Patents by Inventor Motoshi Ono

Motoshi Ono has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11179809
    Abstract: A manufacturing method of a glass substrate having holes includes irradiating a plurality of hole formation target positions of a dummy glass substrate with a laser under a first condition, to form a plurality of holes in the dummy glass substrate; heating the dummy glass substrate under a second condition; measuring, for each of the hole formation target positions, a deviation between the hole formation target position and a position of the hole after the heating formed by irradiating the hole formation target position of the dummy glass substrate; irradiating irradiation target positions of a glass substrate, having substantially same shape, dimension and composition as the dummy glass substrate, with a laser under the first condition, to form a plurality of holes, the irradiation target positions of the glass substrate with the laser being determined taking into account the deviation; and heating the glass substrate under the second condition.
    Type: Grant
    Filed: April 4, 2019
    Date of Patent: November 23, 2021
    Assignee: AGC INC.
    Inventor: Motoshi Ono
  • Patent number: 11123822
    Abstract: A manufacturing method for a glass substrate having a hole with a depth of d (?m) or more includes irradiating the glass substrate with a laser beam emitted from a CO2 laser oscillator for an irradiation time t (?sec), to form a hole in the glass substrate. The laser beam is delivered to the glass substrate after being condensed at a focusing lens. A power density Pd (W/cm2), defined by Pd=P0/S where P0 and S are a power and a beam cross-sectional area of the laser beam just prior to entering the focusing lens, respectively, is 600 W/cm2 or less. The irradiation time t (?sec) satisfies t?10×d/(Pd)1/2.
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: September 21, 2021
    Assignee: AGC Inc.
    Inventor: Motoshi Ono
  • Patent number: 10584053
    Abstract: A manufacturing method of a glass substrate with a hole having a diameter ?f, and with a thickness ?f includes setting a thickness ?1 of a glass plate that is to be processed; preparing a glass plate with the thickness ?1, having first and second surfaces opposite to each other; forming one initial characteristic object or two or more initial characteristic objects in the glass plate by irradiating the glass plate with a laser from a side of the first surface of the glass plate, the initial characteristic object having a size of a diameter ?1 on the first surface; and performing wet etching for the glass plate having the initial characteristic object, so that from the initial characteristic object a hole having the diameter ?f on the first surface is formed, and a thickness of the glass plate is adjusted from ?1 to a target value of ?f.
    Type: Grant
    Filed: August 2, 2017
    Date of Patent: March 10, 2020
    Assignee: AGC Inc.
    Inventor: Motoshi Ono
  • Patent number: 10531566
    Abstract: A glass substrate includes a first surface and a second surface that are opposite to each other. Multiple through holes pierce through the glass substrate from the first surface to the second surface. Each of five through holes randomly selected from the multiple through holes includes a first opening at the first surface and a second opening at the second surface. The approximate circle of the first opening has a diameter greater than a diameter of the approximate circle of the second opening. The first opening has a roundness of 5 ?m or less. Perpendicularity expressed by P=tc/t0 ranges from 1.00000 to 1.00015, where P is the perpendicularity, tc is the distance between the center of the approximate circle of the first opening and the center of the approximate circle of the second opening, and t0 is the thickness of the glass substrate.
    Type: Grant
    Filed: July 9, 2018
    Date of Patent: January 7, 2020
    Assignee: AGC Inc.
    Inventors: Mamoru Isobe, Motoshi Ono, Shigetoshi Mori, Kohei Horiuchi
  • Publication number: 20190359515
    Abstract: Disclosed is a method of forming a hole in a glass substrate by using a pulsed laser, the method including (1) preparing the glass substrate including a first surface and a second surface that face each other; (2) forming a concave portion on the first surface by irradiating, with a first condition, the pulsed laser onto the first surface of the glass substrate through a lens; and (3) forming the hole by irradiating the pulsed laser onto the concave portion with a second condition such that energy density of the pulsed laser is less than or equal to a processing threshold value of the glass substrate.
    Type: Application
    Filed: August 6, 2019
    Publication date: November 28, 2019
    Applicant: AGC Inc.
