Patents by Inventor Mohinder Singh Bhatti

Mohinder Singh Bhatti has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7556088
    Abstract: A heat exchanger assembly for cooling an electronic element includes an oblong condensing tube extending between ends to define an upper chamber downwardly bowed through an upwardly extending arc and a lower chamber upwardly bowed through a downwardly extending arc for dissipating heat. A continuous sheet extends in v-shaped fins between and engaging said arcs of said chambers. The internal fins extend from a center axis of the tube to reverse bends defining the opposite ends of the tube. A continuous sheet extending in sinuous corrugations extends around the exterior of the endless loop between opposite sides of a heat transfer area, which receives the electronic element.
    Type: Grant
    Filed: March 30, 2007
    Date of Patent: July 7, 2009
    Assignee: Coolit Systems, Inc.
    Inventors: Shrikant Mukund Joshi, Mohinder Singh Bhatti, Ilya Reyzin
  • Patent number: 7537151
    Abstract: A method of heat sink manufacture in which the crests of a conductive fin are nested down into close fitting grooves in a flat, conductive base plate, with small interface gaps G. A compressive material is set inside the fin crests and the grooves, viscous enough to not intrude into the gaps G, to a level sufficient to substantially fill the grooves. The work piece thus created is subjected to a cold hydrostatic oil bath, crushing the outer surfaces of the fin crests into the internal surfaces of the grooves where the compressed seal covers, while the rest of the fin is supported against net deformation by the surrounding oil.
    Type: Grant
    Filed: January 11, 2005
    Date of Patent: May 26, 2009
    Assignee: Delphi Technologies, Inc.
    Inventors: Mohinder Singh Bhatti, Patrick Mitchell Griffin
  • Publication number: 20090121488
    Abstract: A system for generating electric power by utilizing solar heat flux. The system comprises a heating sub system and a cooling loop. The cooling loop circulates a coolant through a heat exchanger with an expanded second refrigerant which has been heated by the heating sub system thereby heating the coolant. The cooling loop includes a pipe buried in the ground at depth, D. A soil surrounds the length, L, of the pipe and a wrapping material defines and maintains a radial soil annulus width, ?s, extending radially from the pipe to an outer periphery at a peripheral radius, r?, measured radially from its axis, A. The radial soil annulus width, ?s, can be maintained at k s h s - r o . The length, L, of the pipe can be equal to mc p 2 ? ? ? ? { 0.5469 k f + 1 k p ? ln ? ( r o r i ) + 1 k s ? [ 1 + ln ? ( r ? r o ) ] } wherein r ? = k s h s .
    Type: Application
    Filed: November 8, 2007
    Publication date: May 14, 2009
    Inventors: Mohinder Singh Bhatti, Mingyu Wang, Shrikant Mukund Joshi
  • Publication number: 20090102250
    Abstract: An evaporatively pre-cooled seat assembly comprising a seat cushion, an auxiliary cooler, and an evaporative cooler. The evaporative cooler includes a plurality of parallel tubular dry channels and a plurality of tubular wet channels. The dry channels and wet channels are arranged such that they alternate from dry channel to wet channel from channel to channel. Each of the channels is defined by two parallel side walls, a top, and a bottom. A first plurality of dry channels defines a plurality of apertures in the side walls thereof for conveying air out of the respective dry channel and into an adjacent wet channel. A second plurality of dry channels alternates with the first plurality and is disposed between two wet channels and defines a plurality of cooler apertures in the tops thereof for conveying cooled air out of the second plurality of alternating dry channels and to the auxiliary cooler.
    Type: Application
    Filed: October 18, 2007
    Publication date: April 23, 2009
    Inventors: Edward Wolfe, IV, Prasad Shripad Kadle, Ilya Reyzin, Mohinder Singh Bhatti
  • Publication number: 20090100854
    Abstract: An evaporative cooler assembly including a cooler housing in fluid communication with a condenser. A stream of air flows through the cooler housing where it is cooled and across the condenser to dissipate heat from the condenser. The cooler housing includes a plurality of alternating dry and wet channels with a plurality of plates extending between opposite ends of the cooler housing separating the channels. The plates include a plurality of apertures for proportionally increasing from one end to the other the amount of the stream of air flowing from the dry channels through the wet channels and to the condenser.
