Patents by Inventor Moon Jung

Moon Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210216967
    Abstract: The present disclosure provides systems and methods for delivering packages to customers, comprising a memory storing instructions and a processor configured to execute the instructions to receive, from a first user device in a fulfillment center, a package identifier associated with a package for delivery to a customer, modify a database to assign the package identifier to a group, among a plurality of groups, based on a delivery address associated with the package identifier and a location of a camp to which the package is routed, generate a map of the plurality of groups, send the map for display on a second user device in the camp, and send for display an activatable icon on a location on the map, wherein the location of the activatable icon on the map is associated with the delivery address of the package.
    Type: Application
    Filed: March 31, 2021
    Publication date: July 15, 2021
    Applicant: Coupang, Corp.
    Inventors: Yulhee LEE, Hye Leen CHOI, Yong Hee LEE, Moon Jung JANG, Sun Hee HWANG, Jeongho PI
  • Patent number: 11059435
    Abstract: Disclosed is a vehicle software control device which includes hardware, a kernel connected to the hardware and configured to execute a first operating system, a system library connected to the kernel, a first connecting unit configured to connect a library for a second operating system different from the first operating system to the system library, and a first application executed on the second operating system.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: July 13, 2021
    Assignee: DRIMAES, INC.
    Inventors: Jin Woo Im, Guk Tae Kim, Won Lee, Soo Yeon Kang, Young Moon Jung, Su Chang Ko, Kyung Hyun Lim, Hong Lee
  • Publication number: 20210210227
    Abstract: A long-term cooling system in a nuclear power plant according to the present disclosure may include a boundary section disposed inside a containment to enclose a reactor coolant system, and configured to restrict steam containing radioactive materials generated in the reactor coolant system from leaking into paths other than a discharge part, an In-Containment Water Storage Tank (IRWST) disposed outside the boundary section and configured to store refueling water therein, an emergency cooling tank disposed outside the containment and provided with a condensation heat exchanger, a gas-liquid separator connected to the emergency cooling tank outside the containment, and a return line configured to connect the gas-liquid separator and the boundary section such that condensate generated by condensing the steam within the boundary section through the emergency cooling tank and the gas-liquid separator is discharged toward the boundary section upon an occurrence of a nuclear power plant accident.
    Type: Application
    Filed: November 13, 2020
    Publication date: July 8, 2021
    Applicant: KOREA ATOMIC ENERGY RESEARCH INSTITUTE
    Inventors: Kyungjun KANG, Moon JUNG, Jihan CHUN, Hanok KANG
  • Publication number: 20210193241
    Abstract: A non-volatile storage device includes a non-volatile storage circuit including a plurality of fuse sets suitable for sequentially outputting fuse data according to a counting address, each fuse set including an enable fuse, a plurality of address fuses, and a duplication fuse; a read control circuit suitable for receiving the fuse data, and outputting latch data by selectively masking data of the enable fuse and the address fuses using data of the duplication fuse within the received fuse data; and a program control circuit suitable for controlling programming the duplication fuse of a duplicated fuse set among the fuse sets when a repair address inputted from outside is identical to data of the address fuses within the duplicated fuse set, or to program the repair address into an available fuse set among the fuse sets, according to a program mode signal.
    Type: Application
    Filed: May 13, 2020
    Publication date: June 24, 2021
    Inventor: Chul-Moon JUNG
  • Patent number: 11042059
    Abstract: Provided are a wavelength conversion layer and a display device. A color conversion element comprises: a wavelength conversion layer; one or more low refractive layers which are disposed on and/or under the wavelength conversion layer and have a lower refractive index than the wavelength conversion layer; and one or more capping layers which are disposed between the wavelength conversion layer and the low refractive layers and/or on a surface opposite to a surface of each of the low refractive layers which faces the wavelength conversion layer.
    Type: Grant
    Filed: May 28, 2020
    Date of Patent: June 22, 2021
    Assignee: Samsung Display Co., Ltd.
