Patents by Inventor Moon Jung

Moon Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180236438
    Abstract: Disclosed is a visible light-activated photocatalytic coating composition comprising a visible light active photocatalytic material and an aqueous solvent.
    Type: Application
    Filed: February 23, 2016
    Publication date: August 23, 2018
    Inventors: Joo-Hwan SEO, Dong-Il LEE, Seong-Moon JUNG, Ha-Na KIM, Hye-Youn JANG
  • Publication number: 20180233432
    Abstract: An electronic component package may include: a redistribution layer including a first insulating layer, a first conductive pattern disposed on the first insulating layer, and a first via connected to the first conductive pattern while penetrating through the first insulating layer; an electronic component disposed on the redistribution layer; and an encapsulant encapsulating the electronic component. The first via has a horizontal cross-sectional shape in which a distance between first and second edge points of the first via in a first direction passing through the center of the first via and the first and second edge points thereof is shorter than that between third and fourth edge points of the first via in a second direction perpendicular to the first direction and passing through the center of the first via and the third and fourth points thereof.
    Type: Application
    Filed: April 17, 2018
    Publication date: August 16, 2018
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Han KIM, Young Gwan KO, Kang Heon HUR, Kyung Moon JUNG, Sung Han KIM
  • Publication number: 20180223138
    Abstract: An pressure sensitive adhesive composition according to the present invention includes: an acrylic copolymer; a multifunctional acrylate-based compound; and a photoinitiator, in which the acrylic copolymer includes a repeating unit derived from an acrylate-based monomer having a Tg of ?20° C. or less and a repeating unit derived from an unsaturated carboxylic acid monomer, and the repeating unit derived from the unsaturated carboxylic acid monomer is included in an amount of 10 to 50 parts by weight based on the total 100 parts by weight of the acrylic copolymer.
    Type: Application
    Filed: February 9, 2018
    Publication date: August 9, 2018
    Applicant: DONGWOO FINE-CHEM CO., LTD.
    Inventors: Joong Han KUM, Jeong Ho YOO, Kyoung Moon JUNG, Bong Jin CHOI, Han Young CHOI
  • Patent number: 10032697
    Abstract: An electronic component package may include: a redistribution layer including a first insulating layer, a first conductive pattern disposed on the first insulating layer, and a first via connected to the first conductive pattern while penetrating through the first insulating layer; an electronic component disposed on the redistribution layer; and an encapsulant encapsulating the electronic component. The first via has a horizontal cross-sectional shape in which a distance between first and second edge points of the first via in a first direction passing through the center of the first via and the first and second edge points thereof is shorter than that between third and fourth edge points of the first via in a second direction perpendicular to the first direction and passing through the center of the first via and the third and fourth points thereof.
    Type: Grant
    Filed: July 6, 2016
    Date of Patent: July 24, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Han Kim, Young Gwan Ko, Kang Heon Hur, Kyung Moon Jung, Sung Han Kim
  • Publication number: 20180202616
    Abstract: A color conversion panel includes a first color conversion layer, a second color conversion layer, and a light wavelength conversion layer. The first color conversion layer includes a first semiconductor nanocrystal set for providing red light. The second color conversion layer neighbors the first color conversion layer and includes a second semiconductor nanocrystal set for providing first green light. The light wavelength conversion layer neighbors the second light conversion layer, may provide blue light, and includes a third semiconductor nanocrystal set for providing second green light.
    Type: Application
    Filed: August 15, 2017
    Publication date: July 19, 2018
    Inventors: Seon-Tae YOON, Jung Hyun KWON, Ki Soo PARK, Hae Il PARK, Moon Jung BAEK
  • Publication number: 20180173053
    Abstract: A display device and method of manufacturing the same, in which the display device includes: a first substrate; a transflective layer disposed on a surface of the first substrate; a wavelength conversion layer disposed on the transflective layer; a capping layer disposed on the wavelength conversion layer; a first polarizing layer disposed on the capping layer; and a second polarizing layer disposed on the other surface of the first substrate. The first polarizing layer and the second polarizing layer have different polarization directions.
