Abstract: A manufacturing method for a glass substrate having a hole with a depth of d (?m) or more includes irradiating the glass substrate with a laser beam emitted from a CO2 laser oscillator for an irradiation time t (?sec), to form a hole in the glass substrate. The laser beam is delivered to the glass substrate after being condensed at a focusing lens. A power density Pd (W/cm2), defined by Pd=P0/S where P0 and S are a power and a beam cross-sectional area of the laser beam just prior to entering the focusing lens, respectively, is 600 W/cm2 or less. The irradiation time t (?sec) satisfies t?10×d/Pd)1/2.

Abstract: An apparatus for forming holes in a glass substrate, includes a laser source that irradiates a laser beam on a first surface of the glass substrate, and a base plate on which a second surface of the glass substrate, opposite to the first surface, is placed. The base plate includes a recessed area in a central part thereof, and supports arranged within the recessed area to support the glass substrate. At least a part of the supports is arranged in a lattice shape within a plane approximately perpendicular to a direction in which the supports extend. One support and another adjacent support closest to the one support, amongst the supports arranged in the lattice shape, are arranged at an interval that is shorter than 30 mm, and the supports have a height that is higher than 70 ?m.

Abstract: An apparatus for forming holes in a glass substrate, includes a laser source that irradiates a laser beam on a first surface of the glass substrate, and a base plate on which a second surface of the glass substrate, opposite to the first surface, is placed. The base plate includes a recessed area in a central part thereof, and supports arranged within the recessed area to support the glass substrate. At least a part of the supports is arranged in a lattice shape within a plane approximately perpendicular to a direction in which the supports extend. One support and another adjacent support closest to the one support, amongst the supports arranged in the lattice shape, are arranged at an interval that is shorter than 30 mm, and the supports have a height that is higher than 70 ?m.

Abstract: A method of manufacturing a glass component includes preparing a glass substrate having a thickness greater than or equal to 300 ?m, forming first electric wires on a first surface of the glass substrate, forming a structure by joining the glass substrate via a resin layer to a support substrate such that the first surface of the glass substrate faces the resin layer, thinning the glass substrate from a second surface of the glass substrate to a thickness between 10 ?m and 80 ?m, forming through holes in the glass substrate by irradiating the glass substrate from the second surface with a laser beam, forming second electric wires on the second surface of the glass substrate such that the second electric wires are electrically connected to the corresponding first electric wires via conductors filling the through holes, and separating the glass substrate from the support substrate.

Abstract: Disclosed is a method of forming a hole in a glass substrate by using a pulsed laser, the method including (1) preparing the glass substrate including a first surface and a second surface that face each other; (2) forming a concave portion on the first surface by irradiating, with a first condition, the pulsed laser onto the first surface of the glass substrate through a lens; and (3) forming the hole by irradiating the pulsed laser onto the concave portion with a second condition such that energy density of the pulsed laser is less than or equal to a processing threshold value of the glass substrate.

Abstract: There is provided a glass substrate manufacturing method for manufacturing a glass substrate with a plurality of through-holes. The method includes a laser processing of forming the plurality of through-holes in the glass substrate, the glass substrate having a first main surface and a second main surface facing the first main surface, by irradiating a laser beam toward the first main surface; and an etching process of injecting an etchant only from a position facing the second main surface of the glass substrate toward the plurality of through-holes formed in the glass substrate.

Abstract: Disclosed is a through-hole forming method including a process of forming, by condensing and irradiating a laser beam onto an insulation substrate through a lens, a through-hole that passes through the insulation substrate in a thickness direction of the insulation substrate. A medium between the lens and the insulation substrate is air. A converging half angle ? that is calculated from a focal length f of the lens and a beam diameter d of the laser beam that enters the lens by using expression (1) satisfies expression (2): (d/2)/f=tan ? . . . ??(1), and 0.16?sin ??0.22 . . . ??(2).

Abstract: A method of manufacturing a glass component includes preparing a glass substrate having a thickness greater than or equal to 300 ?m, forming first electric wires on a first surface of the glass substrate, forming a structure by joining the glass substrate via a resin layer to a support substrate such that the first surface of the glass substrate faces the resin layer, thinning the glass substrate from a second surface of the glass substrate to a thickness between 10 ?m and 80 ?m, forming through holes in the glass substrate by irradiating the glass substrate from the second surface with a laser beam, forming second electric wires on the second surface of the glass substrate such that the second electric wires are electrically connected to the corresponding first electric wires via conductors filling the through holes, and separating the glass substrate from the support substrate.

Abstract: To provide a process for producing a glass member provided with a sealing material layer, capable of forming a sealing material layer well even in a case where the entire glass substrate cannot be heated. A sealing material layer is formed by scanning and irradiating with a laser light 9 along a frame-form coating layer 8 of a sealing material paste on a glass substrate. The scanning speed with the laser light 9 in a finishing region from a position close to an irradiation finishing position which at least partially overlaps with an already fired portion of the frame-form coating layer 8 to the irradiation finishing position, is adjusted to be slower than the scanning speed with the laser light in a scanning region along the frame-form coating layer 8.

Abstract: To provide a low-cost wave plate that does not cause any diffracted light and wavefront aberrations. The challenge is met by providing a wave plate characterized by including a first region, a second region, and a third region which are placed on a glass substrate. The first region and the second region exhibit each uniaxial birefringence at least in their portions. The third region exhibits uniaxial birefringence and is interposed between the first region and the second region. Phase advance axes of birefringence of the first region and the second region are substantially parallel to each other. A phase advance axis of birefringence of the third region is substantially orthogonal to the phase advance axes of birefringence of the first and second regions.

