Abstract: A semiconductor device comprising a semiconductor chip having an electrode terminal carrying surface and electrode terminals formed on, and carried by, the electrode terminal carrying surface; leads extending substantially parallel to the electrode terminal carrying surface and each having at least one curved portion; a first bump and a second bump which are formed on one and the other ends, respectively, of each of the leads and protrude from the ends in opposite directions toward and away from, respectively, the electrode terminal carrying surface; and the electrode terminals of the semiconductor chip each being bonded to a top of the first bump of the lead to support the leads at a distance from the electrode terminal carrying surface of the semiconductor chip. A process of producing the semiconductor device a dissolvable metal sheet suitably used in the process and a process of producing the metal sheet are also provided.