    Type: Application
    Filed: December 19, 2017
    Publication date: June 21, 2018
    Inventors: Seon Tae YOON, Jung Hyun Kwon, Ki Soo Park, Hae Il Park, Moon Jung Baek
  • Patent number: 10002524
    Abstract: A method and apparatus for controlling groups of devices in a home network system are provided. The method includes receiving a request message for executing a first operation mode from a mobile station through the Internet, reading a control list stored for the first operation mode, in order to determine home devices associated with the first operation mode and in order to determine functions of the home devices, in response to the request message, transmitting control commands, instructing the home devices to execute the functions, to the home devices, respectively, according to the control list, and reporting the results of execution of the functions, according to the control commands, to the mobile station.
    Type: Grant
    Filed: December 13, 2013
    Date of Patent: June 19, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jung-Hyun Shim, Kyung-Jae Kim, Keun-Cheol Lee, Kyung-Tack Kwon, Hae-Moon Jung
  • Patent number: 9970588
    Abstract: The present invention provides a glass fiber board comprising a glass fiber and an inorganic binder, wherein the inorganic binder comprises an aluminum phosphate. The present invention provides a method for preparing the glass fiber board comprising (a) preparing an inorganic binder solution comprising an aluminum phosphate (b) applying the inorganic binder solution comprising the aluminum phosphate to a glass fiber; (c) compressing the glass fiber to which the inorganic binder solution comprising the aluminum phosphate is applied; and (d) drying the compressed glass fiber.
    Type: Grant
    Filed: December 5, 2012
    Date of Patent: May 15, 2018
    Assignee: LG HAUSYS, LTD.
    Inventors: Ju-Hyung Lee, Seong-Moon Jung, Myung Lee, Eun-Joo Kim, Hyun-Jae Kim
  • Publication number: 20180122584
    Abstract: A method for preparing a perovskite solar cell by a non-deposition method is provided. Particularly, the method includes preparing a first substrate by forming a hole transport layer on a light absorbing layer in a semi-dried state and pressurizing and drying a second substrate including an opposing electrode to the first substrate.
    Type: Application
    Filed: January 30, 2017
    Publication date: May 3, 2018
    Applicants: HYUNDAI MOTOR COMPANY, University-Industry Cooperation Group of Kyung Hee University
    Inventors: Sol Kim, Mi Yeon Song, Sang Hak Kim, Eun Yeong Lee, Moon Jung Eo, Sang Hyuk Im, Hye Ji Han
  • Publication number: 20180114657
    Abstract: A printed circuit board (PCB) assembly according to one embodiment of the present disclosure includes a first pad; a second pad disposed to be spaced apart from the first pad; and a thermal fuse provided with a first terminal and a second terminal which are each coupled to the first pad and the second pad by soldering. Here, a contact area between the first pad and the first terminal is smaller than that between the second pad and the second terminal.
    Type: Application
    Filed: October 26, 2017
    Publication date: April 26, 2018
    Inventors: MOON JUNG PARK, GON JAE LEE
  • Patent number: 9944189
    Abstract: A system for using a solar cell includes a solar cell module configured to convert sunlight into electric energy, an engine operating circuit configured to convert mechanical energy generated by an engine operation of a vehicle into electric energy and provide the electric energy, a solar cell circuit configured to provide the electric energy generated through the solar cell module, a battery configured to be charged by electric energy provided by the solar cell circuit or the engine operating circuit, a load, and a controller of a vehicle. The controller is configured to control a connection of the circuits to the battery or to the load depending on a measured state of charge of the battery, driving of the vehicle, and acceleration of the vehicle. A method for using a solar cell is also disclosed.
    Type: Grant
    Filed: October 20, 2015
    Date of Patent: April 17, 2018
    Assignee: HYUNDAI MOTOR COMPANY
    Inventors: Hae Yoon Jung, Won Jung Kim, Moon Jung Eo, Sung Geun Park, Sang Hak Kim, Mi Yeon Song
  • Patent number: 9935068
    Abstract: A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having a connection pad disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first interconnection member and the inactive surface of the semiconductor chip; and a second interconnection member disposed on the first interconnection member and the active surface of the semiconductor chip, wherein the first interconnection member and the second interconnection member include, respectively, redistribution layers electrically connected to the connection pad, the semiconductor chip includes a passivation layer having an opening exposing at least a portion of the connection pad, the redistribution layer of the second interconnection member is connected to the connection pad through a via, and the via covers at least a portion of the passivation layer.
