Abstract: To provide a composition whereby it is possible to obtain a metal-clad laminate having low relative permittivity and dissipation factor and having adhesion of the composition layer to the metal layer improved, as well as the metal-clad laminate comprising a composition layer made of the composition, and a method for its production. A composition comprising a fluorinated polymer A1 containing units based on a fluoroolefin and units based on a monomer having an adhesive functional group, and an inorganic filler having a specific surface area of less than 5.5 m2/g, wherein the content of the inorganic filler in the solid content of the composition is at least 55 vol % to the entire volume of the solid content of the composition.

Abstract: An all-solid-state battery includes a case, a battery element, and a restraint component. The case accommodates the battery element. The battery element includes an electrode part and a resin part. The resin part covers at least a part of a side face of the electrode part. The restraint component applies a first pressure to the electrode part. The restraint component applies a second pressure to the resin part. The ratio of the second pressure to the first pressure is from 1.5 to 18.

Abstract: An antenna includes an antenna conductor to be provided on an exterior side of a chassis and a flexible substrate. The flexible substrate includes a first insulating portion that is a portion of a sheet-shaped dielectric where the sheet-shaped dielectric is folded, a grounding conductor provided between the first insulating portion and the chassis, a second insulating portion that is a portion of the sheet-shaped dielectric where the sheet-shaped dielectric is not folded, and a signal line configured to feed power to the antenna conductor. A thickness of the first insulating portion is greater than a thickness of the second insulating portion.

Abstract: To provide a substrate with low dielectric loss tangent, relative permittivity, transmission loss and thermal expansion coefficient and excellent in mechanical strength, and a metal laminated substrate using this substrate. A substrate comprising a tetrafluoroethylene polymer and an inorganic filler, wherein the rate of change in dielectric loss tangent at 10 GHz before and after 72 hours of unsaturated pressure cooker test at 120° C. under 85% RH on a 127-?m-thick specimen cut out from the substrate is at most 30%.

Abstract: An antenna includes an antenna conductor to be provided on an exterior side of a chassis and a flexible substrate. The flexible substrate includes a first insulating portion that is a portion of a sheet-shaped dielectric where the sheet-shaped dielectric is folded, a grounding conductor provided between the first insulating portion and the chassis, a second insulating portion that is a portion of the sheet-shaped dielectric where the sheet-shaped dielectric is not folded, and a signal line configured to feed power to the antenna conductor. A thickness of the first insulating portion is greater than a thickness of the second insulating portion.

Abstract: A manufacturing method of a glass substrate having holes includes irradiating a plurality of hole formation target positions of a dummy glass substrate with a laser under a first condition, to form a plurality of holes in the dummy glass substrate; heating the dummy glass substrate under a second condition; measuring, for each of the hole formation target positions, a deviation between the hole formation target position and a position of the hole after the heating formed by irradiating the hole formation target position of the dummy glass substrate; irradiating irradiation target positions of a glass substrate, having substantially same shape, dimension and composition as the dummy glass substrate, with a laser under the first condition, to form a plurality of holes, the irradiation target positions of the glass substrate with the laser being determined taking into account the deviation; and heating the glass substrate under the second condition.

Abstract: A manufacturing method for a glass substrate having a hole with a depth of d (?m) or more includes irradiating the glass substrate with a laser beam emitted from a CO2 laser oscillator for an irradiation time t (?sec), to form a hole in the glass substrate. The laser beam is delivered to the glass substrate after being condensed at a focusing lens. A power density Pd (W/cm2), defined by Pd=P0/S where P0 and S are a power and a beam cross-sectional area of the laser beam just prior to entering the focusing lens, respectively, is 600 W/cm2 or less. The irradiation time t (?sec) satisfies t?10×d/(Pd)1/2.

Abstract: A manufacturing method of a glass substrate with a hole having a diameter ?f, and with a thickness ?f includes setting a thickness ?1 of a glass plate that is to be processed; preparing a glass plate with the thickness ?1, having first and second surfaces opposite to each other; forming one initial characteristic object or two or more initial characteristic objects in the glass plate by irradiating the glass plate with a laser from a side of the first surface of the glass plate, the initial characteristic object having a size of a diameter ?1 on the first surface; and performing wet etching for the glass plate having the initial characteristic object, so that from the initial characteristic object a hole having the diameter ?f on the first surface is formed, and a thickness of the glass plate is adjusted from ?1 to a target value of ?f.

Abstract: A glass substrate includes a first surface and a second surface that are opposite to each other. Multiple through holes pierce through the glass substrate from the first surface to the second surface. Each of five through holes randomly selected from the multiple through holes includes a first opening at the first surface and a second opening at the second surface. The approximate circle of the first opening has a diameter greater than a diameter of the approximate circle of the second opening. The first opening has a roundness of 5 ?m or less. Perpendicularity expressed by P=tc/t0 ranges from 1.00000 to 1.00015, where P is the perpendicularity, tc is the distance between the center of the approximate circle of the first opening and the center of the approximate circle of the second opening, and t0 is the thickness of the glass substrate.

Abstract: Disclosed is a method of forming a hole in a glass substrate by using a pulsed laser, the method including (1) preparing the glass substrate including a first surface and a second surface that face each other; (2) forming a concave portion on the first surface by irradiating, with a first condition, the pulsed laser onto the first surface of the glass substrate through a lens; and (3) forming the hole by irradiating the pulsed laser onto the concave portion with a second condition such that energy density of the pulsed laser is less than or equal to a processing threshold value of the glass substrate.