    Inventors: Taek Joon Lee, Young Gu Kim, Keun Chan Oh, Sun Young Chang, Hye Lim Jang, Baek Kyun Jeon, Jin Soo Jung, Kyung Seon Tak, Jae Jin Lyu, Moon Jung Baek
  • Patent number: 11033591
    Abstract: An antibacterial essential oil includes 100 parts by weight of a Juniperus chinensis extract, 30 to 70 parts by weight of an Aquilaria agallocha extract, 30 to 70 parts by weight of camellia oil, and 10 to 40 parts by weight of a Dendropanax morbifera extract. Additionally, the antibacterial essential oil includes 10 to 40 parts by weight of a Portulaca oleracea extract, and 10 to 40 parts by weight of a Houttuynia cordata extract, 10 to 40 parts by weight of a Salicornict herhacea extract, and 10 to 40 parts by weight of a licorice extract. Further, the antibacterial essential oil includes 10 to 40 parts by weight of an Arctium lcwixt tea extract, 10 to 40 parts by weight of a jujube extract, 10 to 40 parts by weight of a Paeonict japonica extract, and 10 to 40 parts by weight of a Chamaecyparis obtuse extract.
    Type: Grant
    Filed: February 3, 2020
    Date of Patent: June 15, 2021
    Inventor: Jong Moon Jung
  • Publication number: 20210172572
    Abstract: A color conversion panel includes a first color conversion layer, a second color conversion layer, and a light wavelength conversion layer. The first color conversion layer includes a first semiconductor nanocrystal set for providing red light. The second color conversion layer neighbors the first color conversion layer and includes a second semiconductor nanocrystal set for providing first green light. The light wavelength conversion layer neighbors the second light conversion layer, may provide blue light, and includes a third semiconductor nanocrystal set for providing second green light.
    Type: Application
    Filed: February 18, 2021
    Publication date: June 10, 2021
    Inventors: Seon-Tae YOON, Jung Hyun KWON, Ki Soo PARK, Hae Il PARK, Moon Jung BAEK
  • Patent number: 10998362
    Abstract: A fan-out sensor package includes: a substrate in which a through-hole is formed and portions of a wiring layer are exposed from an insulating layer; an image sensor having an active surface having a sensing region disposed below the through-hole of the substrate and connection pads disposed in the vicinity of the sensing region; an optical member disposed on the active surface of the image sensor; a dam member disposed in the vicinity of the sensing region; and an encapsulant encapsulating the substrate and the image sensor, wherein the third wiring layer and the connection pads are electrically connected to each other by connection members.
    Type: Grant
    Filed: June 29, 2020
    Date of Patent: May 4, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae Hyun Lim, Yoon Seok Seo, Kyung Moon Jung, Eun Jin Kim
  • Patent number: 10997546
    Abstract: The present disclosure provides systems and methods for delivering packages to customers, comprising a memory storing instructions and a processor configured to execute the instructions to receive, from a first user device in a fulfillment center, a package identifier associated with a package for delivery to a customer, modify a database to assign the package identifier to a group, among a plurality of groups, based on a delivery address associated with the package identifier and a location of a camp to which the package is routed, generate a map of the plurality of groups, send the map for display on a second user device in the camp, and send for display an activatable icon on a location on the map, wherein the location of the activatable icon on the map is associated with the delivery address of the package.
    Type: Grant
    Filed: August 14, 2019
    Date of Patent: May 4, 2021
    Assignee: Coupang Corp.
    Inventors: Yulhee Lee, Hye Leen Choi, Yong Hee Lee, Moon Jung Jang, Sun Hee Hwang, Jeongho Pi
  • Patent number: 10948137
    Abstract: A color conversion panel includes a first color conversion layer, a second color conversion layer, and a light wavelength conversion layer. The first color conversion layer includes a first semiconductor nanocrystal set for providing red light. The second color conversion layer neighbors the first color conversion layer and includes a second semiconductor nanocrystal set for providing first green light. The light wavelength conversion layer neighbors the second light conversion layer, may provide blue light, and includes a third semiconductor nanocrystal set for providing second green light.
