Abstract: A film deposition device (1A) of a metal film (F) includes a positive electrode (11), a solid electrolyte membrane (13), and a power supply part (14) that applies a voltage between the positive electrode (11) and a base material (B) to be a negative electrode. The solid electrolyte membrane (13) allows a water content to be 15% by mass or more and is capable of containing a metal ion. The power supply part (14) applies a voltage between the positive electrode and the base material in a state where the solid electrolyte membrane is disposed on a surface of the positive electrode such that metal made of metal ions contained inside the solid electrolyte membrane (13) is precipitated on a surface of the base material (B).

Abstract: A metal-film forming apparatus includes: an anode; a resin substrate having a surface on which a conductor pattern layer that serves as a cathode is formed; a solid electrolyte membrane that contains metal ions and is between the anode and the resin substrate, the solid electrolyte membrane contacting a surface of the conductor pattern layer when a metal film is formed; a power supply; and a conductive member that is arranged contacting the conductor pattern layer when the metal film is formed, such that a negative electrode of the power supply is electrically connected to the conductor pattern layer, the conductive member being detachable from the conductor pattern layer, wherein the metal ions are reduced to deposit metal that forms the metal film on the surface of the conductor pattern layer when the voltage is applied.

Abstract: Provided is a metal coating film formation device capable of forming a film using a simple device configuration and in a short time, and capable of performing the formation of a film of metal coating continuously for a long period. A film formation device 1A is provided with an anode 11, a solid electrolyte film 13 disposed between the anode 11 and the base material B, and a power supply unit 16 that applies a voltage between the anode 11 and the base material B. The anode 11 is a non-porous anode comprising the same metal as the metal of the metal coating. Between the anode 11 and the solid electrolyte film 13, a porous material 14 is disposed in contact with the anode 11 and the solid electrolyte film 13. The porous material 14 includes a plurality of pores providing communication between the anode 11 and the solid electrolyte film 13 and being supplied with a metal solution L.

Abstract: A surface treatment method includes: roughening a surface region of a substrate corresponding to a through hole provided to a masking plate by supplying a solvent to a solid electrolyte film from a second surface of a masking plate through the through hole, in a state where: a first surface of the solid electrolyte film is arranged directly on the surface of the substrate; and a first surface of the masking plate is arranged directly on a second surface of the solid electrolyte film, wherein the supplied solvent penetrates the solid electrolyte film, and dissolves the surface of the substrate.

Abstract: A method of manufacturing a semiconductor device includes: arranging a solder material containing at least tin, between a semiconductor element and a joined member provided with a nickel layer and a copper layer, such that the solder material is in contact with the copper layer, the nickel layer being provided on a surface of the joined member, and the copper layer being provided on at least a portion of a surface of the nickel layer; and melting and solidifying the solder material to form Cu6Sn5 on the surface of the nickel layer using tin of the solder material and the copper layer.

Abstract: A film formation system for continuously forming metal films with desired thickness on the surfaces of substrates, and increase the film forming speed while suppressing abnormality of the metal films. A film formation system includes an anode; a solid electrolyte membrane between the anode and a substrate serving as a cathode such that a metal ion solution is disposed on the anode side thereof; and a power supply portion for applying a voltage across the anode and the substrate. A voltage is applied across the anode and the substrate o deposit metal out of the metal ions contained in the solid electrolyte membrane onto the substrate surface, thereby forming a metal film made of the metal ions. The anode has a base material, which is insoluble in the metal ion solution, and a metal plating film made of the same metal as the metal film, formed over the base material.

Abstract: Provided is a manufacturing method of a rare-earth magnet with high coercive force, including a first step of pressing-forming powder as a rare-earth magnet material to form a compact S, the powder including a RE-Fe—B main phase MP (RE: at least one type of Nd and Pr) and a RE-X alloy (X: metal element) grain boundary phase surrounding the main phase; and second step of bringing a modifier alloy M into contact with the compact S or a rare-earth magnet precursor C obtained by hot deformation processing of the compact S, followed by heat treatment to penetrant diffuse melt of the modifier alloy M into the compact S or the rare-earth magnet precursor C to manufacture the rare-earth magnet RM, the modifier alloy including a RE-Y (Y: metal element and not including a heavy rare-earth element) alloy having a eutectic or a RE-rich hyper-eutectic composition.

Abstract: A film-forming metal solution for supplying metal ions to a solid electrolyte membrane in film formation is provided. In the film formation, the solid electrolyte membrane is disposed between an anode and a substrate as a cathode, and the solid electrolyte membrane is brought into contact with the substrate and a voltage is placed between the anode and the substrate to precipitate a metal on a surface of the substrate from the metal ions contained in the solid electrolyte membrane, so that a metal film of the metal is formed on the surface of the substrate. The film-forming metal solution contains a solvent, and the metal dissolved in the solvent in an ionic state. A hydrogen ion concentration of the film-forming metal solution is within a range of 0 to 10?7.85 mol/L at 25° C.

Abstract: Provided is a manufacturing method of a rare-earth magnet with high coercive force, including a first step of pressing-forming powder as a rare-earth magnet material to form a compact S, the powder including a RE-Fe—B main phase MP (RE: at least one type of Nd and Pr) and a RE-X alloy (X: metal element) grain boundary phase surrounding the main phase; and second step of bringing a modifier alloy M into contact with the compact S or a rare-earth magnet precursor C obtained by hot deformation processing of the compact S, followed by heat treatment to penetrant diffuse melt of the modifier alloy M into the compact S or the rare-earth magnet precursor C to manufacture the rare-earth magnet RM, the modifier alloy including a RE-Y (Y: metal element and not including a heavy rare-earth element) alloy having a eutectic or a RE-rich hyper-eutectic composition.

