Patents by Inventor Mohanraj Prabhugoud
Mohanraj Prabhugoud has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20220102887Abstract: Embodiments disclosed herein include sockets and electronic packages with socket architectures. In an embodiment, a socket comprises a housing with a first surface and a second surface. In an embodiment, a plurality of interconnect pins pass through the housing. In an embodiment, an alignment hole is provided through the housing. In an embodiment, an alignment post extending out from the first surface of the housing is also provided.Type: ApplicationFiled: September 25, 2020Publication date: March 31, 2022Inventors: Feifei CHENG, Thomas BOYD, Kuang LIU, Steven A. KLEIN, Daniel NEUMANN, Mohanraj PRABHUGOUD
-
Publication number: 20210410328Abstract: An apparatus is described. The apparatus includes a cold plate having fluidic channels within the cold plate. The fluidic channels have protective material thereon such that when liquid coolant flows through the fluidic channels the protective material is between the liquid coolant and the cold plate's material, wherein, the protective material is to prevent reaction between the liquid coolant and the cold plate's material.Type: ApplicationFiled: September 13, 2021Publication date: December 30, 2021Inventors: Jin YANG, David SHIA, Mohanraj PRABHUGOUD
-
Publication number: 20210345519Abstract: Techniques for reconfigurable heat sinks are disclosed. In one embodiment, a compute system includes a heat sink includes a core fin assembly with two removable lateral fin assemblies. The lateral fin assemblies may be above one or more components of the compute system, such as one or more memory modules. With the lateral fin assemblies in place, the cooling capacity of the heat sink is increased, but the more memory modules may be difficult or impossible to service. With the lateral fin assemblies removed, the memory modules can be serviced (e.g., replaced). In another embodiment, a lateral fin assembly of a heat sink is attached to a heat pipe. The lateral fin assembly can rotate relative to the heat pipe, allowing the lateral fin assembly to fit within a 2U form factor in one configuration and allow access to components under the lateral fin assembly in another configuration.Type: ApplicationFiled: June 25, 2021Publication date: November 4, 2021Applicant: Intel CorporationInventors: Wenbin Tian, Yingqiong Bu, Yanbing Sun, Yang Yao, Yuehong Fan, Ming Zhang, Casey Robert Winkel, Jin Yang, David Shia, Mohanraj Prabhugoud
-
Publication number: 20210327787Abstract: An apparatus is described. The apparatus includes a packaged semiconductor device. The packaged semiconductor device having an integrated heat spreader, wherein, a boiling enhancement structure exists on the integrated heat spreader without a block mass residing between the boiling enhancement structure and the integrated heat spreader. The boiling enhancement structure has a structured non-planar surface to promote bubble nucleation in an immersion cooling system.Type: ApplicationFiled: June 23, 2021Publication date: October 21, 2021Inventors: Jin YANG, Jimmy CHUANG, Xicai JING, Yuan-Liang LI, Yuyang XIA, David SHIA, Mohanraj PRABHUGOUD, Maria de la Luz BELMONT, Oscar FARIAS MOGUEL, Andres RAMIREZ MACIAS, Javier AVALOS GARCIA, Jessica GULLBRAND, Shaorong ZHOU, Chia-Pin CHIU, Xiaojin GU
-
Publication number: 20210216121Abstract: Techniques for liquid cooling interfaces with rotatable connector assemblies are disclosed. In one embodiment, a collar contacts flanges on two components of a connector assembly, preventing them from separating. In another embodiment, a housing is positioned around a stem component. The stem component has a gap between a top part and a bottom part held apart by pillars, allowing water to flow to a tubing fitting connected to the housing. A retainer on top of the stem component holds the housing in place. In yet another embodiment, an internal retainer holds a housing component in place over a stem. Other embodiments are disclosed.Type: ApplicationFiled: March 26, 2021Publication date: July 15, 2021Applicant: Intel CorporationInventors: Kristin L. Weldon, David Rodriguez, Jin Yang, David Shia, Jimmy Chuang, Mohanraj Prabhugoud, Mark Edmund Sprenger
-
Publication number: 20210219459Abstract: An apparatus is described. The apparatus includes a cold plate having columns of fluidic channels. The fluidic channels have a length such that coolant that flows through the fluidic channels will be composed less of vapor than of liquid and a mix of liquid and vapor over a rated power range of one or more semiconductor chips that are cooled by the cold plate.Type: ApplicationFiled: March 8, 2021Publication date: July 15, 2021Inventors: Jin YANG, David SHIA, Mohanraj PRABHUGOUD
-
Publication number: 20210183846Abstract: A processor module comprises an integrated circuit component attached to a power interposer. One or more voltage regulator modules attach to the power interposer via interconnect sockets and the power interposer routes regulated power signals generated by the voltage regulator modules to the integrated circuit component. Input power signals are provided to the voltage regulator from the system board via straight pins, a cable connector, or another type of connector. The integrated circuit component's I/O signals are routed through the power interposer to a system board via a socket located between the power interposer and the socket. Not having to route regulated power signals from a system board through a socket to an integrated circuit component can result in a system board with fewer layers, which can reduce overall system cost, as well as creating more area available in the remaining layers for I/O signal entry to the socket.Type: ApplicationFiled: February 25, 2021Publication date: June 17, 2021Applicant: Intel CorporationInventors: Jeffory L. Smalley, Thomas Holden, Russell J. Wunderlich, Farzaneh Yahyaei-Moayyed, Mohanraj Prabhugoud, Horthense Delphine Tamdem, Vijaya Boddu, Kaladhar Radhakrishnan, Timothy Glen Hanna, Krishna Bharath, Judy Amanor-Boadu, Mark A. Schmisseur, Srikant Nekkanty, Luis E. Rosales Galvan
