Patents by Inventor Moon Gi CHO
Moon Gi CHO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220274264Abstract: A substrate transferring system may include a first transfer unit to transfer a substrate along a circular first orbit while rotating on a first axis perpendicular to a ground, and a second transfer unit to transfer a substrate along a circular second orbit while rotating on a second axis perpendicular to the ground, wherein the first orbit and the second orbit may overlap with each other at a first point, and at the first point, a substrate may be transferred from the first transfer unit to the second transfer unit or from the second transfer unit to the first transfer unit.Type: ApplicationFiled: January 25, 2022Publication date: September 1, 2022Applicant: KCTECH CO., LTD.Inventors: Moon Gi Cho, Hee Sung Chae, Seung Eun Lee, Geun Sik Yun
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Publication number: 20210167063Abstract: Semiconductor devices are provided. A semiconductor device includes a gate structure and an adjacent contact. The semiconductor device includes a connector that is connected to the contact. In some embodiments, the semiconductor device includes a wiring pattern that is connected to the connector. Moreover, in some embodiments, the connector is adjacent a boundary between first and second cells of the semiconductor device.Type: ApplicationFiled: February 8, 2021Publication date: June 3, 2021Inventors: Moon Gi Cho, Hyeonuk Kim, Jongchan Shin, Eryung Hwang, Jaeseok Yang, Jinwoo Jeong
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Patent number: 10930648Abstract: Semiconductor devices are provided. A semiconductor device includes a gate structure and an adjacent contact. The semiconductor device includes a connector that is connected to the contact. In some embodiments, the semiconductor device includes a wiring pattern that is connected to the connector. Moreover, in some embodiments, the connector is adjacent a boundary between first and second cells of the semiconductor device.Type: GrantFiled: May 24, 2019Date of Patent: February 23, 2021Inventors: Moon Gi Cho, Hyeonuk Kim, Jongchan Shin, Eryung Hwang, Jaeseok Yang, Jinwoo Jeong
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Patent number: 10770384Abstract: A printed circuit board (PCB) is provided as follows. A first connection pad and a second connection pad are disposed on a first surface and a second surface of the base substrate layer, respectively. The first connection pad and the second connection pad each includes a first metal. A first pad cover layer covers a top surface of the first connection pad and includes an insulating metal oxide having a second metal different from the first metal.Type: GrantFiled: November 5, 2017Date of Patent: September 8, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Soo-jae Park, Moon-gi Cho
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Patent number: 10636785Abstract: A semiconductor device includes a substrate including a first region and a second region, a cell gate pattern on the first region of the substrate, a dummy gate pattern on the second region of the substrate, a resistor pattern on the second region of the substrate and over the dummy gate pattern, and a connection structure coupled to each of the connection regions. The resistor pattern includes a body region and connection regions at both sides of the body region. The dummy gate pattern overlaps the body region and does not be overlap the connection regions, when viewed in a plan view.Type: GrantFiled: April 26, 2019Date of Patent: April 28, 2020Assignee: Samsung Electronics Co., Ltd.Inventors: Hwichan Jun, Deokhan Bae, HeonJong Shin, Jaeran Jang, Moon Gi Cho, YoungWoo Cho
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Patent number: 10518382Abstract: A substrate processing system comprising a polishing part, a pre-cleaning region, and a cleaning part. The polishing part performs a Chemical Mechanical Polishing (CMP) process on a substrate. The pre-cleaning region is prepared in the polishing part and allows pre-cleaning performed on the substrate having undergone the polishing process. The cleaning part cleans the substrate pre-cleaned in the pre-cleaning region.Type: GrantFiled: December 9, 2016Date of Patent: December 31, 2019Assignee: KCTECH CO., LTD.Inventors: Young Kyu Kweon, Byoung Chaul Son, Moon Gi Cho, Joon Ho An
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Patent number: 10453838Abstract: A semiconductor device includes a substrate including a first region and a second region, a cell gate pattern on the first region of the substrate, a dummy gate pattern on the second region of the substrate, a resistor pattern on the second region of the substrate and over the dummy gate pattern, and a connection structure coupled to each of the connection regions. The resistor pattern includes a body region and connection regions at both sides of the body region. The dummy gate pattern overlaps the body region and does not be overlap the connection regions, when viewed in a plan view.Type: GrantFiled: August 29, 2017Date of Patent: October 22, 2019Assignee: Samsung Electronics Co., Ltd.Inventors: Hwichan Jun, Deokhan Bae, HeonJong Shin, Jaeran Jang, Moon Gi Cho, YoungWoo Cho