Abstract: To provide a process for producing a glass member provided with a sealing material layer, capable of favorably forming a sealing material layer even in a case where the entire glass substrate cannot be heated. A sealing material paste prepared by mixing a sealing material containing a sealing glass and a laser absorbent with an organic binder is applied to a sealing region of a glass substrate 2 in the form of a frame. The frame-form coating layer 8 of the sealing material paste is selectively heated by irradiation with a laser light 9 along the coating layer 8 to fire the sealing material while the organic binder in the coating layer 8 is burnt out to form a sealing material layer 7. Using such a sealing material layer 7, a space between two glass substrates is sealed.

Abstract: It is an object of the present invention to provide a glass substrate having plural through-holes which is not likely to peel from a silicon wafer, even though laminated on and jointed to a the silicon wafer and then subjected to heat treatment. The above object is accomplished by a glass substrate having an average thermal expansion coefficient of from 10×10?7 to 50×10?7/K within a range of from 50° C. to 300° C., having plural through-holes with a taper angle of from 0.1 to 20° and having a thickness of from 0.01 to 5 mm.

Abstract: The present invention is intended to provide an organic LED element in which the extraction efficiency is improved up to 80% of emitted light, and provides a translucent substrate comprising a translucent glass substrate; a scattering layer formed on the glass substrate and comprising a glass which contains a base material having a first refractive index for at least one wavelength of light to be transmitted and a plurality of scattering materials dispersed in the base material and having a second refractive index different from that of the base material; and a translucent electrode formed on the scattering layer and having a third refractive index higher than the first refractive index, wherein distribution of the scattering materials in the scattering layer decreases toward the translucent electrode.

Abstract: The present invention relates to a glass laminate including: a thin glass substrate having a first main surface and a second main surface; a supporting glass substrate having a first main surface and a second main surface, provided such that the first main surface thereof faces the first main surface of the thin glass substrate; a resin layer formed between the thin glass substrate and the supporting glass substrate, fixed to the first main surface of the supporting glass substrate and closely adhered to the first main surface of the thin glass substrate with peelability to the first main surface thereof; and an outer frame layer containing a glass sealing material and being formed by firing at an outer side of a peripheral part of the resin layer.

Abstract: To provide a process for producing a glass member provided with a sealing material layer, capable of favorably forming a sealing material layer even in a case where the entire glass substrate cannot be heated. A sealing material paste prepared by mixing a sealing material containing a sealing glass and a laser absorbent with an organic binder is applied to a sealing region of a glass substrate 2 in the form of a frame. The frame-form coating layer 8 of the sealing material paste is selectively heated by irradiation with a laser light 9 along the coating layer 8 to fire the sealing material while the organic binder in the coating layer 8 is burnt out to form a sealing material layer 7. Using such a sealing material layer 7, a space between two glass substrates is sealed.

Abstract: The present invention is to provide a method for smoothing the optical surface having a concave defect of an optical component for EUVL. The present invention relates to a method for smoothing the optical surface of an optical component for EUVL, comprising irradiating, with an excimer laser having a wavelength of 250 nm or less with a fluence of 0.5 to 2.0 J/cm2, the optical surface having a concave defect of an optical component for EUV lithography (EUVL), the optical component being made of a TiO2-containing silica glass material comprising SiO2 as a main component.

Abstract: The present invention provides a method for smoothing an optical surface of an optical component for EUVL. Specifically, the present invention provides a method for smoothing an optical surface of an optical component for EUVL made of a silica glass material containing TiO2 and comprising SiO2 as a main component with a laser having an oscillation wavelength, to which the optical component for EUVL has an absorption coefficient of 0.01 ?m?1 or more, at a fluence of 0.3 to 1.5 J/cm2 in an atmosphere having a water vapor partial pressure of 3.6 mmHg or less.

Abstract: A wave plate is disclosed which includes a glass plate having a thickness of at least 0.1 mm and at most 5 mm. The glass plate has a plurality of strip-shaped birefringent regions substantially in parallel with a surface of the glass plate. The axial directions of the strip-shaped birefringent regions are the same with one another, and substantially in parallel with the surface of the glass plate. The wave plate has a retardation value of from 80 to 450 nm as measured with incident light having a wavelength of 540 nm.

Abstract: It is an object of the present invention to provide a glass substrate having plural through-holes which is not likely to peel from a silicon wafer, even though laminated on and jointed to a the silicon wafer and then subjected to heat treatment. The above object is accomplished by a glass substrate having an average thermal expansion coefficient of from 10×10?7 to 50×10?7/K within a range of from 50° C. to 300° C., having plural through-holes with a taper angle of from 0.1 to 20° and having a thickness of from 0.01 to 5 mm.

Abstract: A wave plate is disclosed which includes a glass plate having a thickness of at least 0.1 mm and at most 5 mm. The glass plate has a plurality of strip-shaped birefringent regions substantially in parallel with a surface of the glass plate. The axial directions of the strip-shaped birefringent regions are the same with one another, and substantially in parallel with the surface of the glass plate. The wave plate has a retardation value of from 80 to 450 nm as measured with incident light having a wavelength of 540 nm.