-
Publication number: 20210183737Abstract: An apparatus is described. The apparatus includes a loading frame for mounting a packaged semiconductor chip and a heat sink for the packaged semiconductor chip to a socket. The loading frame is comprised of metal. The loading frame has at least one frame leg where the metal is folded to re-enforce a strength of the frame leg.Type: ApplicationFiled: December 23, 2020Publication date: June 17, 2021Inventors: Jeffory L. SMALLEY, Mohanraj PRABHUGOUD, Steven A. KLEIN, Mengqi LIU
-
Publication number: 20210105911Abstract: Examples described herein relate to a cold plate. In some examples, the cold plate includes a surface with fins and at least two channels, wherein a first channel is shaped with a first opening extending towards the surface, a second opening proximate and across a first fin attached to the surface, and a third opening from the surface and extending away from the surface. In some examples, when a fluid is provided to the first opening, the first opening directs the fluid towards the surface, the second opening directs the fluid across the first fin, and the third opening directs the fluid away from the surface. In some examples, the second opening comprises split openings around opposite sides of the first fin.Type: ApplicationFiled: December 16, 2020Publication date: April 8, 2021Inventors: Jin YANG, David SHIA, Mohanraj PRABHUGOUD, Olaotan ELENITOBA-JOHNSON, Craig JAHNE, Phil GENG
-
Publication number: 20200227362Abstract: Embodiments include interposers for use in high speed applications. In an embodiment, the interposer comprises an interposer substrate, and an array of pads on a first surface of the interposer substrate. In an embodiment, a plurality of vias pass through the interposer substrate, where each via is electrically coupled to one of the pads in the array of pads. In an embodiment a plurality of heating elements are embedded in the interposer substrate. In an embodiment a first cable is over the first surface interposer substrate. In an embodiment, the first cable comprises an array of conductive lines along the first cable, where conductive lines proximate to a first end of the cable are electrically coupled to pads in the array of pads.Type: ApplicationFiled: January 14, 2019Publication date: July 16, 2020Inventors: Jonathan W. THIBADO, Jeffory L. SMALLEY, John C. GULICK, Phi THANH, Mohanraj PRABHUGOUD, Chong ZHAO
-
Publication number: 20200205299Abstract: A reflowable grid array (RGA) interposer includes first connection pads on a first surface of a body and second connection pads on a second surface of the body. Heating elements within the body are adjacent to the second connection pads. First interconnects within the body connect some of the second connection pads to the first connection pads. Second interconnects within the body connect pairs of the second connection pads. A motherboard assembly includes first and second components (e.g., CPU with co-processor and/or memory) and the RGA interposer. The first connection pads are in contact with motherboard contacts. The second connection pads are in contact with the first and second components. The first component passes signals directly to the motherboard by the first interconnects. The second component passes signals directly to the first component by the second interconnects but does not pass signals directly to the motherboard by the first interconnects.Type: ApplicationFiled: December 20, 2018Publication date: June 25, 2020Applicant: INTEL CORPORATIONInventors: Jonathan W. Thibado, Jeffory L. Smalley, John C. Gulick, Phi Thanh, Mohanraj Prabhugoud
-
Publication number: 20200141979Abstract: A coaxial wire interconnect architecture and associated methods are described. In one example, the coaxial wire interconnect architecture is used in a test socket interconnect array. Flexible bends are formed in one or more of the coaxial wire interconnects to provide compliant connections to an electronic device during testing.Type: ApplicationFiled: March 31, 2017Publication date: May 7, 2020Inventors: Ronald Michael Kirby, Erkan Acar, Joe Walczyk, Youngseok Oh, Justin M Huttula, Mohanraj Prabhugoud
-
Patent number: 10644458Abstract: A shielded interconnect array and associated methods are described. Examples of the shielded interconnect array include socket connections that include conductive members with flexible bends. In examples shown, corresponding grounded conductive members with flexible bends are located adjacent to other conductive members with flexible bends to provide shielding.Type: GrantFiled: March 31, 2017Date of Patent: May 5, 2020Assignee: Intel CorporationInventors: Youngseok Oh, Justin M Huttula, Mohanraj Prabhugoud, Ronald Kirby, Joe Walczyk, Erkan Acar
-
