Abstract: Provided is a porous single resin fiber composite material comprising: a first fibrous particle; a second fibrous particle; and a binder for binding the first fibrous particle and the second fibrous particle, wherein the first fibrous particles and the second fibrous particles are bound by the binder so as to form a random network structure including pores, the first fibrous particle is a polyester-based fiber including a first polyester-based resin, the second fibrous particle is a polyester-based fiber including a second polyester-based resin, the binder includes a third polyester-based resin, the first fibrous particle has an elongation rate higher than that of the second fibrous particle, and the melting point of the second polyester-based resin is higher than the melting point of the third polyester-based resin.

Abstract: A semiconductor package is provided. The semiconductor package includes a connection structure, a semiconductor chip, and a connection metal. The connection structure includes a redistribution layer and a connection via layer. The semiconductor chip is disposed on the connection structure, and includes a connection pad. The connection metal is disposed on the connection structure and is electrically connected to the connection pad by the connection structure. The connection via layer includes a connection via having a major axis and a minor axis, and in a plan view, the minor axis of the connection via intersects with the connection metal.

Abstract: A semiconductor package includes: a connection member having a first surface and a second surface opposing each other in a stacking direction of the semiconductor package and including an insulating member and a redistribution layer formed on the insulating member and having a redistribution via; a semiconductor chip disposed on the first surface of the connection member and having connection pads connected to the redistribution layer; an encapsulant disposed on the first surface of the connection member and encapsulating the semiconductor chip; a passivation layer disposed on the second surface of the connection member; UBM pads disposed on the passivation layer and overlapping the redistribution vias in the stacking direction; and UBM vias connecting the UBM pads to the redistribution layer through the passivation layer, not overlapping the redistribution vias with respect to the stacking direction, and having a non-circular cross section.

Abstract: A fan-out sensor package includes: a substrate in which a through-hole is formed and portions of a wiring layer are exposed from an insulating layer; an image sensor having an active surface having a sensing region disposed below the through-hole of the substrate and connection pads disposed in the vicinity of the sensing region; an optical member disposed on the active surface of the image sensor; a dam member disposed in the vicinity of the sensing region; and an encapsulant encapsulating the substrate and the image sensor, wherein the third wiring layer and the connection pads are electrically connected to each other by connection members.

Abstract: In one embodiment of the present disclosure, an OTP memory circuit may include: a fuse array configured to output fuse data of a fuse set corresponding to a fuse address among a plurality of fuse sets; and a fuse address generation circuit configured to generate the fuse address to search for an available fuse set within a particular region, corresponding to a defective address, among a plurality of regions of the fuse array.

Abstract: Various aspects of the present invention are directed to providing a perovskite solar cell, and has a technical feature in that excellent stability and high efficiency are simultaneously secured by using a solid solution having a specific composition as a light absorber.

Abstract: A display device including: a first substrate; a transflective layer disposed on a surface of the first substrate; a wavelength conversion layer disposed on the transflective layer; a capping layer disposed on the wavelength conversion layer; a first polarizing layer disposed on the capping layer; and a second polarizing layer disposed on the other surface of the first substrate. The first polarizing layer and the second polarizing layer have different polarization directions.

Abstract: A semiconductor package includes a semiconductor chip having an active surface on which connection pads are disposed and an inactive surface opposing the active surface, an encapsulant disposed to cover at least a portion of the semiconductor chip, and a connection member including a redistribution layer. The redistribution layer includes a plurality of first pads, a plurality of second pads surrounding the plurality of first pads, and a plurality of third pads surrounding the plurality of second pads. Each of the plurality of second pads and each of the plurality of third pads have shapes different from a shape of each of the plurality of first pads. Gaps between the plurality of second pads and gaps between the plurality of third pads are staggered with each other.

Abstract: Disclosed is a vehicle software control device which includes hardware, a kernel connected to the hardware and configured to execute a first operating system, a system library connected to the kernel, a first connecting unit configured to connect a library for a second operating system different from the first operating system to the system library, and a first application executed on the second operating system.

Abstract: Provided are a wavelength conversion layer and a display device. A color conversion element comprises: a wavelength conversion layer; one or more low refractive layers which are disposed on and/or under the wavelength conversion layer and have a lower refractive index than the wavelength conversion layer; and one or more capping layers which are disposed between the wavelength conversion layer and the low refractive layers and/or on a surface opposite to a surface of each of the low refractive layers which faces the wavelength conversion layer.

Abstract: A semiconductor package includes: a connection member having a first surface and a second surface opposing each other in a stacking direction of the semiconductor package and including an insulating member and a redistribution layer formed on the insulating member and having a redistribution via; a semiconductor chip disposed on the first surface of the connection member and having connection pads connected to the redistribution layer; an encapsulant disposed on the first surface of the connection member and encapsulating the semiconductor chip; a passivation layer disposed on the second surface of the connection member; UBM pads disposed on the passivation layer and overlapping the redistribution vias in the stacking direction; and UBM vias connecting the UBM pads to the redistribution layer through the passivation layer, not overlapping the redistribution vias with respect to the stacking direction, and having a non-circular cross section.