    Inventors: Kohei HORIUCHI, Motoshi ONO
  • Patent number: 10442720
    Abstract: Disclosed is a method of forming a hole in a glass substrate by using a pulsed laser, the method including (1) preparing the glass substrate including a first surface and a second surface that face each other; (2) forming a concave portion on the first surface by irradiating, with a first condition, the pulsed laser onto the first surface of the glass substrate through a lens; and (3) forming the hole by irradiating the pulsed laser onto the concave portion with a second condition such that energy density of the pulsed laser is less than or equal to a processing threshold value of the glass substrate.
    Type: Grant
    Filed: September 27, 2016
    Date of Patent: October 15, 2019
    Assignee: AGC Inc.
    Inventors: Kohei Horiuchi, Motoshi Ono
  • Publication number: 20190224783
    Abstract: A manufacturing method of a glass substrate having holes includes irradiating a plurality of hole formation target positions of a dummy glass substrate with a laser under a first condition, to form a plurality of holes in the dummy glass substrate; heating the dummy glass substrate under a second condition; measuring, for each of the hole formation target positions, a deviation between the hole formation target position and a position of the hole after the heating formed by irradiating the hole formation target position of the dummy glass substrate; irradiating irradiation target positions of a glass substrate, having substantially same shape, dimension and composition as the dummy glass substrate, with a laser under the first condition, to form a plurality of holes, the irradiation target positions of the glass substrate with the laser being determined taking into account the deviation; and heating the glass substrate under the second condition.
    Type: Application
    Filed: April 4, 2019
    Publication date: July 25, 2019
    Applicant: AGC INC.
    Inventor: Motoshi ONO
  • Publication number: 20190118281
    Abstract: Disclosed is a through-hole forming method including a process of forming, by condensing and irradiating a laser beam onto an insulation substrate through a lens, a through-hole that passes through the insulation substrate in a thickness direction of the insulation substrate. A medium between the lens and the insulation substrate is air. A converging half angle ? that is calculated from a focal length f of the lens and a beam diameter d of the laser beam that enters the lens by using expression (1) satisfies expression (2): (d/2)/f=tan ???(1), and 0.16?sin ??0.22??(2).
    Type: Application
    Filed: December 20, 2018
    Publication date: April 25, 2019
    Applicant: AGC, Inc.
    Inventor: Motoshi ONO
  • Patent number: 10264672
    Abstract: A glass substrate includes a plurality of through holes that penetrate from a first surface to a second surface of the glass substrate. Each through hole has an upper aperture with a first diameter on the first surface and a lower aperture with a second diameter on the second surface. For each of ten through holes selected from the plurality of through holes, a side wall length is obtained from the first and second diameters and the thickness of the glass substrate, and an R value is obtained by dividing the side wall length by the thickness of the glass substrate. The R values fall within a range of 1 to 1.1. A B value, obtained from dividing a difference between the greatest R value and the smallest R value by an average of the R values followed by multiplication with 100, is 5% or less.
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: April 16, 2019
    Assignee: AGC Inc.
    Inventors: Shigetoshi Mori, Motoshi Ono, Mamoru Isobe, Kohei Horiuchi
  • Patent number: 10201867
    Abstract: Disclosed is a through-hole forming method including a process of forming, by condensing and irradiating a laser beam onto an insulation substrate through a lens, a through-hole that passes through the insulation substrate in a thickness direction of the insulation substrate. A medium between the lens and the insulation substrate is air. A converging half angle ? that is calculated from a focal length f of the lens and a beam diameter d of the laser beam that enters the lens by using expression (1) satisfies expression (2): (d/2)/f=tan ???(1), and 0.16?sin ??0.22??(2).
    Type: Grant
    Filed: December 10, 2015
    Date of Patent: February 12, 2019
    Assignee: AGC Inc.