    Type: Application
    Filed: October 18, 2007
    Publication date: April 23, 2009
    Inventors: Ilya Reyzin, Mohinder Singh Bhatti, Peter E. Fogle
  • Patent number: 7520317
    Abstract: A heat exchanger assembly is provided including a primary housing having a plurality of primary condensing fingers extending upwardly from and perpendicular to a horizontal axis and disposed circumferentially about a primary axis. A tube extends radially from the primary axis along the horizontal axis toward a remote housing including remote condensing fingers extending downwardly from and perpendicular to the horizontal axis. The remote condensing fingers are disposed circumferentially about a remote axis extending vertically through the remote housing. The tube interconnects the primary housing and the remote housing and is flexible to facilitate movement of the housings relative to one another.
    Type: Grant
    Filed: May 16, 2006
    Date of Patent: April 21, 2009
    Assignee: Delphi Technologies, Inc
    Inventors: David P Rusch, Mohinder Singh Bhatti, Ilya Reyzin
  • Patent number: 7509995
    Abstract: A heat dissipation element for cooling an electronic device is disclosed. The heat dissipation element has a top surface and a bottom surface for mounting the electronic device to be cooled thereto. The top surface defines a heat dissipation area for dissipating heat from the electronic device and a plurality of heat transfer fins project upwardly from the top surface and are coextensive with the heat dissipation area. Each of the heat transfer fins defines a plurality of steps having a rise and a run and each of the steps extend across the heat dissipation area for maximizing an amount of heat dissipated from the electronic device. The heat dissipation element is particularly useful in either one of a cold plate assembly used with a liquid cooled unit (LCU) or a boiler plate assembly used with a thermosiphon cooling unit (TCU).
    Type: Grant
    Filed: May 6, 2004
    Date of Patent: March 31, 2009
    Assignee: Delphi Technologies, Inc.
    Inventors: Mohinder Singh Bhatti, Ilya Reyzin, Debashis Ghosh, Shrikant Mukund Joshi
  • Publication number: 20090078396
    Abstract: The invention provides for an orientation insensitive heat exchanger assembly for cooling an electronic device comprising a hermetically sealed housing defining a boiling chamber and two condensing chambers. A partition is disposed in the boiling chamber and defines two sets of alternating channels extending in overlapping relationship to one another and with one set of alternating channels open to one of the condensing chambers and the other set of alternating channels open to the other condensing chamber for sealing the condensing chambers from one another. Coolant is maintained in each of the condensing chambers. In operation, if the thermosiphon is tilted with one side lower than the other, the channels open to the lower side are empty of coolant into the lower condensing chamber while the channels open to the opposite upper side hold the coolant over the entire boiling chamber aligning with an electronic device to continue cooling.
    Type: Application
    Filed: September 26, 2007
    Publication date: March 26, 2009
    Inventors: Mohinder Singh Bhatti, Ilya Reyzin, James Alan Bright, Stephan Michael Vetter, Shrikant Mukund Joshi
  • Patent number: 7506682
    Abstract: A fluid heat exchanger assembly cools an electronic device with a cooling fluid supplied from a heat extractor (R, F) to an upper portion of a housing. A refrigerant is disposed in a lower portion of the housing for liquid-to-vapor transformation. A partition divides the upper portion of the housing from the lower portion and flow interrupters are disposed in the upper portion for interrupting thermal boundary layer to enhance thermal heat transfer to the flow of liquid coolant through the coolant passage of the upper portion in response to heat transferred by an electronic device to the lower portion of the housing.
    Type: Grant
    Filed: January 21, 2005
    Date of Patent: March 24, 2009
    Assignee: Delphi Technologies, Inc.
    Inventors: Mohinder Singh Bhatti, Debashis Ghosh, Ilya Reyzin
  • Patent number: 7497249
    Abstract: A heat exchanger assembly is provided including a multi-function boiling chamber having a top wall and a bottom wall parallel to the top wall and a first side wall and a second side wall both extending inwardly from the bottom wall to the top wall and a pair of end walls closing the chamber. First and second condensing tubes attached to the first and second side walls, respectively, of the boiling chamber have an elongated width presenting an upper surface and a lower surface and extend in opposite respective directions to distal ends of the tubes at an inclined angle relative to the bottom wall of the boiling chamber. The condensing tubes include a plurality of channels across the width and extending from the boiling chamber to the distal end of the tube. A tank disposed at each of the distal ends of the condensing tubes is in fluid communication with the channels tubes.