Abstract: Disclosed is a method of forming a hole in a glass substrate by using a pulsed laser, the method including (1) preparing the glass substrate including a first surface and a second surface that face each other; (2) forming a concave portion on the first surface by irradiating, with a first condition, the pulsed laser onto the first surface of the glass substrate through a lens; and (3) forming the hole by irradiating the pulsed laser onto the concave portion with a second condition such that energy density of the pulsed laser is less than or equal to a processing threshold value of the glass substrate.

Abstract: A manufacturing method of a glass substrate having holes includes irradiating a plurality of hole formation target positions of a dummy glass substrate with a laser under a first condition, to form a plurality of holes in the dummy glass substrate; heating the dummy glass substrate under a second condition; measuring, for each of the hole formation target positions, a deviation between the hole formation target position and a position of the hole after the heating formed by irradiating the hole formation target position of the dummy glass substrate; irradiating irradiation target positions of a glass substrate, having substantially same shape, dimension and composition as the dummy glass substrate, with a laser under the first condition, to form a plurality of holes, the irradiation target positions of the glass substrate with the laser being determined taking into account the deviation; and heating the glass substrate under the second condition.

Abstract: Disclosed is a through-hole forming method including a process of forming, by condensing and irradiating a laser beam onto an insulation substrate through a lens, a through-hole that passes through the insulation substrate in a thickness direction of the insulation substrate. A medium between the lens and the insulation substrate is air. A converging half angle ? that is calculated from a focal length f of the lens and a beam diameter d of the laser beam that enters the lens by using expression (1) satisfies expression (2): (d/2)/f=tan ???(1), and 0.16?sin ??0.22??(2).

Abstract: A glass substrate includes a plurality of through holes that penetrate from a first surface to a second surface of the glass substrate. Each through hole has an upper aperture with a first diameter on the first surface and a lower aperture with a second diameter on the second surface. For each of ten through holes selected from the plurality of through holes, a side wall length is obtained from the first and second diameters and the thickness of the glass substrate, and an R value is obtained by dividing the side wall length by the thickness of the glass substrate. The R values fall within a range of 1 to 1.1. A B value, obtained from dividing a difference between the greatest R value and the smallest R value by an average of the R values followed by multiplication with 100, is 5% or less.

Abstract: Disclosed is a through-hole forming method including a process of forming, by condensing and irradiating a laser beam onto an insulation substrate through a lens, a through-hole that passes through the insulation substrate in a thickness direction of the insulation substrate. A medium between the lens and the insulation substrate is air. A converging half angle ? that is calculated from a focal length f of the lens and a beam diameter d of the laser beam that enters the lens by using expression (1) satisfies expression (2): (d/2)/f=tan ???(1), and 0.16?sin ??0.22??(2).

Abstract: A glass substrate includes a first surface and a second surface that are opposite to each other. Multiple through holes pierce through the glass substrate from the first surface to the second surface. Each of five through holes randomly selected from the multiple through holes includes a first opening at the first surface and a second opening at the second surface. The approximate circle of the first opening has a diameter greater than a diameter of the approximate circle of the second opening. The first opening has a roundness of 5 ?m or less. Perpendicularity expressed by P=tc/t0 ranges from 1.00000 to 1.00015, where P is the perpendicularity, tc is the distance between the center of the approximate circle of the first opening and the center of the approximate circle of the second opening, and t0 is the thickness of the glass substrate.

Abstract: A manufacturing method of a glass substrate having through holes includes (i) irradiating at a through hole forming target position on a first surface of the glass substrate with a laser light; and (ii) performing a wet etching treatment on the glass substrate. During the wet etching treatment being performed on the glass substrate, an ultrasonic vibration with a frequency of less than 40 kHz is applied to an etchant over at least a part of the wet etching period, referred to as an ultrasonic vibration application period.

Abstract: A glass substrate having a plurality of holes includes a first surface and a second surface, which are opposite to each other. Each of the holes is arranged so as to have an aperture on the first surface. The plurality of holes includes a first hole group including a plurality of first holes having a first aperture diameter including a first variation, and a second hole group including a second hole or a plurality of second holes having a second aperture diameter including a second variation. Each of the first holes has an aspect ratio of greater than 1, and a surface roughness on an inner wall (arithmetic average roughness Ra) of less than 0.1 ?m. The second aperture diameter is greater than the first aperture diameter by 15% or more, or less than the first aperture diameter by 15% or more.

Abstract: A glass substrate includes a plurality of through holes that penetrate from a first surface to a second surface of the glass substrate. Each through hole has an upper aperture with a first diameter on the first surface and a lower aperture with a second diameter on the second surface. For each of ten through holes selected from the plurality of through holes, a side wall length is obtained from the first and second diameters and the thickness of the glass substrate, and an R value is obtained by dividing the side wall length by the thickness of the glass substrate. The R values fall within a range of 1 to 1.1. A B value, obtained from dividing a difference between the greatest R value and the smallest R value by an average of the R values followed by multiplication with 100, is 5% or less.

Abstract: A manufacturing method of a glass substrate with a hole having a diameter ?f, and with a thickness ?f includes setting a thickness ?1 of a glass plate that is to be processed; preparing a glass plate with the thickness ?1, having first and second surfaces opposite to each other; forming one initial characteristic object or two or more initial characteristic objects in the glass plate by irradiating the glass plate with a laser from a side of the first surface of the glass plate, the initial characteristic object having a size of a diameter ?1 on the first surface; and performing wet etching for the glass plate having the initial characteristic object, so that from the initial characteristic object a hole having the diameter ?f on the first surface is formed, and a thickness of the glass plate is adjusted from ?1 to a target value of ?f.