Abstract: Disclosed is a visible light-activated photocatalytic coating composition comprising a visible light active photocatalytic material and an aqueous solvent.

Abstract: A semiconductor package includes a support member having a first surface and a second surface, and having a through-hole, a first metal layer for shielding disposed on an internal sidewall of the through-hole and the first surface and the second surface of the support member, a connection member disposed on the first surface of the support member, and having a redistribution layer, a semiconductor chip disposed in the through-hole, an encapsulant sealing the semiconductor chip located in the through-hole, and covering the second surface of the support member, a second metal layer for shielding disposed on the encapsulant, and connected to the first metal layer for shielding by a connecting trench via passing through the encapsulant, and a reinforcing via disposed in a region, overlapping the trench via for connection, of the support member, and connected to the first metal layer for shielding.

Abstract: A semiconductor device may include a fuse array configured to output fuse data. The semiconductor device may include a latch circuit configured to store the fuse data during an enabled section of a dummy boot-up signal, output the stored fuse data as a fuse data information signal during a disabled section of the dummy boot-up signal, and fix the fuse data information signal to a specific level during the enabled section of the dummy boot-up signal regardless of the stored fuse data.

Abstract: A method for preparing a functional health food including 40-60 parts by weight of Huperzia serrata powder, 90-110 parts by weight of walnut powder, 90-110 parts by weight of Ginkgo biloba leaf powder, 90-110 parts by weight of lotus root powder, 40-60 parts by weight of vegetable worm powder, 40-60 parts by weight of Corni fructus powder, 90-110 parts by weight of lycium Chinese powder, and 90-110 parts by weight of puer tea powder. The functional health food further includes 90-110 parts by weight of Korean angelica root powder, 40-60 parts by weight of Saururus chinensis (Lour.) baill powder, 40-60 parts by weight of white-flowering Korean dandelion powder, 40-60 parts by weight of perilla powder, and 2,500-3,500 parts by weight of honey on the basis of 100 parts by weight of aloeswood powder.

Abstract: A semiconductor package includes a support member having a first surface and a second surface, and having a through-hole, a first metal layer for shielding disposed on an internal sidewall of the through-hole and the first surface and the second surface of the support member, a connection member disposed on the first surface of the support member, and having a redistribution layer, a semiconductor chip disposed in the through-hole, an encapsulant sealing the semiconductor chip located in the through-hole, and covering the second surface of the support member, a second metal layer for shielding disposed on the encapsulant, and connected to the first metal layer for shielding by a connecting trench via passing through the encapsulant, and a reinforcing via disposed in a region, overlapping the trench via for connection, of the support member, and connected to the first metal layer for shielding.

Abstract: Disclosed is a visible light-activated photocatalytic coating composition comprising a visible light active photocatalytic material and an aqueous solvent.

Abstract: A polymer dispersed liquid crystal film for vehicles includes an electrode unit, a first electrode provided on the electrode unit, a polymer layer provided between the electrode unit and the first electrode, and a plurality of liquid crystal molecules dispersed in the polymer layer. The electrode unit includes a resin layer and a mesh-type second electrode inserted into the resin layer. The upper surface of the second electrode is exposed to the outside of the resin layer.

Abstract: A fan-out semiconductor package includes a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface, an encapsulant sealing at least a portion of the inactive surface, a first connection member disposed on the active surface and including a redistribution layer and a first via electrically connecting the connection pad to the redistribution layer, a passivation layer disposed on the first connection member, and an under-bump metal layer including an external connection pad disposed on the passivation layer and a second via connecting the external connection pad to the redistribution layer. In a vertical direction, the first and second vias are disposed within the external connection pad and do not overlap each other.

Abstract: A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having a connection pad disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first interconnection member and the inactive surface of the semiconductor chip; and a second interconnection member disposed on the first interconnection member and the active surface of the semiconductor chip, wherein the first interconnection member and the second interconnection member include, respectively, redistribution layers electrically connected to the connection pad, the semiconductor chip includes a passivation layer having an opening exposing at least a portion of the connection pad, the redistribution layer of the second interconnection member is connected to the connection pad through a via, and the via covers at least a portion of the passivation layer.

Abstract: A color conversion panel includes a substrate, a light blocking layer on the substrate, and color conversion layers and a transmission layer on the substrate, the color conversion layers including a quantum dot, wherein the light blocking layer includes a first sub-light blocking layer overlapping the color conversion layers and the transmission layer, and a second sub-light blocking layer between adjacent ones of the color conversion layers and the transmission layer, and wherein each of the first sub-light blocking layer and the second sub-light blocking layer includes an external light absorption layer on the substrate, and a reflection layer on the external light absorption layer.