    Type: Grant
    Filed: March 30, 2007
    Date of Patent: March 3, 2009
    Assignee: Delphi Technologies, Inc.
    Inventors: Mohinder Singh Bhatti, Ilya Reyzin, Shrikant Mukund Joshi
  • Patent number: 7477516
    Abstract: A cooling assembly includes a housing supporting a nozzle for directing cooling air over an electronic component. A casing rotatably supports a shaft, which in turn, supports a compressor, an expander, and an electric motor, for circulating air and delivering the cooling air to the nozzle. The assembly is distinguished by air bearings supporting the shaft in the casing on a thin film of air, thereby maintaining a contaminate free housing.
    Type: Grant
    Filed: August 17, 2006
    Date of Patent: January 13, 2009
    Assignee: Delphi Technologies, Inc.
    Inventors: Shrikant Mukund Joshi, Mohinder Singh Bhatti
  • Patent number: 7475718
    Abstract: A hermetically sealed housing includes a plurality of inner walls extending radially from a central post to a circular outer wall, thereby defining a plurality of pie shaped chambers, each independently containing a refrigerant. At least one of the chambers is always in position to remove heat from an electronic device regardless of the orientation of the heat exchanger assembly. A plurality of side fins are disposed on the outer wall of the housing, and a plurality of top fins extend radially from a central axis (A) and are disposed on top of the housing. A wicking material is disposed on the interior of each chamber. A fan assembly is disposed on top of the top fins to blow air radially down into the fins.
    Type: Grant
    Filed: November 15, 2006
    Date of Patent: January 13, 2009
    Assignee: Delphi Technologies, Inc.
    Inventors: Ilya Reyzin, Mohinder Singh Bhatti, Shrikant Mukund Joshi
  • Patent number: 7467657
    Abstract: A modular CPU cooling unit designed to fit within the available space within an existing box or cabinet containing a CPU. The fan, pump and liquid to air cross flow heat exchanger are fitted within the available volume with the fan spaced away from the heat exchanger a suitable distance to pull air through the entire face area of the heat exchanger, even though it is considerably larger than the fan.
    Type: Grant
    Filed: June 7, 2006
    Date of Patent: December 23, 2008
    Assignee: Delphi Technologies, Inc.
    Inventors: John Lawrence Pawlak, III, Ilya Reyzin, Mohinder Singh Bhatti
  • Patent number: 7461690
    Abstract: A spreader plate for an electronic component cooling assembly has a flat lower surface and a substantially arcuate upper surface of larger surface area than the lower surface which is generally convex and arcuate in cross section, and which decreases in thickness, as measured between the lower and upper surfaces, moving from the central area out to the periphery. This allows the heat flux lines to be more evenly spaced and regular in length, as compared to a typical plate with flat upper and lower surfaces of equal surface area.
    Type: Grant
    Filed: September 27, 2005
    Date of Patent: December 9, 2008
    Assignee: Delphi Technologies, Inc.
    Inventor: Mohinder Singh Bhatti
  • Publication number: 20080276640
    Abstract: An air conditioning system includes an evaporator assembly and a condenser assembly. A first portion of the exhaust airstream leaves the condenser and enters a primary channel of an evaporative cooler assembly. Water evaporates from the evaporative cooler tubes and creates a moisture-laden airstream. A plurality of apertures in the evaporative cooler tubes bleeds the moisture-laden airstream into a secondary channel defined within the evaporative cooler tubes. The heat drawn from the air in the primary channel produces an evaporatively cooled airstream that enters a desiccant wheel. A solid desiccant material within the desiccant wheel absorbs moisture from the evaporatively cooled airstream to produce a dehumidified airstream that enters the evaporator assembly. A second portion of the exhaust airstream is directed through a heater and then into the desiccant wheel to provide heat for regeneration of the solid desiccant material.
