Abstract: A method for manufacturing a circuit substrate according to the present disclosure is a method for manufacturing a circuit substrate including an insulation substrate formed with a plurality of via holes passing through a first main surface and a second main surface and a metal with which the via holes are filled, the first and second main surfaces being opposing main surfaces. The method for manufacturing a circuit substrate according to the present disclosure includes: forming, in the insulation substrate, the via hole or a non-through hole opening only on the second main surface; filling the via hole or the non-through hole with the metal; polishing the metal of at least one of the main surfaces to form a step between the metal and the insulation substrate; coating a polished surface of the metal by plating; and polishing the metal on the first main surface and the second main surface.

Abstract: An optical component according to the present disclosure includes a substrate, which contains sapphire and includes a first main face and a second main face on opposite sides from each other. The inclination of the first main face and of the second main face with respect to a c-plane of the sapphire is 15° or less, and a heat dissipating portion is provided on at least one of the first main face or the second main face.

Abstract: An optical component according to the present disclosure includes a substrate containing sapphire. The substrate is provided with a functional portion and a heat dissipating portion. An inclination of a main face of the substrate is 75° or greater with respect to a c-plane of the sapphire. The functional portion and the heat dissipating portion are provided so that an angle formed by a c-axis of the sapphire and a line segment connecting the functional portion and the heat dissipating portion is 15° or less.

Abstract: A composite substrate of the present disclosure includes a piezoelectric substrate having a first surface which is an element formation surface and a second surface which is a back surface of the first surface, a sapphire substrate having a third surface which is disposed opposing a second surface and a fourth surface which is a back surface of the third surface, a fifth surface opposing the second surface, and a sixth surface opposing the third surface. It includes an alumina layer bonding the second surface and the third surface, and an arithmetic mean roughness Ra of the third surface is 0.1 ?m or more and 0.5 ?m or less. The arithmetic mean roughness Ra of the fifth surface is 0.1 ?m or less and is smaller than the arithmetic mean roughness Ra of the third surface.

Abstract: A composite substrate of the present disclosure is a composite substrate in which a piezoelectric substrate and a sapphire substrate are directly bonded, and a bonding surface of the sapphire substrate has a step bunch structure. A piezoelectric device of the present disclosure includes the composite substrate. A method for manufacturing a composite substrate includes the steps of: preparing a piezoelectric substrate and a sapphire substrate including a surface having a predetermined off-angle to a specific crystal plane, heat treating the sapphire substrate in an oxidizing atmosphere to form a step bunch on the surface of the sapphire substrate, and bonding the piezoelectric substrate and the surface of the sapphire substrate directly.

Abstract: A composite substrate of the present disclosure is a composite substrate comprising a piezoelectric substrate and a sapphire substrate which are directly bonded, wherein the ratio of the number of oxygen atoms to the number of aluminum atoms in the bonding surface region including the bonding surface of the sapphire substrate bonded to the piezoelectric substrate is less than 1.5. The piezoelectric device of the present disclosure comprises the composite substrate. A method for manufacturing the composite substrate of the present disclosure comprises a step of preparing a piezoelectric substrate and a sapphire substrate, a step of heat-treating the sapphire substrate in a reducing atmosphere or in a vacuum, and a step of directly bonding the piezoelectric substrate to the sapphire substrate.

Abstract: The composite substrate of the present disclosure has a piezoelectric substrate having a first surface and a second surface opposing the first surface, a support substrate having a third surface in contact with the second surface and a fourth surface opposing the third surface, and a through hole penetrating from the first surface to the fourth surface. The through hole has a tapered shape having a diameter decreasing from the first surface to the fourth surface and has a stepped surface having a decreasing diameter in the support substrate. The piezoelectric device of the present disclosure comprises the composite substrate and a conductor located within the through hole.

Abstract: A SAW device includes a SAW element, a conductor connected to the SAW element, an LT substrate including the SAW element, and a case for housing the LT substrate including the SAW element. The case includes a cover part, a lateral part, and a bottom part. The bottom part is including a sapphire substrate, the LT substrate is positioned on a first surface of the sapphire substrate, the first surface serving as an inner surface of the case, and a second surface opposite to the first surface serves as an outer surface of the case. The conductor includes a via conductor provided in a through-hole continuously penetrating through the sapphire substrate and the LT substrate.

Abstract: A SAW device includes a SAW element, a conductor connected to the SAW element, an LT substrate including the SAW element, and a case for housing the LT substrate including the SAW element. The case includes a cover part, a lateral part, and a bottom part. The bottom part is including a sapphire substrate, the LT substrate is positioned on a first surface of the sapphire substrate, the first surface serving as an inner surface of the case, and a second surface opposite to the first surface serves as an outer surface of the case. The conductor includes a via conductor provided in a through-hole continuously penetrating through the sapphire substrate and the LT substrate.

Abstract: A sapphire structure with a metal substructure is disclosed. The sapphire structure with a metal substructure includes a sapphire structure and a metal substructure. The sapphire structure includes a flat surface and a concave portion on the flat surface. The metal substructure in the concave portion is bonded to an inner surface of the concave portion and includes a surface portion that is substantially flush with the flat surface.

