Patents by Inventor Motoaki Tamaya
Motoaki Tamaya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10707643Abstract: The purpose of the present invention is to provide a laser light source module that is capable of heat dissipation from a laser device and of suppressing the diffusion of a light beam due to the close arrangement of the laser device. The laser light source module comprises a stem that is a base plate and first and second laser assemblies disposed on the stem. Each of the laser assemblies comprises a multi-emitter LD bar that is a laser device emitting a laser light along an optical axis, and a holding member having a mounting surface parallel to the axis, the multi-emitter LD bar being mounted on the mounting surface. The first and second laser assemblies are positioned such that the optical axes of the assemblies are parallel to each other and that the mounting surfaces of the assemblies are arranged opposite to each other in parallel.Type: GrantFiled: April 4, 2019Date of Patent: July 7, 2020Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Daisuke Morita, Kazutaka Ikeda, Motoaki Tamaya
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Publication number: 20190229491Abstract: The purpose of the present invention is to provide a laser light source module that is capable of heat dissipation from a laser device and of suppressing the diffusion of a light beam due to the close arrangement of the laser device. The laser light source module comprises a stem that is a base plate and first and second laser assemblies disposed on the stem. Each of the laser assemblies comprises a multi-emitter LD bar that is a laser device emitting a laser light along an optical axis, and a holding member having a mounting surface parallel to the axis, the multi-emitter LD bar being mounted on the mounting surface. The first and second laser assemblies are positioned such that the optical axes of the assemblies are parallel to each other and that the mounting surfaces of the assemblies are arranged opposite to each other in parallel.Type: ApplicationFiled: April 4, 2019Publication date: July 25, 2019Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Daisuke MORITA, Kazutaka IKEDA, Motoaki TAMAYA
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Patent number: 10297975Abstract: The purpose of the present invention is to provide a laser light source module that is capable of heat dissipation from a laser device and of suppressing the diffusion of a light beam due to the close arrangement of the laser device. The laser light source module comprises a stem that is a base plate and first and second laser assemblies disposed on the stem. Each of the laser assemblies comprises a multi-emitter LD bar that is a laser device emitting a laser light along an optical axis, and a holding member having a mounting surface parallel to the axis, the multi-emitter LD bar being mounted on the mounting surface. The first and second laser assemblies are positioned such that the optical axes of the assemblies are parallel to each other and that the mounting surfaces of the assemblies are arranged opposite to each other in parallel.Type: GrantFiled: October 27, 2015Date of Patent: May 21, 2019Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Daisuke Morita, Kazutaka Ikeda, Motoaki Tamaya
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Patent number: 10281634Abstract: A light source apparatus includes a plurality of light source modules each including at least one light source unit, light guide lines connected respectively to the light source units, and a casing accommodating the plurality of light source modules and the plurality of light guide lines. The light guide lines are led from the light source units so as not to intervene in the plurality of light source modules when viewed in a direction perpendicular to an array direction of the plurality of light source modules. The plurality of light source modules are separately attachable and detachable in the direction perpendicular to the array direction of the plurality of light source modules.Type: GrantFiled: May 6, 2013Date of Patent: May 7, 2019Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Mitoru Yabe, Yukio Sato, Takumi Kijima, Motoaki Tamaya
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Patent number: 10277011Abstract: Provided is a laser light source device which has a plurality of semiconductor laser elements arranged in an array and is provided with: a heat sink; a sub-mount substrate which is placed on one end edge of the heat sink, which has a power feed path, and on which the semiconductor laser array is mounted; an insulation plate placed in an area other than the sub-mount substrate on the heat sink; a first electrode plate mounted on the insulation plate; a second electrode plate mounted on the insulation plate separately from the first electrode plate; metal wires electrically connecting respectively between the first electrode plate and the sub-mount substrate and between the second electrode plate and the semiconductor laser array; and a cooling block on which the heat sink is mounted and which has a cooling water flow channel inside of the cooling block.Type: GrantFiled: October 16, 2015Date of Patent: April 30, 2019Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Kazutaka Ikeda, Daisuke Morita, Motoaki Tamaya
