Abstract: Disclosed herein is a dielectric waveguide antenna including: a dielectric waveguide transmitting a signal applied from a power feeder; a dielectric waveguide radiator radiating the signal transmitted from the dielectric waveguide to the air through a first aperture; and a matching unit formed in a portion of the dielectric waveguide and controlling a serial reactance and a parallel reactance to thereby perform impedance matching between the dielectric waveguide radiator and the air, in order to reduce reflection generated in the first aperture during the radiation of the signal through the first aperture. Reflection in the aperture is reduced through the matching unit having various structures, thereby making it possible to improve characteristics of the dielectric waveguide antenna.

Abstract: Disclosed herein is a dielectric resonator antenna embedded in a multilayer substrate for enhancing bandwidth. The dielectric resonator antenna includes a multilayer substrate, a first conductive plate, a second conductive plate, a plurality of first metal via holes, a feeding part configured to feed a dielectric resonator, and a conductive pattern part inserted into the dielectric resonator so that a vertical metal interface is formed in the dielectric resonator. Accordingly, the dielectric resonator antenna has low sensitivity to fabrication errors and an external environment, and can enhance the radiation characteristics of the antenna when multiple resonances occur.

Abstract: Disclosed herein is a dielectric resonator antenna using a matching substrate in order to improve a bandwidth. The dielectric resonator antenna includes: a dielectric resonator body part that is embedded in a multi-layer substrate and has an opening part on the upper portion thereof; and at least one matching substrate that is stacked on the opening part and includes an an insulating layer having a dielectric constant smaller than that of the multi-layer substrate but larger than that of air, thereby making it possible to improve the bandwidth without adjusting the size of the dielectric resonator body part and to prevent loss and change in the radiation pattern due to the substrate mode.

Abstract: Disclosed is a dielectric resonator antenna embedded in a multilayer substrate, which includes a multilayer substrate, a first conductor plate having an opening, a second conductor plate formed on the bottom of a lowermost insulating layer resulting from stacking at least two insulating layers downward from the first conductor plate, a plurality of metal via holes passing through around the opening at a predetermined interval, and a feeder for transmitting a frequency signal to the dielectric resonator embedded by the metal boundaries defined by the first conductor plate, the second conductor plate and the plurality of metal via holes, thus exhibiting low sensitivity to fabrication error and the external environment.

Abstract: The present invention relates to a high throughput screening method of a binding inhibitor between caspase3 and xIAP and chromomycin screened using the same, and more specifically, the present invention provides a method for screening anticancer substance, the method comprising the steps of reacting caspase3 or xIAP and candidate inhibitors of the binding between caspase3 and xIAP on a biochip for detecting caspase3:xIAP interaction, and selecting a candidate substance inhibiting the binding of caspase3 to xIAP as an anticancer substance, and an anticancer agent inhibiting caspase3:xIAP binding, which is screened by the above method. According to present invention, it is possible to develop a target-oriented anticancer agent focused on xIAP and caspase3, apoptosis-related proteins and thus it can be applied to tailored medication and combination therapy.

Abstract: A line-waveguide converter includes a backside electrode disposed on a first face of a dielectric substrate, a waveguide attached to a second face of the dielectric substrate opposite the first face and having electrical conduction to the backside electrode, and multiple electrodes disposed inside the waveguide on the second face. The electrodes are identical in shape and size, and the intervals between adjoining ones of the electrodes are identical. At least one of the electrodes can be fed with power from a line.

Abstract: High frequency power amplification modules comprise a dielectric substrate supporting a stepped impedance transition coupled to the input of a power amplifier and a symmetrically disposed stepped impedance transition connected to the output of the power amplifier. The power amplification modules are oriented in an electromagnetic energy field so that input electromagnetic energy is coupled to the input of the power amplifier by the input side stepped impedance transition, amplified by the amplifier, and emitted from the module by the output side stepped impedance transition. A plurality of the power amplification modules may be organized into an array to provide a power combiner. The power amplification modules in the array may be linked by isolation impedances that decouple the modules in the array.

Abstract: A first metal plate for transmission and a second metal plate for transmission are closely-attached to a first surface and a second surface of a dielectric body, respectively. An outer edge of the first metal plate substantially symmetrically faces an outer edge of the second metal plate via the dielectric body. A metal plate for matching is arranged inside a hole formed on the second metal plate, with a slit formed with an inner wall of the hole, and is fixed to the dielectric body. The metal plate for matching is electrically connected to the first metal plate via a through hole penetrating the dielectric body. An IC chip is surface-mounted to connect the second metal plate with the metal plate for matching.

Abstract: An antenna comprises a first conductive layer, a second conductive layer and an LC resonance circuit. The first conductive layer has plural elements and is disposed adjacently to each other. The second conductive layer is disposed at a predetermined distance from the first conductive layer via a dielectric substrate. The LC resonance circuit comprises connection for electrically connecting the elements and the second conductive layer. The LC resonance circuit takes a resonance state in which impedance becomes high in the operating frequency of the antenna. Of the plural elements, a power feeding section is provided in each of any two adjacent elements. Power is fed to the power feeding sections during transmission so that signals of the operating frequency are opposite in phase, and signals of the operating frequency inputted to the antenna are outputted in opposite phase from the power feeding sections during reception.