Abstract: An electronic apparatus and a light-transmissive cover plate are disclosed. The electronic apparatus includes an image display device; and a light-transmissive cover plate that includes a first surface facing the image display surface and a second surface positioned on the opposite side of the first surface. The light-transmissive cover plate is made of a single crystal that contains alumina (Al2O3) as a main component and has a step-terrace structure in at least a portion of the second surface.

Abstract: An electronic apparatus is disclosed. The electronic apparatus includes an exterior body, a wireless communication unit, and a display device. The exterior body includes a wireless communication unit, a display device and an exterior body. The exterior body includes a light-transmissive cover plate and a case member. The light-transmissive cover plate includes: first and second surfaces opposite to each other; and a single crystal body containing alumina (Al2O3) as a main component. The case member is disposed at an opposite side to the light-transmissive cover plate with respect to the display device and includes a single crystal body containing alumina (Al2O3) as a main component. The wireless communication unit and the display device are in the exterior body. The display device includes a display surface that faces the first surface.

Abstract: An electronic apparatus and a light-transmissive cover plate are disclosed. The electronic apparatus includes an image display device; and a light-transmissive cover plate that includes a first surface facing the image display surface and a second surface positioned on the opposite side of the first surface. The light-transmissive cover plate is made of a single crystal that contains alumina (Al2O3) as a main component and has a step-terrace structure in at least a portion of the second surface.

Abstract: An electronic apparatus, a light-transmissive cover member, and an electronic device are disclosed. The electronic apparatus may include an image display device that includes an image display surface and a light-transmissive cover member. The light-transmissive cover member is arranged such that at least part of the light-transmissive cover member faces the image display surface. The light-transmissive cover member is a single crystal that contains alumina (Al2O3) as a main component. Due to the light-transmissive cover member, the transmittance of light having a wavelength of 260 nm is less than 92% of the transmittance of light having a wavelength of approximately 550 nm.

Abstract: An electronic apparatus, a light-transmissive cover member, and an electronic device are disclosed. The electronic apparatus may include an image display device that includes an image display surface and a light-transmissive cover member. The light-transmissive cover member is arranged such that at least part of the light-transmissive cover member faces the image display surface. The light-transmissive cover member is a single crystal that contains alumina (Al2O3) as a main component. Due to the light-transmissive cover member, the transmittance of light having a wavelength of 260 nm is less than 92% of the transmittance of light having a wavelength of approximately 550 nm.

Abstract: A sapphire structure with a metal substructure is disclosed. The sapphire structure with a metal substructure includes a sapphire structure and a metal substructure. The sapphire structure includes a flat surface and a concave portion on the flat surface. The metal substructure in the concave portion is bonded to an inner surface of the concave portion and includes a surface portion that is substantially flush with the flat surface.

Abstract: The present invention relates to a sapphire monocrystalline body to be used as the substrate for a semiconductor for electronic parts or component parts, and to a monocrystalline sapphire substrate. The invention also relates to a method for working the same. The invention is based cleavage along the plane R of the sapphire monocrystalline body which cleavage is easy to accomplish and provides a surface high in precision. The inventive process includes forming linear crack parallel or vertical to a reference plane of the substrate, with a microcrack line as a starting point, to develop a crack in a thickness direction of the body.

Abstract: The present invention relates to a sapphire monocrystalline body to be used as the substrate for a semiconductor for electronic parts or component parts, and to a monocrystalline sapphire substrate. The invention also relates to a method for working the same. The invention is based cleavage along the plane R of the sapphire monocrystalline body which cleavage is easy to accomplish and provides a surface high in precision. The inventive process includes forming linear crack parallel or vertical to a reference plane of the substrate, with a microcrack line as a starting point, to develop a crack in a thickness direction of the body.

Abstract: The present invention relates to a sapphire monocrystal body to be used as the substrate of the thin growth for the semiconductor or the like as electronic parts or component parts, and to a monocrystal sapphire substrate. The invention also relates to a method for working the same. The invention utilizes that the cleavage plane of the plane R of the sapphire monocrystal body has a smooth plane high in surface precision and is easier to cleave. For an easier dividing operation, by cleaving, of the substrate after the formation of the element such as semiconductor element, functional element, the reference plane substantially parallel or vertical to the plane R is provided on the periphery of the substrate, so as to make an index for controlling the plane R in the cleavage division. A method applies forming linear crack parallel or vertical to the reference plane of the substrate, having microcrack line as a starting point to develop the crack in the thickness direction.

Abstract: The present invention provides a liquid crystal display device, which includes a liquid crystal panel as one of optical components for transmitting, absorbing or reflecting light. At least any one of the optical components is comprised of a sapphire substrate. The optical components further include a lens, and a polarizer having a polarizer film and a retaining plate for retaining the polarizer film, and the liquid crystal panel may include a transparent substrate. In this case, any one of the lens, the retaining plate and transparent substrates is comprised of a sapphire substrate, and thus, it is possible to provide a transmission type liquid crystal display device which transmits light from the light source through the lens, the polarizer and the liquid crystal panel so that light is projected.