Patents by Inventor Moon Gi CHO

Moon Gi CHO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • JOINT RELIABILITY OF SOLDER JOINT BETWEEN Sn-yAg SOLDER AND Ni-P UNDER BUMP METALLIC LAYER BY COBALT ADDITION
    Publication number: 20090212422
    Abstract: An improvement of joint reliability between Sn-yAg (0?y?4.0) solder and Ni—P under-bump metallic layers is achieved by cobalt (Co) addition. A solder joint with improved joint reliability is formed between a solder part of an electronic packaging and an under-bump metallic (UBM) layer, which has a specific structure comprising Sn-yAg-xCo (0.02?x?0.1, 0?y?4.0) alloy solder containing cobalt (Co) ingredient bonded to a Ni—P UBM. Also, a solder joint with a joint structure comprising Sn-yAg-xCo (0.02?x?0.1, 0?y?4.0) alloy solder with addition of Co ingredient and Ni—P UBM is formed, which is inserted between a PCB substrate and a silicon chip to join the same.
    Type: Application
    Filed: July 30, 2008
    Publication date: August 27, 2009
    Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Hyuck Mo LEE, Moon Gi CHO, Dong Hoon KIM