Abstract: A distributed amplifier is provided that includes an input network that simulates an input signal transmission line, and having an output network that simulates an output signal transmission line, and also having multiple unit cells with amplifying characteristics that are connected in parallel to one another between the input network and the output network, that amplify a signal propagating through the input network and feed it into the output network with a predetermined phase relationship to a signal propagating through the output network.

Abstract: A device and a method for producing such a device is provided, whereby the windings of a spiral inductance are embedded in a membrane such that they are freely suspended over a completely back-etched area of the substrate for a decoupling of the windings from the substrate. An additional substrate is connected to the bottom side of the back-etched area of the processed substrate such that a hollow cavity is formed for a decoupling of the windings from the substrate.

Abstract: A device and a method for producing such a device is provided, whereby the windings of a spiral inductance are embedded in a membrane such that they are freely suspended over a completely back-etched area of the substrate for a decoupling of the windings from the substrate. An additional substrate is connected to the bottom side of the back-etched area of the processed substrate such that a hollow cavity is formed for a decoupling of the windings from the substrate.

Abstract: A device for application in the high frequency field and a method for forming a photonic band-gap structure are provided. The device being mountable on a primary substrate for forming the device. The device being formed by forming conformal coplanar waveguide metallizations on surface areas of two substrates, connecting the conformal coplanar waveguide metallizations of the two substrates, and structured back-etching of the two substrates, starting at surface areas of the two substrates that are opposite the coplanar waveguide metallizations.

Abstract: A component having at least one conductor path on a substrate, and a production method for fabricating such a component is provided. The component is made by providing at least one conductor path on a predefined area of the substrate. Then a dielectric insulating layer is formed over the at least one conductor path, and a an area of the substrate is completely back etched below the at least one conductor path beginning on the bottom side of the substrate in such a way that the at least one conductor path is supported across the completely back-etched area of the substrate by adhesion to the second insulating layer.

Abstract: A component for the transmission of electromagnetic waves and a method for producing such a component is provided, whereby conductors of a coplanar waveguide system are embedded in a membrane such that they are at least partially suspended across a back-etched area of the substrate for the decoupling of the conductors from the substrate (1). An additional substrate is connected to the bottom side of the back-etched area of the substrate in such a way that a hollow cavity is formed.

Abstract: A method for constructing passive devices on a substrate and a device is provided that is fabricated in accordance with the a method. The method includes the steps of: forming a plurality of grooves on a surface of the substrate by using an anisotropic etching procedure to enlarge a surface area of the substrate; forming an insulating layer at least in the plurality of grooves; and a structured metallization at least in the plurality of grooves for constructing the device above the insulating layer such that for a maximum integration density, the passive device is essentially constructed to extend through the plurality of grooves.

Abstract: A circuit having an input amplifier and a second amplifier that provides the circuit with a unity gain crossover frequency that is higher than a unity gain crossover frequency of the input amplifier is provided. The circuit has a control input coupled to a control input of the input amplifier and also has a first current connection and a second current connection. The circuit further includes an additional amplifier that is connected in series with the second amplifier and is controlled by the input amplifier.