Abstract: A heat sink is made of a material excellent in thermal conductivity and is mounted on a stem; a sub-mount substrate is made of a material excellent in insulation property and is mounted on the heat sink; a first lead frame made of a material excellent in electric conductivity and thermal conductivity and having a linear expansion coefficient similar to that of a semiconductor laser array, is mounted on the sub-mount substrate, having the semiconductor laser array mounted thereon, and composing a power feeding path of the semiconductor laser array; a second lead frame made of a material excellent in electric conductivity and thermal conductivity, is arranged on the sub-mount substrate side by side with the first lead frame, and composing the power feeding path of the semiconductor laser array; and a wire electrically bonds the semiconductor laser array and the second lead frame.

Abstract: A semiconductor laser module includes: a semiconductor laser element which emits light; a package base having a through hole; a lead pin which passes through the through hole and supplies the current to the semiconductor laser element; a glass material which seals the through hole through which the lead pin passes; and a cap which has a window from which light emitted by the semiconductor laser element is taken out and has the semiconductor laser element in the inside thereof, the cap being joined in air sealing relation to the package base. The lead pin is an iron-nickel alloys in which the coefficient of linear expansion is not higher than a predetermined ratio in difference with the glass material, the saturation magneto-striction constant is not higher than a predetermined value, and volume resistivity is not higher than a predetermined rate.

Abstract: In a wavelength conversion element in which a periodic poled crystal that converts an input laser light into a laser light of a predetermined wavelength is provided on a thick-film resistance substrate including a heating unit, a heat spreader having a predetermined thermal conductivity, which equalizes a temperature distribution of the periodic poled crystal, is provided between the thick-film resistance substrate and the periodic poled crystal, and the thick-film resistance substrate and the heat spreader, and the heat spreader and the periodic poled crystal are adhered by an adhesive member having a predetermined thermal conductivity.

Abstract: Because a reflector that reflects a fundamental wave generated from a solid-state laser element and forms an optical resonator is disposed on an exit surface of a wavelength conversion element, the fundamental wave cannot be resonated and amplified in a stage before the wavelength conversion element is joined to the solid-state laser element. As a result, a problem is created in that the solid-state laser element emits low level light output, so that a relative position of the semiconductor laser and the solid-state laser element cannot properly be adjusted. In order to overcome the above problem, even in the stage before joining the wavelength conversion element to the solid-state laser element, the invention enables the semiconductor laser and the solid-state laser element to be joined by properly adjusting the relative position of the laser and the laser element.

Abstract: An apparatus for manufacturing a light source and a method therefor are provided that enables a high efficient light source to be manufactured even when an optical element whose characteristic significantly varies is used. After maintaining temperatures of a laser device and a wavelength conversion element at a temperature where an output of light emitted from each of the device and the element is equal to or greater than a predetermined rate of the maximum output, the laser device and the wavelength conversion element whose temperatures have been maintained are joined together so that the output of the light emitted from the wavelength conversion element is equal to or greater than a predetermined value.

Abstract: When a laser light source module includes a heat sink in which a solid laser element, an excitation light source, and a wavelength conversion element are arranged and a stem that supports the heat sink, wherein the heat sink is separated into three blocks, namely a first block including a laser oscillating unit for the solid laser element is arranged, a second block including a semiconductor laser element that emits excitation light for the laser oscillating unit and a first temperature sensor are arranged and on a specific surface of which the first heater is arranged, and a third block including the wavelength conversion element that converts the wavelength of the fundamental laser beam and a second temperature sensor are arranged and on a specific surface of which a second heater is arranged, enabling thus downsizing of the module and improvement of the positioning accuracy of the elements.

Abstract: A first optical base having a high-reflection mirror and a second optical base having a partial-reflection mirror are arranged in parallel to each other on both sides of an oscillator housing. A guide light source emits a guide light for aligning optical components in an optical path of a laser light emitted from an optical resonator and adjusting a processing point on a target object. An optical-component supporting unit includes optical components that guide the laser light in a direction perpendicular to an optical axis of the optical resonator. The guide light source is arranged on the second optical base.

Abstract: To constitute an optical module in which a comb-shaped submount is fixed on a heat sink and a device having an optical functioning unit is mounted on the comb-shaped submount, a stress buffering block that relaxes a thermal stress acting between the heat sink and the comb-shaped submount is placed between the heat sink and the comb-shaped submount. With this configuration, a thermal stress acting between the comb-shaped submount and the device mounted thereon is relaxed, and as a result, long-term reliability of bonding parts between the comb-shaped submount and the device is enhanced.

Abstract: In a laser light source device having an optical element and a plurality of heat sinks on which the optical element is joined directly or through a sub mount, and obtained by joining the heat sinks to each other by means of a joining material such that optical elements are optically directly joined to each other, the laser light source device includes a groove portion extending in a direction substantially orthogonal to an optical axis of light in the laser light source device on any one of a joining surface of the optical element or the sub mount to join with the heat sink and a joining surface of the heat sink to join with the optical element or the sub mount.

Abstract: A heat sink is made of a material excellent in thermal conductivity and is mounted on a stem; a sub-mount substrate is made of a material excellent in insulation property and is mounted on the heat sink; a first lead frame made of a material excellent in electric conductivity and thermal conductivity and having a linear expansion coefficient similar to that of a semiconductor laser array, is mounted on the sub-mount substrate, having the semiconductor laser array mounted thereon, and composing a power feeding path of the semiconductor laser array; a second lead frame made of a material excellent in electric conductivity and thermal conductivity, is arranged on the sub-mount substrate side by side with the first lead frame, and composing the power feeding path of the semiconductor laser array; and a wire electrically bonds the semiconductor laser array and the second lead frame.

Abstract: A first optical base having a high-reflection mirror and a second optical base having a partial-reflection mirror are arranged in parallel to each other on both sides of an oscillator housing. A guide light source emits a guide light for aligning optical components in an optical path of a laser light emitted from an optical resonator and adjusting a processing point on a target object. An optical-component supporting unit includes optical components that guide the laser light in a direction perpendicular to an optical axis of the optical resonator. The guide light source is arranged on the second optical base.