Patent number: 10595439Abstract: Embodiments described herein may include apparatuses, systems and/or processes to provide a cooling apparatus that includes a first heatsink, a second movable heatsink and a flexible thermal conductor physically and thermally coupled with the first and second heatsinks, where the flexible thermal conductor is to flex and remain thermally coupled with the first heatsink and the second heatsink, when the second heatsink is moved relative to the first heatsink. The first heatsink may be coupled to a heat source such as a processor that may be coupled with a PCB. Also, the movable heatsink may allow access to components, such as dual in-line memory modules (DIMMs) that are next to the first heatsink and under the movable second heatsink. Other embodiments may be described and/or claimed.Type: GrantFiled: June 25, 2018Date of Patent: March 17, 2020Assignee: Intel CorporationInventors: David Shia, Evan Chenelly, Mohanraj Prabhugoud
-
Publication number: 20190302857Abstract: A microprocessor loading mechanism, comprising a bolster plate surrounding an aperture, wherein the opening is to receive a microprocessor socket, one or more torsion bars coupled to the bolster plate, and a stud coupled to each of the one or more torsion bars, wherein each stud is to receive a nut to secure a microprocessor package to the microprocessor socket within the aperture and wherein each stud is secured to the bolster plate by each corresponding torsion bar.Type: ApplicationFiled: March 30, 2018Publication date: October 3, 2019Applicant: INTEL CORPORATIONInventors: Eric W. Buddrius, Ralph V. Miele, Mohanraj Prabhugoud, David Shia, Jeffory L. Smalley
-
Patent number: 10324112Abstract: Embodiments of the present disclosure provide techniques and configurations for a package testing system. In some embodiments, the system may comprise a printed circuit board (PCB), including one or more sensors disposed adjacent to a corner of the PCB to face a package to be tested, to detect an electrical edge of the package. The PCB may include a contactor array disposed to face respective interconnects of the package. The system may further include a controller coupled with the one or more sensors, to process an input from the one or more sensors, to identify the electrical edge of the package, and initiate an adjustment of a position of the PCB relative to the package, based at least in part on the electrical edge of the package, to substantially align contacts of the contactor array with the respective interconnects of the package. Other embodiments may be described and/or claimed.Type: GrantFiled: December 6, 2016Date of Patent: June 18, 2019Assignee: Intel CorporationInventors: Mohanraj Prabhugoud, Andrew J. Hoitink, Abram M. Detofsky, Joe F. Walczyk
-
Publication number: 20190045663Abstract: Embodiments described herein may include apparatuses, systems and/or processes to provide a cooling apparatus that includes a first heatsink, a second movable heatsink and a flexible thermal conductor physically and thermally coupled with the first and second heatsinks, where the flexible thermal conductor is to flex and remain thermally coupled with the first heatsink and the second heatsink, when the second heatsink is moved relative to the first heatsink. The first heatsink may be coupled to a heat source such as a processor that may be coupled with a PCB. Also, the movable heatsink may allow access to components, such as dual in-line memory modules (DIMMs) that are next to the first heatsink and under the movable second heatsink. Other embodiments may be described and/or claimed.Type: ApplicationFiled: June 25, 2018Publication date: February 7, 2019Inventors: David Shia, Evan Chenelly, Mohanraj Prabhugoud
-
Publication number: 20180045759Abstract: Embodiments of the present disclosure provide techniques and configurations for a package testing system. In some embodiments, the system may comprise a printed circuit board (PCB), including one or more sensors disposed adjacent to a corner of the PCB to face a package to be tested, to detect an electrical edge of the package. The PCB may include a contactor array disposed to face respective interconnects of the package. The system may further include a controller coupled with the one or more sensors, to process an input from the one or more sensors, to identify the electrical edge of the package, and initiate an adjustment of a position of the PCB relative to the package, based at least in part on the electrical edge of the package, to substantially align contacts of the contactor array with the respective interconnects of the package. Other embodiments may be described and/or claimed.Type: ApplicationFiled: December 6, 2016Publication date: February 15, 2018Inventors: Mohanraj Prabhugoud, Andrew J. Hoitink, Abram M. Detofsky, Joe F. Walczyk
-
Publication number: 20160178663Abstract: A test die contactor is described with a formed wire probe interconnect. In one example the contactor includes a plurality of wire probes formed to be resilient against longitudinal pressure, a first aligner proximate one end of the wire probes having a first plurality of holes through which the wire probes extend, the first alignment layer to align the wire probes to contact pads of a text fixture, a second aligner proximate the other end of the wire probes having a second plurality of holes through the wire probes extend, the second alignment layer to align the wire probes to contact pads of a device under test, and an insulating layer between the first and the second aligner through which the wire probes extend to hold the wire probes when compressed by longitudinal pressure.Type: ApplicationFiled: December 23, 2014Publication date: June 23, 2016Inventors: Mohanraj Prabhugoud, Youngseok Oh, Joseph F. Walczyk, Todd P. Albertson