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Publication number: 20190044303Abstract: A semiconductor laser light source device wherein a plate-shaped semiconductor laser array has a first electrode and a second electrode, the first electrode is bonded to an electrode layer of a sub-mount substrate in which the electrode layer is formed on one surface of a substrate formed of electrical insulation material and the sub-mount substrate surface which is a surface opposite to a surface on which the electrode layer is formed is bonded to a heat sink made of metal, and in a region which is formed by projecting the sub-mount substrate to inside of the heat sink from the Y direction, a cooling part wherein a plurality of flat flow channels having a width of 200 ?m to 600 ?m, a depth of 3 mm to 5 mm are aligned at a pitch equal to or less than 1 mm is formed.Type: ApplicationFiled: February 14, 2017Publication date: February 7, 2019Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Daisuke MORITA, Motoaki TAMAYA, Kazutaka IKEDA, Yumi GENDA
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Publication number: 20180278012Abstract: The purpose of the present invention is to provide a laser light source module that is capable of heat dissipation from a laser device and of suppressing the diffusion of a light beam due to the close arrangement of the laser device. The laser light source module comprises a stem that is a base plate and first and second laser assemblies disposed on the stem. Each of the laser assemblies comprises a multi-emitter LD bar that is a laser device emitting a laser light along an optical axis, and a holding member having a mounting surface parallel to the axis, the multi-emitter LD bar being mounted on the mounting surface. The first and second laser assemblies are positioned such that the optical axes of the assemblies are parallel to each other and that the mounting surfaces of the assemblies are arranged opposite to each other in parallel.Type: ApplicationFiled: October 27, 2015Publication date: September 27, 2018Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Daisuke MORITA, Kazutaka IKEDA, Motoaki TAMAYA
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Publication number: 20180226772Abstract: Provided is a laser light source device which has a plurality of semiconductor laser elements arranged in an array and is provided with: a heat sink; a sub-mount substrate which is placed on one end edge of the heat sink, which has a power feed path, and on which the semiconductor laser array is mounted; an insulation plate placed in an area other than the sub-mount substrate on the heat sink; a first electrode plate mounted on the insulation plate; a second electrode plate mounted on the insulation plate separately from the first electrode plate; metal wires electrically connecting respectively between the first electrode plate and the sub-mount substrate and between the second electrode plate and the semiconductor laser array; and a cooling block on which the heat sink is mounted and which has a cooling water flow channel inside of the cooling block.Type: ApplicationFiled: October 16, 2015Publication date: August 9, 2018Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Kazutaka IKEDA, Daisuke MORITA, Motoaki TAMAYA
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Patent number: 9008146Abstract: A semiconductor laser excitation solid-state laser comprises: a planar waveguide-type solid-state laser element which is disposed on a solid-state laser substrate; an LD array; and a sub-mount substrate on which joining layers of two different thicknesses are formed on the same plane; wherein the planar waveguide-type solid-state laser element is joined to the sub-mount substrate on the surface on the opposite side of a surface on which the solid-state laser substrate is mounted, via a joining layer of one of the thicknesses out of the joining layers of the two different thicknesses, and the LD array is joined to the sub-mount substrate on the surface on a light-emitting layer side, via another joining layer of the other thickness out of the joining layers of the two different thicknesses.Type: GrantFiled: November 16, 2011Date of Patent: April 14, 2015Assignee: Mitsubishi Electric CorporationInventors: Motoaki Tamaya, Akira Yokoyama
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Publication number: 20140233598Abstract: A semiconductor laser excitation solid-state laser comprises: a planar waveguide-type solid-state laser element which is disposed on a solid-state laser substrate; an LD array; and a sub-mount substrate on which joining layers of two different thicknesses are formed on the same plane; wherein the planar waveguide-type solid-state laser element is joined to the sub-mount substrate on the surface on the opposite side of a surface on which the solid-state laser substrate is mounted, via a joining layer of one of the thicknesses out of the joining layers of the two different thicknesses, and the LD array is joined to the sub-mount substrate on the surface on a light-emitting layer side, via another joining layer of the other thickness out of the joining layers of the two different thicknesses.Type: ApplicationFiled: November 16, 2011Publication date: August 21, 2014Applicant: Mitsubishi Electric CorporationInventors: Motoaki Tamaya, Akira Yokoyama