Abstract: A line-waveguide converter includes a backside electrode disposed on a first face of a dielectric substrate, a waveguide attached to a second face of the dielectric substrate opposite the first face and having electrical conduction to the backside electrode, and multiple electrodes disposed inside the waveguide on the second face. The electrodes are identical in shape and size, and the intervals between adjoining ones of the electrodes are identical. At least one of the electrodes can be fed with power from a line.

Abstract: High frequency power amplification modules comprise a dielectric substrate supporting a stepped impedance transition coupled to the input of a power amplifier and a symmetrically disposed stepped impedance transition connected to the output of the power amplifier. The power amplification modules are oriented in an electromagnetic energy field so that input electromagnetic energy is coupled to the input of the power amplifier by the input side stepped impedance transition, amplified by the amplifier, and emitted from the module by the output side stepped impedance transition. A plurality of the power amplification modules may be organized into an array to provide a power combiner. The power amplification modules in the array may be linked by isolation impedances that decouple the modules in the array.

Abstract: An antenna comprises a first conductive layer, a second conductive layer and an LC resonance circuit. The first conductive layer has plural elements and is disposed adjacently to each other. The second conductive layer is disposed at a predetermined distance from the first conductive layer via a dielectric substrate. The LC resonance circuit comprises connection for electrically connecting the elements and the second conductive layer. The LC resonance circuit takes a resonance state in which impedance becomes high in the operating frequency of the antenna. Of the plural elements, a power feeding section is provided in each of any two adjacent elements. Power is fed to the power feeding sections during transmission so that signals of the operating frequency are opposite in phase, and signals of the operating frequency inputted to the antenna are outputted in opposite phase from the power feeding sections during reception.

Abstract: A first metal plate for transmission and a second metal plate for transmission are closely-attached to a first surface and a second surface of a dielectric body, respectively. An outer edge of the first metal plate substantially symmetrically faces an outer edge of the second metal plate via the dielectric body. A metal plate for matching is arranged inside a hole formed on the second metal plate, with a slit formed with an inner wall of the hole, and is fixed to the dielectric body. The metal plate for matching is electrically connected to the first metal plate via a through hole penetrating the dielectric body. An IC chip is surface-mounted to connect the second metal plate with the metal plate for matching.

Abstract: A multi layered high impedance structure presents a high impedance to multiple frequency signals, with a different frequency for each layer. Each layer comprises a dielectric substrate, and an array of radiating elements such as parallel conductive strips or conductive patches on the substrate's top surface, with a conductive layer on the bottom surface of the bottommost layer. The radiating elements of succeeding layers are vertically aligned with conductive vias extending through the substrates to connect the radiating elements to the ground plane. Each layer presents as a series of parallel resonant L-C circuits to an E field at a particular signal frequency, resulting in a high impedance surface at that frequency. The new structure can be used as the substrate for a microstrip patch antenna to provide an optimal electrical distance between the resonator and backplane at multiple frequencies.

Abstract: A multi layered high impedance structure presents a high impedance to multiple frequency signals, with a different frequency for each layer. Each layer comprises a dielectric substrate, and an array of radiating elements such as parallel conductive strips or conductive patches on the substrate's top surface, with a conductive layer on the bottom surface of the bottommost layer. The radiating elements of succeeding layers are vertically aligned with conductive vias extending through the substrates to connect the radiating elements to the ground plane. Each layer presents as a series of parallel resonant L-C circuits to an E field at a particular signal frequency, resulting in a high impedance surface at that frequency. The new structure can be used as the substrate for a microstrip patch antenna to provide an optimal electrical distance between the resonator and backplane at multiple frequencies.

Abstract: A multi layered high impedance structure presents a high impedance to multiple frequency signals, with a different frequency for each layer. Each layer comprises a dielectric substrate, and an array of radiating elements such as parallel conductive strips or conductive patches on the substrate's top surface with a conductive layer on the bottom surface of the bottommost layer. The radiating elements of succeeding layers are vertically aligned with conductive vias extending through the substrates to connect the radiating elements to the ground plane. Each layer presents as a series of parallel resonant L-C circuits to an E field at a particular signal frequency, resulting in a high impedance surface at that frequency. The new structure can be used as the substrate for a microstrip patch antenna to provide an optimal electrical distance between the resonator and backplane at multiple frequencies.

Abstract: An improved waveguide wall structure and improved waveguide using the new wall structure as the interior walls of the waveguide. The wall structure comprises a sheet of dielectric material, a series of parallel conductive strips on one side of the dielectric material and a layer of conductive material on the other side. Multiple conductive vias are also included through the dielectric material and between the conductive layer and conductive strips. The new wall structure presents as a series of parallel L-C circuits to a transverse E field at resonant frequency, resulting in a high impedance surface. The wall structure can be used in waveguides that transmit a signal in one polarization or signals that are cross polarized. The new waveguide maintains a near uniform density E field and H field component, resulting in near uniform signal power density across the waveguide cross section.