    Type: Grant
    Filed: December 13, 2018
    Date of Patent: March 16, 2021
    Inventors: Seon-Tae Yoon, Jung Hyun Kwon, Ki Soo Park, Hae Il Park, Moon Jung Baek
  • Publication number: 20210057116
    Abstract: A sparger includes a main pipe connecting inside and outside of a water tank having a storage space therein for storing cooling water, so as to define a flow path through which steam and air containing radioactive materials generated outside the water tank are discharged into the cooling water, a header part connected to one end portion of the main pipe located in the storage space, and having a storage chamber in which the steam and air transferred through the main pipe are collected, and a plurality of discharge nozzles disposed in a spacing manner, each having inlet and outlet formed on one end located in the storage chamber and another end located in the storage space, respectively, to discharge the steam and air from the storage chamber to the storage space, and at least some of the plurality of discharge nozzles protruding from the header part by different lengths.
    Type: Application
    Filed: August 19, 2020
    Publication date: February 25, 2021
    Applicant: KOREA ATOMIC ENERGY RESEARCH INSTITUTE
    Inventors: Kyungjun KANG, Moon JUNG, Jihan CHUN, Hanok KANG
  • Publication number: 20210049549
    Abstract: The present disclosure provides systems and methods for delivering packages to customers, comprising a memory storing instructions and a processor configured to execute the instructions to receive, from a first user device in a fulfillment center, a package identifier associated with a package for delivery to a customer, modify a database to assign the package identifier to a group, among a plurality of groups, based on a delivery address associated with the package identifier and a location of a camp to which the package is routed, generate a map of the plurality of groups, send the map for display on a second user device in the camp, and send for display an activatable icon on a location on the map, wherein the location of the activatable icon on the map is associated with the delivery address of the package.
    Type: Application
    Filed: August 14, 2019
    Publication date: February 18, 2021
    Inventors: Yulhee LEE, Hye Leen CHOI, Yong Hee LEE, Moon Jung JANG, Sun Hee HWANG, Jeongho PI
  • Patent number: 10898879
    Abstract: Disclosed is a visible light-activated photocatalytic coating composition comprising a visible light active photocatalytic material and an aqueous solvent.
    Type: Grant
    Filed: September 13, 2019
    Date of Patent: January 26, 2021
    Assignee: LG HAUSYS, LTD.
    Inventors: Joo-Hwan Seo, Dong-Il Lee, Seong-Moon Jung, Ha-Na Kim, Hye-Youn Jang
  • Patent number: 10887983
    Abstract: A printed circuit board includes a circuit layer and a ground layer disposed above the circuit layer. The ground layer includes ground layer sections each having metal members, arranged in parallel in one direction on a plane. Areas of the metal members of adjacent ground layer sections are different from each other. The areas of the metal members are determined based on respective areas of circuits of the circuit layer corresponding to respective ground layer sections.
    Type: Grant
    Filed: April 22, 2019
    Date of Patent: January 5, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sung-Jun Lim, Seong-Hwan Park, Kyung-Ho Lee, Kyung-Moon Jung, Chul-Kyu Kim
  • Publication number: 20200403029
    Abstract: A display device includes a substrate; a first electrode and a second electrode arranged to be spaced apart from each other on the substrate; a first insulating layer on the substrate; a light emitting element on the first insulating layer, located between the first electrode and the second electrode, and including a first end portion and a second end portion; a third electrode on the substrate and electrically connected to the first electrode and the first end portion; a fourth electrode on the substrate and electrically connected to the second electrode and the second end portion; a second insulating layer on the substrate and covering the light emitting element, the third electrode, and the fourth electrode; and a light diffusion layer on the second insulating layer and including a light diffusion particle.