Abstract: A solar cell in a stack structure having no step may include a solar cell, and an electrode formed on one surface of the solar cell, in which the solar cell is/are stacked on a center portion of a substrate with the electrode interposed therebetween, and the electrode is/are in contact with an electrode line coated on an edge portion of the substrate.

Abstract: A fan-out sensor package includes: a substrate in which a through-hole is formed and portions of a wiring layer are exposed from an insulating layer; an image sensor having an active surface having a sensing region disposed below the through-hole of the substrate and connection pads disposed in the vicinity of the sensing region; an optical member disposed on the active surface of the image sensor; a dam member disposed in the vicinity of the sensing region; and an encapsulant encapsulating the substrate and the image sensor, wherein the third wiring layer and the connection pads are electrically connected to each other by connection members.

Abstract: A method for preparing a mixed tea having an aloeswood. Each of the aloeswood tea, the green tea and the white tea is mixed with water in a weight ratio of 1:30 to 1:70. The aloeswood tea is brewed at a temperature of 90-100° C. for 30-80 seconds. The green tea is d brewed at a temperature of 80-85° C. for 30-80 seconds. The white tea is brewed at a temperature of 90-95° C. for 30-80 seconds. The aloeswood tea liquor, the green tea liquor and the white liquor are cooled to 5-15° C. The aloeswood liquor, the green tea liquor and the white tea liquor are mixed in a weight ratio of 1:2:1 to prepare a mixed raw water. The mixed raw water is mixed with mineral water in the weight ratio of 1:1,000 and heated. The solids are removed from the mixed raw water after the heating step.

Abstract: A printed circuit board (PCB) assembly according to one embodiment of the present disclosure includes a first pad; a second pad disposed to be spaced apart from the first pad; and a thermal fuse provided with a first terminal and a second terminal which are each coupled to the first pad and the second pad by soldering. Here, a contact area between the first pad and the first terminal is smaller than that between the second pad and the second terminal.

Abstract: Disclosed is a liquid crystal film for a vehicle, including a first electrode, a liquid crystal molecular layer provided on the first electrode, and a second electrode provided on the liquid crystal molecular layer. The liquid crystal molecular layer includes a pre-polymer, a liquid crystal material, and a crosslinking agent.

Abstract: An pressure sensitive adhesive composition according to the present invention includes: an acrylic copolymer; a multifunctional acrylate-based compound; and a photoinitiator, in which the acrylic copolymer includes a repeating unit derived from an acrylate-based monomer having a Tg of ?20° C. or less and a repeating unit derived from an unsaturated carboxylic acid monomer, and the repeating unit derived from the unsaturated carboxylic acid monomer is included in an amount of 10 to 50 parts by weight based on the total 100 parts by weight of the acrylic copolymer.

Abstract: An exemplary embodiment of the present disclosure provides a color conversion panel including: a substrate; a polarization layer that is disposed on the substrate and includes a plurality of polarization patterns spaced apart from each other at a predetermined interval; and a color conversion layer that is disposed on the polarization layer, wherein at least one of the plurality of polarization patterns may include an external light interference layer disposed on the substrate and a reflection layer disposed on the external light interference layer.

Abstract: A semiconductor package includes: a connection member having a first surface and a second surface opposing each other in a stacking direction of the semiconductor package and including an insulating member and a redistribution layer formed on the insulating member and having a redistribution via; a semiconductor chip disposed on the first surface of the connection member and having connection pads connected to the redistribution layer; an encapsulant disposed on the first surface of the connection member and encapsulating the semiconductor chip; a passivation layer disposed on the second surface of the connection member; UBM pads disposed on the passivation layer and overlapping the redistribution vias in the stacking direction; and UBM vias connecting the UBM pads to the redistribution layer through the passivation layer, not overlapping the redistribution vias with respect to the stacking direction, and having a non-circular cross section.

Abstract: Provided are a wavelength conversion layer and a display device. A color conversion element comprises: a wavelength conversion layer; one or more low refractive layers which are disposed on and/or under the wavelength conversion layer and have a lower refractive index than the wavelength conversion layer; and one or more capping layers which are disposed between the wavelength conversion layer and the low refractive layers and/or on a surface opposite to a surface of each of the low refractive layers which faces the wavelength conversion layer.