    Type: Grant
    Filed: March 9, 2017
    Date of Patent: April 3, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Min Ban, Han Kim, Kyung Moon Jung
  • Publication number: 20180090458
    Abstract: A fan-out semiconductor package includes a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface, an encapsulant sealing at least a portion of the inactive surface, a first connection member disposed on the active surface and including a redistribution layer and a first via electrically connecting the connection pad to the redistribution layer, a passivation layer disposed on the first connection member, and an under-bump metal layer including an external connection pad disposed on the passivation layer and a second via connecting the external connection pad to the redistribution layer. In a vertical direction, the first and second vias are disposed within the external connection pad and do not overlap each other.
    Type: Application
    Filed: January 10, 2017
    Publication date: March 29, 2018
    Inventors: Han KIM, Kyung Moon JUNG, Seok Hwan KIM, Kyung Ho LEE, Kang Heon HUR
  • Patent number: 9925747
    Abstract: Provided is an outer cover material for a vacuum insulator, sequentially comprising: one or more layers of a polyester film; a polyvinyl alcohol (PVOH) film adhered to a lower surface of the polyester film; and a sealing film adhered to a lower surface of the PVOH film. Also provided is a vacuum insulator, comprising a core material consisting of a fiberglass; and the outer cover material under internal pressure, accommodating the core material.
    Type: Grant
    Filed: April 1, 2014
    Date of Patent: March 27, 2018
    Assignee: LG HAUSYS, LTD.
    Inventors: Myung Lee, Eun Joo Kim, Seong Moon Jung, Hyun Jae Kim
  • Publication number: 20180082736
    Abstract: A refresh control device for reducing power consumption during a target row refresh operation is disclosed. The refresh control device includes a refresh address generator configured to generate a refresh address by selecting any one of a target row refresh address and a normal refresh address according to a target row refresh flag signal, an address control signal generator configured to generate a multiple address control signal in response to the target row refresh flag signal and a multiple refresh signal, and a final refresh address generator configured to generate a plurality of final refresh addresses from the refresh address in response to the multiple address control signal.
    Type: Application
    Filed: March 7, 2017
    Publication date: March 22, 2018
    Applicant: SK hynix Inc.
    Inventor: Chul Moon JUNG
  • Patent number: 9911505
    Abstract: A semiconductor system may include a first semiconductor device and a second semiconductor device. The first semiconductor device may output a clock signal, a test mode signal and command address signals. The second semiconductor device may repeatedly write and read out data into and from a plurality of memory cells sequentially selected by addresses that are sequentially counted or may repeatedly write and read out the data into and from specific memory cells selected by a specific address among the addresses, according to the clock signal and the command address signals in response to the test mode signal.
    Type: Grant
    Filed: November 20, 2015
    Date of Patent: March 6, 2018
    Assignee: SK hynix Inc.
    Inventors: Chul Moon Jung, Mi Hyun Hwang
  • Publication number: 20180059301
    Abstract: Provided is a polarizer. The polarizer includes a base layer and a wire grid layer which is disposed on the base layer and which include a plurality of wire metal patterns extending along a first direction and spaced apart from each other along a second direction crossing the first direction, wherein the wire grid layer is made of an aluminum (Al) alloy containing nickel (Ni) and lanthanum (La).
    Type: Application
    Filed: April 3, 2017
    Publication date: March 1, 2018
    Inventors: Moon Jung AN, Jung Gun NAM, Su Kyoung YANG, Gyung Min BAEK, Kang Soo HAN, Joon Yong PARK, Sang Won SHIN, Hyun Eok SHIN
  • Publication number: 20180033751
    Abstract: A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having a connection pad disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first interconnection member and the inactive surface of the semiconductor chip; and a second interconnection member disposed on the first interconnection member and the active surface of the semiconductor chip, wherein the first interconnection member and the second interconnection member include, respectively, redistribution layers electrically connected to the connection pad, the semiconductor chip includes a passivation layer having an opening exposing at least a portion of the connection pad, the redistribution layer of the second interconnection member is connected to the connection pad through a via, and the via covers at least a portion of the passivation layer.
    Type: Application
    Filed: October 4, 2017
    Publication date: February 1, 2018
    Inventors: Young Min BAN, Han KIM, Kyung Moon JUNG
  • Patent number: D817306
    Type: Grant
    Filed: November 25, 2015
    Date of Patent: May 8, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Moon-Jung Jang, Ji-Hee Kwak, Ji-Yun Lim, Tai-Hyung Ju
  • Patent number: D817925
    Type: Grant
    Filed: November 25, 2015
    Date of Patent: May 15, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Moon-Jung Jang, Ji-Hee Kwak, Ji-Yun Lim, Tai-Hyung Ju