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Publication number: 20130335993Abstract: A light source apparatus includes a plurality of light source modules each including at least one light source unit, light guide lines connected respectively to the light source units, and a casing accommodating the plurality of light source modules and the plurality of light guide lines. The light guide lines are led from the light source units so as not to intervene in the plurality of light source modules when viewed in a direction perpendicular to an array direction of the plurality of light source modules. The plurality of light source modules are separately attachable and detachable in the direction perpendicular to the array direction of the plurality of light source modules.Type: ApplicationFiled: May 6, 2013Publication date: December 19, 2013Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Mitoru YABE, Yukio SATO, Takumi KIJIMA, Motoaki TAMAYA
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Publication number: 20130279170Abstract: A laser light source module includes a laser light source outputting laser light, a wavelength conversion element converting a wavelength of the laser light, a temperature sensor mounted on a first face of the wavelength conversion element, a heater substrate of a ceramic base material, on which the wavelength conversion element is mounted. A heater is provided on the heater substrate, in which a sub-mount substrate on which the laser light source is mounted and the heater substrate are fixed to a heat sink, and the heat sink includes a concavity at a position corresponding to a projection region of the wavelength conversion element opposite to the substrate, whereby the entire wavelength conversion element is kept at the most suitable operation temperature, and laser light can be wavelength-converted in higher efficiency.Type: ApplicationFiled: January 17, 2011Publication date: October 24, 2013Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Akira Yokoyama, Motoaki Tamaya, Takayuki Yanagisawa
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Patent number: 8553738Abstract: In a laser light source device having an optical element and a plurality of heat sinks on which the optical element is joined directly or through a sub mount, and obtained by joining the heat sinks to each other by means of a joining material such that optical elements are optically directly joined to each other, the laser light source device includes a groove portion extending in a direction substantially orthogonal to an optical axis of light in the laser light source device on any one of a joining surface of the optical element or the sub mount to join with the heat sink and a joining surface of the heat sink to join with the optical element or the sub mount.Type: GrantFiled: December 28, 2007Date of Patent: October 8, 2013Assignee: Mitsubishi Electric CorporationInventors: Shinichi Oe, Motoaki Tamaya, Akira Nakamura, Keiichi Fukuda
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Patent number: 8419493Abstract: An apparatus for manufacturing a light source and a method therefor are provided that enables a high efficient light source to be manufactured even when an optical element whose characteristic significantly varies is used. After maintaining temperatures of a laser device and a wavelength conversion element at a temperature where an output of light emitted from each of the device and the element is equal to or greater than a predetermined rate of the maximum output, the laser device and the wavelength conversion element whose temperatures have been maintained are joined together so that the output of the light emitted from the wavelength conversion element is equal to or greater than a predetermined value.Type: GrantFiled: April 6, 2012Date of Patent: April 16, 2013Assignee: Mitsubishi Electric CorporationInventors: Shinichi Oe, Kazutaka Ikeda, Akira Nakamura, Motoaki Tamaya
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Patent number: 8391326Abstract: To obtain a laser light source module, a copper-based material is press-fitted into a through hole formed in a stem made of an iron-based material, thereby forming a first heat sink. A mount made of a copper-based material is fixed to the first heat sink and at least one semiconductor laser device is mounted on the mount. A second heat sink is bonded to lower surfaces of the stem and the first heat sink by a thermal conductive adhesive. An upper surface of the first heat sink is located on a same plane as that of the stem, and a lower surface of the first heat sink is located higher than that of the stem.Type: GrantFiled: March 18, 2008Date of Patent: March 5, 2013Assignee: Mitsubishi Electric CorporationInventors: Motoaki Tamaya, Kenji Okuda, Chise Nanba, Akira Nakamura, Junichi Aizawa