    Type: Application
    Filed: January 9, 2020
    Publication date: December 24, 2020
    Inventors: Dong Gyun KIM, Moon Jung AN, Dong Eon LEE, Hye Lim KANG, Hoo Keun PARK, Byung Ju LEE
  • Publication number: 20200381180
    Abstract: A multilayer ceramic electronic component and a mounting board thereof include a reinforcing member that is disposed on upper and lower surfaces of a ceramic body of the multilayer ceramic electronic component and that is bonded to the first and the second external electrodes. The reinforcing member provides reduced occurrence of cracking and reduced stress applied to the component. The reinforcing member may have a coefficient of thermal expansion (CTE) that is within a range of 1 to 4 times a coefficient of thermal expansion of a dielectric layer of the ceramic body, and/or may have a modulus that is 0.5 or more times a modulus of the dielectric layer.
    Type: Application
    Filed: September 5, 2019
    Publication date: December 3, 2020
    Inventors: Yun Tae LEE, Kyung Moon JUNG, Han KIM
  • Patent number: 10850454
    Abstract: Provided is a porous single resin fiber composite material comprising: a first fibrous particle; a second fibrous particle; and a binder for binding the first fibrous particle and the second fibrous particle, wherein the first fibrous particles and the second fibrous particles are bound by the binder so as to form a random network structure including pores, the first fibrous particle is a polyester-based fiber including a first polyester-based resin, the second fibrous particle is a polyester-based fiber including a second polyester-based resin, the binder includes a third polyester-based resin, the first fibrous particle has an elongation rate higher than that of the second fibrous particle, and the melting point of the second polyester-based resin is higher than the melting point of the third polyester-based resin.
    Type: Grant
    Filed: October 21, 2016
    Date of Patent: December 1, 2020
    Assignees: LG HAUSYS, LTD., ENVIONEER CO., LTD.
    Inventors: Seung-Hyun Ahn, Kyung-Seok Han, Seong-Moon Jung
  • Publication number: 20200365545
    Abstract: A semiconductor package is provided. The semiconductor package includes a connection structure, a semiconductor chip, and a connection metal. The connection structure includes a redistribution layer and a connection via layer. The semiconductor chip is disposed on the connection structure, and includes a connection pad. The connection metal is disposed on the connection structure and is electrically connected to the connection pad by the connection structure. The connection via layer includes a connection via having a major axis and a minor axis, and in a plan view, the minor axis of the connection via intersects with the connection metal.
    Type: Application
    Filed: December 20, 2019
    Publication date: November 19, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chang Eun JOO, Sung Hoan KIM, Kyung Moon JUNG, Yong Hwan KWON, Young Kyu LIM, Seong Hwan PARK
  • Publication number: 20200350270
    Abstract: A semiconductor package includes: a connection member having a first surface and a second surface opposing each other in a stacking direction of the semiconductor package and including an insulating member and a redistribution layer formed on the insulating member and having a redistribution via; a semiconductor chip disposed on the first surface of the connection member and having connection pads connected to the redistribution layer; an encapsulant disposed on the first surface of the connection member and encapsulating the semiconductor chip; a passivation layer disposed on the second surface of the connection member; UBM pads disposed on the passivation layer and overlapping the redistribution vias in the stacking direction; and UBM vias connecting the UBM pads to the redistribution layer through the passivation layer, not overlapping the redistribution vias with respect to the stacking direction, and having a non-circular cross section.
    Type: Application
    Filed: July 17, 2020
    Publication date: November 5, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seok Hwan KIM, Han KIM, Kyung Ho LEE, Kyung Moon JUNG
  • Publication number: 20200328241
    Abstract: A fan-out sensor package includes: a substrate in which a through-hole is formed and portions of a wiring layer are exposed from an insulating layer; an image sensor having an active surface having a sensing region disposed below the through-hole of the substrate and connection pads disposed in the vicinity of the sensing region; an optical member disposed on the active surface of the image sensor; a dam member disposed in the vicinity of the sensing region; and an encapsulant encapsulating the substrate and the image sensor, wherein the third wiring layer and the connection pads are electrically connected to each other by connection members.
    Type: Application
    Filed: June 29, 2020
    Publication date: October 15, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae Hyun LIM, Yoon Seok SEO, Kyung Moon JUNG, Eun Jin KIM