Abstract: An electroplating cell includes: an anode chamber in which an anode chamber solution is stored; and a separator that separates the anode chamber and a cathode. The electroplating cell undergoes a modification treatment of introducing a carboxylic acid group or a derivative thereof into a base material of the separator. The separator selectively allows permeation of metal ions contained in the anode chamber solution.

Abstract: An electroplating cell includes: (i) an anode chamber in which an anode chamber solution is stored; and (ii) a separator that includes a base material and an organic plating additive contained in the base material, separates the anode chamber and a cathode from each other, and selectively allows permeation of metal ions contained in the anode chamber solution.

Abstract: Provided are a film formation device and a film formation method for forming a metal film, with which metal films with a desired thickness can be continuously formed on surfaces of a plurality of substrates. A film formation device 1A includes at least a positive electrode 11, a negative electrode 12, a solid electrolyte membrane 13 arranged on a surface of the positive electrode 12, between. the positive electrode and a substrate to serve as the negative electrode, and a power supply unit E adapted to apply a voltage across the positive electrode 11 and the substrate B. A voltage is applied across the positive electrode 11 and the substrate B to deposit metal on a surface of the substrate from metal ions contained in the solid electrolyte membrane 13, whereby a metal film F made of metal is formed, The positive electrode 11 is made of a porous body that allows a solution L containing metal ions to pass therethrough and supplies the metal ions to the solid electrolyte membrane 13.

Abstract: A process for producing a rare earth magnet comprises: an adhesion step of causing a diffusion element capable of diffusing inwardly to adhere to the surface part of a magnet material comprising a compact or sintered body of rare earth alloy particles; and an evaporation step of heating the magnet material in vacuum to evaporate at least a portion of the diffusion element having been retained on or in the surface part of the magnet material.

Abstract: A method of manufacturing rare-earth magnets includes, a first step of producing a compact C by subjecting a sintered body S, which is formed of a RE—Fe—B main phase MP having a nanocrystalline structure (where RE is at least one of neodymium and praseodymium) and a grain boundary phase BP of an RE—X alloy (where X is a metal element) located around the main phase, to hot plastic processing that imparts anisotropy; and a second step of producing a rare-earth magnet RM by melting a RE—Y—Z alloy which increases the coercive force of the compact C (where Y is a transition metal element, and Z is a heavy rare-earth element), together with the grain boundary phase BP, and liquid-phase infiltrating the RE—Y—Z alloy melt from a surface of the compact C.

Abstract: Provided is a rare-earth magnet containing no heavy rare-earth metals such as Dy or Tb in a grain boundary phase, has a modifying alloy for increasing coercivity (in particular, coercivity under a high-temperature atmosphere) infiltrated thereinto at lower temperature than in the conventional rare-earth magnets, has high coercivity, and has relatively high magnetizability, and a production method therefor. The rare-earth magnet RM includes a RE-Fe—B-based main phase MP with a nanocrystalline structure (where RE is at least one of Nd or Pr) and a grain boundary phase BP around the main phase, the grain boundary phase containing a RE-X alloy (where X is a metallic element other than heavy rare-earth elements). Crystal grains of the main phase MP are oriented along the anisotropy axis, and each crystal grain of the main phase, when viewed from a direction perpendicular to the anisotropy axis, has a plane that is quadrilateral in shape or has a close shape thereto.

Abstract: A process for producing a rare earth magnet comprises: an adhesion step of causing a diffusion element capable of diffusing inwardly to adhere to the surface part of a magnet material comprising a compact or sintered body of rare earth alloy particles; and an evaporation step of heating the magnet material in vacuum to evaporate at least a portion of the diffusion element having been retained on or in the surface part of the magnet material.

Abstract: A rare earth magnet production method of the present invention includes a placing step of placing a magnet material including a compact or a sintered body of powder particles having a rare earth magnet alloy, and a diffusing material containing a diffusing element to improve coercivity, in a vicinity of each other; and a diffusing step of diffusing the diffusing element into an inside of the magnet material by exposing the magnet material heated to vapor of the diffusing element evaporated from the diffusing material heated; and wherein the diffusing step is a step of heating the diffusing material independently of the magnet material to diffusing material temperature which is different from heating temperature of the magnet material called magnet material temperature.

Abstract: Provided is a manufacturing method of a rare-earth magnet capable of penetrant-diffusing a modifier alloy to increase a coercive force (especially a coercive force under a high-temperature atmosphere) at a temperature lower than the conventional method for manufacturing a rare-earth magnet without using heavy rare-earth metals such as Dy and Tb, and accordingly capable of manufacturing a high coercivity rare-earth magnet at the lowest cost possible.

Abstract: A resin material is brought into contact with a first solution containing ozone, and at the same time, ultraviolet rays are irradiated. The activation due to the treatment with ozone water and the activation due to the treatment with ultraviolet rays are synergistically operated to enable the formation of a plated coating having excellent adhesive strength by a short treatment. In addition, even by a long treatment, the adhesive strength can be restrained from lowering. Consequently, a plated coating having excellent adhesion can be formed without roughening the surface of the resin material by a short pretreatment.

Abstract: A resin-metal composite layer is formed by modifying a surface of a resin substrate to a modified layer, contacting the modified layer with a metal compound solution, and adsorbing at least either metal colloids or ions are adsorbed to the polar group, so that metal particles are dispersed into the modified layer. Because of the fineness of the metal particles in the resin-metal composite layer, high transparent can be achieved. The resin-metal composite layer functions as a transparent conductive layer and the like.