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Publication number: 20190287965Abstract: Semiconductor devices are provided. A semiconductor device includes a gate structure and an adjacent contact. The semiconductor device includes a connector that is connected to the contact. In some embodiments, the semiconductor device includes a wiring pattern that is connected to the connector. Moreover, in some embodiments, the connector is adjacent a boundary between first and second cells of the semiconductor device.Type: ApplicationFiled: May 24, 2019Publication date: September 19, 2019Inventors: Moon Gi Cho, Hyeonuk Kim, Jongchan Shin, Eryung Hwang, Jaeseok Yang, Jinwoo Jeong
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Publication number: 20190252372Abstract: A semiconductor device includes a substrate including a first region and a second region, a cell gate pattern on the first region of the substrate, a dummy gate pattern on the second region of the substrate, a resistor pattern on the second region of the substrate and over the dummy gate pattern, and a connection structure coupled to each of the connection regions. The resistor pattern includes a body region and connection regions at both sides of the body region. The dummy gate pattern overlaps the body region and does not be overlap the connection regions, when viewed in a plan view.Type: ApplicationFiled: April 26, 2019Publication date: August 15, 2019Applicant: Samsung Electronics Co., Ltd.Inventors: Hwichan Jun, Deokhan Bae, HeonJong Shin, Jaeran Jang, Moon Gi Cho, YoungWoo Cho
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Patent number: 10347627Abstract: Semiconductor devices are provided. A semiconductor device includes a gate structure and an adjacent contact. The semiconductor device includes a connector that is connected to the contact. In some embodiments, the semiconductor device includes a wiring pattern that is connected to the connector. Moreover, in some embodiments, the connector is adjacent a boundary between first and second cells of the semiconductor device.Type: GrantFiled: March 20, 2018Date of Patent: July 9, 2019Assignee: Samsung Electronics Co., Ltd.Inventors: Moon Gi Cho, Hyeonuk Kim, Jongchan Shin, Eryung Hwang, Jaeseok Yang, Jinwoo Jeong
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Patent number: 10211089Abstract: A semiconductor device and a fabricating method thereof are provided. The method includes sequentially forming an interlayer insulating layer and a hard mask layer on a substrate with first and second regions, performing a first patterning process on the hard mask layer to form first openings in the first and second regions, performing a second patterning process on the hard mask layer to form second openings in the first and second regions, and performing a third patterning process on the hard mask layer to selectively form at least one third opening in only the second region. The third patterning process includes forming a first photoresist pattern with openings on the hard mask layer, and the opening of the first photoresist pattern on the first region is overlapped with the second opening on the first region, when viewed in a plan view.Type: GrantFiled: June 12, 2017Date of Patent: February 19, 2019Assignee: Samsung Electronics Co., Ltd.Inventors: Moon Gi Cho, Byungju Kang, Janie Hyojin Kim
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Publication number: 20180366463Abstract: Semiconductor devices are provided. A semiconductor device includes a gate structure and an adjacent contact. The semiconductor device includes a connector that is connected to the contact. In some embodiments, the semiconductor device includes a wiring pattern that is connected to the connector. Moreover, in some embodiments, the connector is adjacent a boundary between first and second cells of the semiconductor device.Type: ApplicationFiled: March 20, 2018Publication date: December 20, 2018Inventors: Moon Gi Cho, Hyeonuk Kim, Jongchan Shin, Eryung Hwang, Jaeseok Yang, Jinwoo Jeong
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Publication number: 20180247887Abstract: A printed circuit board (PCB) is provided as follows. A first connection pad and a second connection pad are disposed on a first surface and a second surface of the base substrate layer, respectively. The first connection pad and the second connection pad each includes a first metal. A first pad cover layer covers a top surface of the first connection pad and includes an insulating metal oxide having a second metal different from the first metal.Type: ApplicationFiled: November 5, 2017Publication date: August 30, 2018Inventors: Soo-jae PARK, Moon-gi CHO
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Publication number: 20180130796Abstract: A semiconductor device includes a substrate including a first region and a second region, a cell gate pattern on the first region of the substrate, a dummy gate pattern on the second region of the substrate, a resistor pattern on the second region of the substrate and over the dummy gate pattern, and a connection structure coupled to each of the connection regions. The resistor pattern includes a body region and connection regions at both sides of the body region. The dummy gate pattern overlaps the body region and does not be overlap the connection regions, when viewed in a plan view.Type: ApplicationFiled: August 29, 2017Publication date: May 10, 2018Applicant: Samsung Electronics Co., Ltd.Inventors: Hwichan JUN, Deokhan BAE, HeonJong SHIN, Jaeran JANG, Moon Gi CHO, YoungWoo CHO