    Type: Application
    Filed: May 10, 2007
    Publication date: November 13, 2008
    Inventors: Mohinder Singh Bhatti, Ilya Reyzin, Shrikant Mukund Joshi
  • Patent number: 7438124
    Abstract: An electronics cabinet for storing a plurality of electronic devices therein is provided and includes a fan and an evaporative cooler. The fan draws a flow of air into the cabinet, circulates the flow of air through the evaporative cooler, and then across the electronic devices for removing heat produced by the electronic devices. The evaporative cooler removes heat from the flow of air by absorbing heat from the flow of air and then dissipating the heat by evaporating a liquid into a secondary airflow, which is directed out of the cabinet. The cabinet includes a cold air plenum having an actuator for adjusting a cross-sectional area of the cold air plenum to control the airflow through each of the supports.
    Type: Grant
    Filed: October 4, 2005
    Date of Patent: October 21, 2008
    Assignee: Delphi Technologies, Inc.
    Inventors: Mohinder Singh Bhatti, Ilya Reyzin, Shrikant Mukund Joshi
  • Publication number: 20080236789
    Abstract: A thermosiphon cooling assembly includes a plurality of hairpin condenser tubes that extend into openings of a boiling chamber for collection of refrigerant vapor from a boiler housing. The distal ends of the tubes extend into the chamber from a cover the least distance midway between the ends of the boiler housing and increase in distance in opposite directions toward the ends. The hairpin tubes are in groups with each tube in a group having the same length and the groups having respectively different lengths and at least one group includes more than one tube.
    Type: Application
    Filed: March 30, 2007
    Publication date: October 2, 2008
    Inventors: Mohinder Singh Bhatti, Ilya Reyzin, David P. Rusch, Shrikant Mukund Joshi
  • Publication number: 20080236788
    Abstract: A heat exchanger assembly for cooling an electronic element includes an oblong condensing tube extending between ends to define an upper chamber downwardly bowed through an upwardly extending arc and a lower chamber upwardly bowed through a downwardly extending arc for dissipating heat. A continuous sheet extends in v-shaped fins between and engaging said arcs of said chambers. The internal fins extend from a center axis of the tube to reverse bends defining the opposite ends of the tube. A continuous sheet extending in sinuous corrugations extends around the exterior of the endless loop between opposite sides of a heat transfer area, which receives the electronic element.
    Type: Application
    Filed: March 30, 2007
    Publication date: October 2, 2008
    Inventors: Shrikant Mukund Joshi, Mohinder Singh Bhatti, Ilya Reyzin
  • Publication number: 20080236790
    Abstract: A heat exchanger assembly is provided including a multi-function boiling chamber having a top wall and a bottom wall parallel to the top wall and a first side wall and a second side wall both extending inwardly from the bottom wall to the top wall and a pair of end walls closing the chamber. First and second condensing tubes attached to the first and second side walls, respectively, of the boiling chamber have an elongated width presenting an upper surface and a lower surface and extend in opposite respective directions to distal ends of the tubes at an inclined angle relative to the bottom wall of the boiling chamber. The condensing tubes include a plurality of channels across the width and extending from the boiling chamber to the distal end of the tube. A tank disposed at each of the distal ends of the condensing tubes is in fluid communication with the channels tubes.
    Type: Application
    Filed: March 30, 2007
    Publication date: October 2, 2008
    Inventors: Mohinder Singh Bhatti, Ilya Reyzin, Shrikant Mukund Joshi
  • Publication number: 20080230210
    Abstract: A thermosiphon boiler plate assembly (20) for dissipating heat generated by an electronic device includes a plurality of widthwise ribs (38) disposed on a top surface (26) of a base (24) extending parallel to a latitudinal axis (Ax) of the base (24) in spaced relationship to each other. A plurality of lengthwise ribs (40) are disposed on the top surface (26) of the base (24) extending parallel to a longitudinal axis (Ay) of the base (24) in spaced relationship to each other. The lengthwise ribs (40) intersect the widthwise ribs (38) on the top surface (26) of the base (24) to define a plurality of pockets (42) completely surrounded by the lengthwise and widthwise ribs (40, 38) to increase the widthwise and lengthwise area moments of inertia (Ix, Iy) of the assembly (20).
    Type: Application
    Filed: March 21, 2007
    Publication date: September 25, 2008
    Inventors: Mohinder Singh Bhatti, Ilya Reyzin, Shrikant Mukund Joshi