    Inventor: Motoshi Ono
  • Publication number: 20190021170
    Abstract: A glass substrate includes a first surface and a second surface that are opposite to each other. Multiple through holes pierce through the glass substrate from the first surface to the second surface. Each of five through holes randomly selected from the multiple through holes includes a first opening at the first surface and a second opening at the second surface. The approximate circle of the first opening has a diameter greater than a diameter of the approximate circle of the second opening. The first opening has a roundness of 5 ?m or less. Perpendicularity expressed by P=tc/t0 ranges from 1.00000 to 1.00015, where P is the perpendicularity, tc is the distance between the center of the approximate circle of the first opening and the center of the approximate circle of the second opening, and t0 is the thickness of the glass substrate.
    Type: Application
    Filed: July 9, 2018
    Publication date: January 17, 2019
    Applicant: AGC Inc.
    Inventors: Mamoru ISOBE, Motoshi ONO, Shigetoshi MORI, Kohei HORIUCHI
  • Publication number: 20180339936
    Abstract: A manufacturing method of a glass substrate having through holes includes (i) irradiating at a through hole forming target position on a first surface of the glass substrate with a laser light; and (ii) performing a wet etching treatment on the glass substrate. During the wet etching treatment being performed on the glass substrate, an ultrasonic vibration with a frequency of less than 40 kHz is applied to an etchant over at least a part of the wet etching period, referred to as an ultrasonic vibration application period.
    Type: Application
    Filed: May 25, 2018
    Publication date: November 29, 2018
    Applicant: Asahi Glass Company, Limited
    Inventors: Motoshi Ono, Mamoru Isobe, Shigetoshi Mori, Kohei Horiuchi
  • Publication number: 20180317319
    Abstract: A glass substrate includes a plurality of through holes that penetrate from a first surface to a second surface of the glass substrate. Each through hole has an upper aperture with a first diameter on the first surface and a lower aperture with a second diameter on the second surface. For each of ten through holes selected from the plurality of through holes, a side wall length is obtained from the first and second diameters and the thickness of the glass substrate, and an R value is obtained by dividing the side wall length by the thickness of the glass substrate. The R values fall within a range of 1 to 1.1. A B value, obtained from dividing a difference between the greatest R value and the smallest R value by an average of the R values followed by multiplication with 100, is 5% or less.
    Type: Application
    Filed: April 25, 2018
    Publication date: November 1, 2018
    Applicant: Asahi Glass Company, Limited
    Inventors: Shigetoshi MORI, Motoshi ONO, Mamoru ISOBE, Kohei HORIUCHI
  • Publication number: 20180312432
    Abstract: A glass substrate having a plurality of holes includes a first surface and a second surface, which are opposite to each other. Each of the holes is arranged so as to have an aperture on the first surface. The plurality of holes includes a first hole group including a plurality of first holes having a first aperture diameter including a first variation, and a second hole group including a second hole or a plurality of second holes having a second aperture diameter including a second variation. Each of the first holes has an aspect ratio of greater than 1, and a surface roughness on an inner wall (arithmetic average roughness Ra) of less than 0.1 ?m. The second aperture diameter is greater than the first aperture diameter by 15% or more, or less than the first aperture diameter by 15% or more.
    Type: Application
    Filed: April 24, 2018
    Publication date: November 1, 2018
    Applicant: ASAHI GLASS COMPANY, LIMITED
    Inventors: Kohei HORIUCHI, Motoshi ONO, Mamoru ISOBE, Shigetoshi MORI
  • Publication number: 20180037489
    Abstract: A manufacturing method of a glass substrate with a hole having a diameter ?f, and with a thickness ?f includes setting a thickness ?1 of a glass plate that is to be processed; preparing a glass plate with the thickness ?1, having first and second surfaces opposite to each other; forming one initial characteristic object or two or more initial characteristic objects in the glass plate by irradiating the glass plate with a laser from a side of the first surface of the glass plate, the initial characteristic object having a size of a diameter ?1 on the first surface; and performing wet etching for the glass plate having the initial characteristic object, so that from the initial characteristic object a hole having the diameter ?f on the first surface is formed, and a thickness of the glass plate is adjusted from ?1 to a target value of ?f.