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Publication number: 20180082890Abstract: A semiconductor device and a fabricating method thereof are provided. The method includes sequentially forming an interlayer insulating layer and a hard mask layer on a substrate with first and second regions, performing a first patterning process on the hard mask layer to form first openings in the first and second regions, performing a second patterning process on the hard mask layer to form second openings in the first and second regions, and performing a third patterning process on the hard mask layer to selectively form at least one third opening in only the second region. The third patterning process includes forming a first photoresist pattern with openings on the hard mask layer, and the opening of the first photoresist pattern on the first region is overlapped with the second opening on the first region, when viewed in a plan view.Type: ApplicationFiled: June 12, 2017Publication date: March 22, 2018Inventors: Moon Gi CHO, Byungju KANG, Janie Hyojin KIM
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Publication number: 20170320188Abstract: A substrate processing system comprising a polishing part, a pre-cleaning region, and a cleaning part. The polishing part performs a Chemical Mechanical Polishing (CMP) process on a substrate. The pre-cleaning region is prepared in the polishing part and allows pre-cleaning performed on the substrate having undergone the polishing process. The cleaning part cleans the substrate pre-cleaned in the pre-cleaning region.Type: ApplicationFiled: December 9, 2016Publication date: November 9, 2017Applicant: K.C.Tech Co., Ltd.Inventors: Young Kyu Kweon, Byoung Chaul Son, Moon Gi Cho, Joon Ho An
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Patent number: 9704729Abstract: Provided are a substrate cleaning apparatus and method and a brush assembly used therein. The substrate cleaning apparatus for contact-cleaning a substrate includes a cleaning brush rotatably disposed in a cylindrical shape and having an outer circumferential surface contacting the substrate to clean the substrate. Here, the cleaning brush includes a plurality of pressure chambers expanding by a fluid pressure and disposed along a longitudinal direction of a rotation axis rotating at a central portion of the cleaning brush, and the plurality of pressure chambers are individually expandable to allow a portion of the outer circumferential surface to protrude in a radial direction and thus contact-clean a portion of the substrate.Type: GrantFiled: June 11, 2014Date of Patent: July 11, 2017Assignee: K.C. TECH CO., LTD.Inventors: Moon Gi Cho, Jun Ho Son
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Publication number: 20160329275Abstract: The present inventive concept provides a package substrate. The package substrate comprises an insulating substrate having a top surface a circuit pattern disposed on the top surface, and a multilayer conductive joint unit disposed on the circuit pattern. The multilayer conductive joint unit comprises a nickel layer which is in contact with the circuit pattern, and an aluminum layer disposed on the nickel layer and connected to a semiconductor chip mounted on the insulating substrate.Type: ApplicationFiled: May 4, 2016Publication date: November 10, 2016Inventors: Soojae PARK, Moon Gi CHO
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Patent number: 9449918Abstract: A semiconductor device has improved reliability by preventing a fuse cut through a repair process from being electrically reconnected by electrochemical migration. The semiconductor device includes a substrate, a fuse including a first fuse pattern and a second fuse pattern formed at the same level on the substrate, the first fuse pattern and the second fuse pattern being spaced a first width apart from each other such that a gap in the fuse is disposed at a first location between the first fuse pattern and the second fuse pattern, and a first insulation layer formed on the first fuse pattern and the second fuse pattern, the first insulation layer including an opening above the first location and having a second width smaller than the first width.Type: GrantFiled: July 14, 2015Date of Patent: September 20, 2016Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Moon-Gi Cho, Eun-Chul Ahn, Sang-Young Kim, Joo-Weon Shin, Min-Ho Lee
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Patent number: 9312213Abstract: A bump structure may include a body portion spaced apart from a pad disposed on a substrate and a first extension extending from a side of the body portion onto the pad. A second extension extends from another side of the body portion.Type: GrantFiled: August 29, 2013Date of Patent: April 12, 2016Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Moon Gi Cho, Young Lyong Kim, Sun-Hee Park, Hwan-Sik Lim