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Patent number: 8292686Abstract: An apparatus for manufacturing a light source and a method therefor are provided that enables a high efficient light source to be manufactured even when an optical element whose characteristic significantly varies is used. After maintaining temperatures of a laser device and a wavelength conversion element at a temperature where an output of light emitted from each of the device and the element is equal to or greater than a predetermined rate of the maximum output, the laser device and the wavelength conversion element whose temperatures have been maintained are joined together so that the output of the light emitted from the wavelength conversion element is equal to or greater than a predetermined value.Type: GrantFiled: August 6, 2010Date of Patent: October 23, 2012Assignee: Mitsubishi Electric CorporationInventors: Shinichi Oe, Kazutaka Ikeda, Akira Nakamura, Motoaki Tamaya
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Publication number: 20120263200Abstract: A laser module includes: a heat sink that releases heat from a member in contact with the heat sink; a sub-mount substrate that is disposed on the heat sink and made of an insulating material; a feeding layer that is disposed on the sub-mount substrate; and a laser diode array that has plural light-emitting portions disposed on the feeding layer in a parallel arrangement. A linear expansion coefficient of the sub-mount substrate is made smaller than a linear expansion coefficient of the laser diode array, and the linear expansion coefficient of the sub-mount substrate in a state connected to the heat sink having a larger linear expansion coefficient than the laser diode array is set to fall within a predetermined range including the linear expansion coefficient of the laser diode array.Type: ApplicationFiled: December 16, 2010Publication date: October 18, 2012Applicant: Mitsubishi Electric CorporationInventors: Motoaki Tamaya, Chise Nanba, Takayuki Yanagisawa, Shinichi Oe, Shuhei Yamamoto, Akira Yokoyama
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Patent number: 8284806Abstract: Because a reflector that reflects a fundamental wave generated from a solid-state laser element and forms an optical resonator is disposed on an exit surface of a wavelength conversion element, the fundamental wave cannot be resonated and amplified in a stage before the wavelength conversion element is joined to the solid-state laser element. As a result, a problem is created in that the solid-state laser element emits low level light output, so that a relative position of the semiconductor laser and the solid-state laser element cannot properly be adjusted. In order to overcome the above problem, even in the stage before joining the wavelength conversion element to the solid-state laser element, the invention enables the semiconductor laser and the solid-state laser element to be joined by properly adjusting the relative position of the laser and the laser element.Type: GrantFiled: August 6, 2010Date of Patent: October 9, 2012Assignee: Mitsubishi Electric CorporationInventors: Kazutaka Ikeda, Shinichi Oe, Akira Nakamura, Motoaki Tamaya
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Patent number: 8265111Abstract: When a laser light source module includes a heat sink in which a solid laser element, an excitation light source, and a wavelength conversion element are arranged and a stem that supports the heat sink, wherein the heat sink is separated into three blocks, namely a first block including a laser oscillating unit for the solid laser element is arranged, a second block including a semiconductor laser element that emits excitation light for the laser oscillating unit and a first temperature sensor are arranged and on a specific surface of which the first heater is arranged, and a third block including the wavelength conversion element that converts the wavelength of the fundamental laser beam and a second temperature sensor are arranged and on a specific surface of which a second heater is arranged, enabling thus downsizing of the module and improvement of the positioning accuracy of the elements.Type: GrantFiled: March 18, 2008Date of Patent: September 11, 2012Assignee: Mitsubishi Electric CorporationInventors: Motoaki Tamaya, Chise Nanba, Akira Nakamura, Keiichi Fukuda, Koji Funaoka, Manabu Kawakami, Masamitsu Okamura
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Publication number: 20120192403Abstract: An apparatus for manufacturing a light source and a method therefor are provided that enables a high efficient light source to be manufactured even when an optical element whose characteristic significantly varies is used. After maintaining temperatures of a laser device and a wavelength conversion element at a temperature where an output of light emitted from each of the device and the element is equal to or greater than a predetermined rate of the maximum output, the laser device and the wavelength conversion element whose temperatures have been maintained are joined together so that the output of the light emitted from the wavelength conversion element is equal to or greater than a predetermined value.Type: ApplicationFiled: April 6, 2012Publication date: August 2, 2012Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Shinichi OE, Kazutaka Ikeda, Akira Nakamura, Motoaki Tamaya