Abstract: A system for isolating a failed resistor in a liquid dispensing system including a fusible links described. The system includes drive circuitry to drive a voltage supply to a resistor. The fusible link is disposed between a field effect transistor (FET) and the resistor. The fusible link is to fuse apart upon failure of the resistor.

Abstract: According to an example, a printhead including a thin film passivation layer, an adhesion layer, and a fluidics layer; wherein the thin film passivation layer is an atomic layer deposition thin film layer is disclosed

Abstract: A system for isolating a failed resistor in a liquid dispensing system including a fusible links described. The system includes drive circuitry to drive a voltage supply to a resistor. The fusible link is disposed between a field effect transistor (FET) and the resistor. The fusible link is to fuse apart upon failure of the resistor.

Abstract: In a three-dimensional printing method example, a liquid functional agent is selectively applied. The liquid functional agent includes an alloying agent. A metallic build material is applied. The liquid functional agent is selectively applied before the metallic build material, after the metallic build material, or both before and after the metallic build material. The liquid functional agent patterns the metallic build material to form a composite layer. At least some of the metallic build material is exposed to energy to melt the at least some of the metallic build material to form a layer. Upon contact or after energy exposure, the alloying agent and the build material alter a composition of the composite layer.

Abstract: In a three-dimensional printing method example, a liquid functional agent is selectively applied. The liquid functional agent includes i) an energy source material or ii) an energy sink material. A metallic or ceramic build material is applied. The liquid functional agent is selectively applied any of before the metallic or ceramic build material, after the metallic or ceramic build material, or both before and after the metallic or ceramic build material. The liquid functional agent patterns the metallic or ceramic build material to form a composite layer. At least some of the metallic or ceramic build material is exposed to energy. A reaction involving i) the energy source material or ii) the energy sink material is initiated to alter a thermal condition of the composite layer.

Abstract: A system for isolating a failed resistor in a liquid dispensing system including a fusible links described. The system includes drive circuitry to drive a voltage supply to a resistor. The fusible link is disposed between a field effect transistor (FET) and the resistor. The fusible link is to fuse apart upon failure of the resistor.

Abstract: A metalized printable recording medium including a porous metallic reflective top layer, a porous ink-absorbing layer and a bottom supporting substrate. Method to form such printable recording medium and method to form printed images on the metalized printable recording medium are also disclosed.

Abstract: A printed article with optically variable properties that includes a printable media on which a printed feature has been formed with an ink composition. Said ink composition contains metal oxide particles that have an average particle size in the range of about 3 to about 180 nm and that have a refractive index superior or equal to 1.2. The printable media contains a bottom supporting substrate, an ink-absorbing layer and a metallized top layer with pore diameters that are smaller than the size of the metal oxide particles, and the ink composition forms, onto the printable media, a printed feature that exhibits optically variable properties.

Abstract: A fluid ejection device includes a thin film heater resistor portion having a heater resistor, and a two-layer structure disposed over the heater resistor. The two-layer structure includes a top layer and a bottom layer, with the top layer having a hardness that is at least 1.5 times greater than the hardness of the bottom layer.

Abstract: Various methods and apparatus relating to a multi-level layer are disclosed.

Abstract: A printed article with optically variable properties that includes a printable media on which a printed feature has been formed with an ink composition. Said ink composition contains metal oxide particles that have an average particle size in the range of about 3 to about 180 nm and that have a refractive index superior or equal to 1.2. The printable media contains a bottom supporting substrate, an ink-absorbing layer and a metallized top layer with pore diameters that are smaller than the size of the metal oxide particles, and the ink composition forms, onto the printable media, a printed feature that exhibits optically variable properties.

Abstract: A metalized printable recording medium including a porous metallic reflective top layer, a porous ink-absorbing layer and a bottom supporting substrate. Method to form such printable recording medium and method to form printed images on the metalized printable recording medium are also disclosed.

Abstract: A fluid ejection device includes a thin film heater resistor portion having a heater resistor, and a two-layer structure disposed over the heater resistor. The two-layer structure includes a top layer and a bottom layer, with the top layer having a hardness that is at least 1.5 times greater than the hardness of the bottom layer.

Abstract: A microfluidic architecture is disclosed. The microfluidic architecture includes a substrate having an edge and a thin film stack established on at least a portion of the substrate adjacent the edge. The thin film stack includes a non-conducting layer and a seed layer, where the seed layer is positioned such that a portion of the non-conducting layer is exposed. A chamber layer is established on at least a portion of the seed layer. The non-conducting layer, the seed layer, and the chamber layer define a microfluidic chamber. A layer having a predetermined surface property is electroplated on the chamber layer and on at least one of another portion of the seed layer and the exposed portion of the non-conducting layer.

Abstract: A method of forming a tapered bore an orifice layer of a photo-resist comprises forming a lens in a surface of a first unexposed portion of the layer and exposing the first unexposed portion through a bore-hole mask to define an exposed portion and a second unexposed portion, wherein the second unexposed portion has a tapered shape. The layer is baked to cross-link the exposed portion and developed to remove the second unexposed portion to form a tapered bore hole. The tapered bore hole has a shape corresponding to the tapered shape.

Abstract: A method for manufacturing a fluid ejection device includes providing a sacrificial structure substantially overlying a semiconductor substrate. The structure has a shape configured to define an ink chamber, ink manifold, and a nozzle. The method also includes providing a first metal adjacent the sacrificial structure and substantially overlying the substrate and removing the sacrificial structure to form the ink chamber and the nozzle. The method further includes removing a portion of the first and second sacrificial materials to form the sacrificial structure.

Abstract: A microfluidic architecture is disclosed. The microfluidic architecture includes a substrate having an edge and a thin film stack established on at least a portion of the substrate adjacent the edge. The thin film stack includes a non-conducting layer and a seed layer, where the seed layer is positioned such that a portion of the non-conducting layer is exposed. A chamber layer is established on at least a portion of the seed layer. The non-conducting layer, the seed layer, and the chamber layer define a microfluidic chamber. A layer having a predetermined surface property is electroplated on the chamber layer and on at least one of another portion of the seed layer and the exposed portion of the non-conducting layer.

Abstract: A method for manufacturing a fluid ejection device includes providing a sacrificial structure substantially overlying a semiconductor substrate. The structure has a shape configured to define an ink chamber, ink manifold, and a nozzle. The method also includes providing a first metal adjacent the sacrificial structure and substantially overlying the substrate and removing the sacrificial structure to form the ink chamber and the nozzle. The method further includes removing a portion of the first and second sacrificial materials to form the sacrificial structure.