Abstract: A display device and method of manufacturing the same, in which the display device includes: a first substrate; a transflective layer disposed on a surface of the first substrate; a wavelength conversion layer disposed on the transflective layer; a capping layer disposed on the wavelength conversion layer; a first polarizing layer disposed on the capping layer; and a second polarizing layer disposed on the other surface of the first substrate. The first polarizing layer and the second polarizing layer have different polarization directions.

Abstract: A fan-out semiconductor package includes a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface, an encapsulant sealing at least a portion of the inactive surface, a first connection member disposed on the active surface and including a redistribution layer and a first via electrically connecting the connection pad to the redistribution layer, a passivation layer disposed on the first connection member, and an under-bump metal layer including an external connection pad disposed on the passivation layer and a second via connecting the external connection pad to the redistribution layer. In a vertical direction, the first and second vias are disposed within the external connection pad and do not overlap each other.

Abstract: A fan-out sensor package includes: a substrate in which a through-hole is formed and portions of a wiring layer are exposed from an insulating layer; an image sensor having an active surface having a sensing region disposed below the through-hole of the substrate and connection pads disposed in the vicinity of the sensing region; an optical member disposed on the active surface of the image sensor; a dam member disposed in the vicinity of the sensing region; and an encapsulant encapsulating the substrate and the image sensor, wherein the third wiring layer and the connection pads are electrically connected to each other by connection members.

Abstract: Provided are a wavelength conversion layer and a display device. A color conversion element comprises: a wavelength conversion layer; one or more low refractive layers which are disposed on and/or under the wavelength conversion layer and have a lower refractive index than the wavelength conversion layer; and one or more capping layers which are disposed between the wavelength conversion layer and the low refractive layers and/or on a surface opposite to a surface of each of the low refractive layers which faces the wavelength conversion layer.

Abstract: An antibacterial essential oil includes 100 parts by weight of a Juniperus chinensis extract, 30 to 70 parts by weight of an Aquilaria agallocha extract, 30 to 70 parts by weight of camellia oil, and 10 to 40 parts by weight of a Dendropanax morbifera extract. Additionally, the antibacterial essential oil includes 10 to 40 parts by weight of a Portulaca oleracea extract, and 10 to 40 parts by weight of a Houttuynia cordata extract, 10 to 40 parts by weight of a Salicornict herhacea extract, and 10 to 40 parts by weight of a licorice extract. Further, the antibacterial essential oil includes 10 to 40 parts by weight of an Arctium lcwixt tea extract, 10 to 40 parts by weight of a jujube extract, 10 to 40 parts by weight of a Paeonia japonica extract, and 10 to 40 parts by weight of a Chamaecyparis obtuse extract.

Abstract: A method for preparing a mixed tea having an aloeswood. Each of the aloeswood tea, the green tea and the white tea is mixed with water in a weight ratio of 1:30 to 1:70. The aloeswood tea is brewed at a temperature of 90-100° C. for 30-80 seconds. The green tea is d brewed at a temperature of 80-85° C. for 30-80 seconds. The white tea is brewed at a temperature of 90-95° C. for 30-80 seconds. The aloeswood tea liquor, the green tea liquor and the white liquor are cooled to 5-15° C. The aloeswood liquor, the green tea liquor and the white tea liquor are mixed in a weight ratio of 1:2:1 to prepare a mixed raw water. The mixed raw water is mixed with mineral water in the weight ratio of 1:1,000 and heated. The solids are removed from the mixed raw water after the heating step.

Abstract: A semiconductor package includes a semiconductor chip having an active surface on which connection pads are disposed and an inactive surface opposing the active surface, an encapsulant disposed to cover at least a portion of the semiconductor chip, and a connection member including a redistribution layer. The redistribution layer includes a plurality of first pads, a plurality of second pads surrounding the plurality of first pads, and a plurality of third pads surrounding the plurality of second pads. Each of the plurality of second pads and each of the plurality of third pads have shapes different from a shape of each of the plurality of first pads. Gaps between the plurality of second pads and gaps between the plurality of third pads are staggered with each other.

Abstract: A printed circuit board includes a circuit layer and a ground layer disposed above the circuit layer. The ground layer includes ground layer sections each having metal members, arranged in parallel in one direction on a plane. Areas of the metal members of adjacent ground layer sections are different from each other. The areas of the metal members are determined based on respective areas of circuits of the circuit layer corresponding to respective ground layer sections.

Abstract: The present disclosure relates to HAPLN1 protein of an aged individual. The HAPLN1 protein exhibits reduced expression with aging, and when administered, its effect in alleviating and reversing skin aging including wrinkles is excellent. Therefore, by exploiting the difference in expression, provided are a biomarker composition for measuring skin aging, capable of diagnosing skin aging; a kit; and a method of screening for skin aging alleviating agents, comprising detecting the expression level of HAPLN1 protein or HAPLN1 gene. In addition, provided are a pharmaceutical composition, cosmetic composition, or health functional food for preventing or alleviating skin aging, and a cosmetic composition or health functional food for alleviating wrinkles, each containing any one or more selected from the group consisting of HAPLN1 protein, a gene encoding the same, and an effective agent for promoting the expression or activating the functions of HAPLN1 protein or gene.