    Type: Application
    Filed: August 2, 2017
    Publication date: February 8, 2018
    Applicant: Asahi Glass Company, Limited
    Inventor: Motoshi ONO
  • Publication number: 20170282299
    Abstract: A manufacturing method for a glass substrate having a hole with a depth of d (?m) or more includes irradiating the glass substrate with a laser beam emitted from a CO2 laser oscillator for an irradiation time t (?sec), to form a hole in the glass substrate. The laser beam is delivered to the glass substrate after being condensed at a focusing lens. A power density Pd (W/cm2), defined by Pd=P0/S where P0 and S are a power and a beam cross-sectional area of the laser beam just prior to entering the focusing lens, respectively, is 600 W/cm2 or less. The irradiation time t (?sec) satisfies t?10×d/Pd)1/2.
    Type: Application
    Filed: March 29, 2017
    Publication date: October 5, 2017
    Applicant: Asahi Glass Company, Limited
    Inventor: Motoshi ONO
  • Patent number: 9688563
    Abstract: An apparatus for forming holes in a glass substrate, includes a laser source that irradiates a laser beam on a first surface of the glass substrate, and a base plate on which a second surface of the glass substrate, opposite to the first surface, is placed. The base plate includes a recessed area in a central part thereof, and supports arranged within the recessed area to support the glass substrate. At least a part of the supports is arranged in a lattice shape within a plane approximately perpendicular to a direction in which the supports extend. One support and another adjacent support closest to the one support, amongst the supports arranged in the lattice shape, are arranged at an interval that is shorter than 30 mm, and the supports have a height that is higher than 70 ?m.
    Type: Grant
    Filed: March 1, 2016
    Date of Patent: June 27, 2017
    Assignee: Asahi Glass Company, Limited
    Inventors: Motoshi Ono, Takanori Kobashi
  • Publication number: 20170137314
    Abstract: An apparatus for forming holes in a glass substrate, includes a laser source that irradiates a laser beam on a first surface of the glass substrate, and a base plate on which a second surface of the glass substrate, opposite to the first surface, is placed. The base plate includes a recessed area in a central part thereof, and supports arranged within the recessed area to support the glass substrate. At least a part of the supports is arranged in a lattice shape within a plane approximately perpendicular to a direction in which the supports extend. One support and another adjacent support closest to the one support, amongst the supports arranged in the lattice shape, are arranged at an interval that is shorter than 30 mm, and the supports have a height that is higher than 70 ?m.
    Type: Application
    Filed: March 1, 2016
    Publication date: May 18, 2017
    Applicant: Asahi Glass Company, Limited
    Inventors: Motoshi ONO, Takanori Kobashi
  • Patent number: 9629250
    Abstract: A method of manufacturing a glass component includes preparing a glass substrate having a thickness greater than or equal to 300 ?m, forming first electric wires on a first surface of the glass substrate, forming a structure by joining the glass substrate via a resin layer to a support substrate such that the first surface of the glass substrate faces the resin layer, thinning the glass substrate from a second surface of the glass substrate to a thickness between 10 ?m and 80 ?m, forming through holes in the glass substrate by irradiating the glass substrate from the second surface with a laser beam, forming second electric wires on the second surface of the glass substrate such that the second electric wires are electrically connected to the corresponding first electric wires via conductors filling the through holes, and separating the glass substrate from the support substrate.
    Type: Grant
    Filed: April 6, 2015
    Date of Patent: April 18, 2017
    Assignee: Asahi Glass Company, Limited
    Inventors: Shintaro Takahashi, Motoshi Ono
  • Publication number: 20170096361
    Abstract: Disclosed is a method of forming a hole in a glass substrate by using a pulsed laser, the method including (1) preparing the glass substrate including a first surface and a second surface that face each other; (2) forming a concave portion on the first surface by irradiating, with a first condition, the pulsed laser onto the first surface of the glass substrate through a lens; and (3) forming the hole by irradiating the pulsed laser onto the concave portion with a second condition such that energy density of the pulsed laser is less than or equal to a processing threshold value of the glass substrate.
    Type: Application
    Filed: September 27, 2016
    Publication date: April 6, 2017
    Applicant: ASAHI GLASS COMPANY, LIMITED
    Inventors: Kohei HORIUCHI, Motoshi ONO