Patents by Inventor Motoshi Ono

Motoshi Ono has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9629250
    Abstract: A method of manufacturing a glass component includes preparing a glass substrate having a thickness greater than or equal to 300 ?m, forming first electric wires on a first surface of the glass substrate, forming a structure by joining the glass substrate via a resin layer to a support substrate such that the first surface of the glass substrate faces the resin layer, thinning the glass substrate from a second surface of the glass substrate to a thickness between 10 ?m and 80 ?m, forming through holes in the glass substrate by irradiating the glass substrate from the second surface with a laser beam, forming second electric wires on the second surface of the glass substrate such that the second electric wires are electrically connected to the corresponding first electric wires via conductors filling the through holes, and separating the glass substrate from the support substrate.
    Type: Grant
    Filed: April 6, 2015
    Date of Patent: April 18, 2017
    Assignee: Asahi Glass Company, Limited
    Inventors: Shintaro Takahashi, Motoshi Ono
  • Publication number: 20170096361
    Abstract: Disclosed is a method of forming a hole in a glass substrate by using a pulsed laser, the method including (1) preparing the glass substrate including a first surface and a second surface that face each other; (2) forming a concave portion on the first surface by irradiating, with a first condition, the pulsed laser onto the first surface of the glass substrate through a lens; and (3) forming the hole by irradiating the pulsed laser onto the concave portion with a second condition such that energy density of the pulsed laser is less than or equal to a processing threshold value of the glass substrate.
    Type: Application
    Filed: September 27, 2016
    Publication date: April 6, 2017
    Applicant: ASAHI GLASS COMPANY, LIMITED
    Inventors: Kohei HORIUCHI, Motoshi ONO
  • Publication number: 20160347643
    Abstract: There is provided a glass substrate manufacturing method for manufacturing a glass substrate with a plurality of through-holes. The method includes a laser processing of forming the plurality of through-holes in the glass substrate, the glass substrate having a first main surface and a second main surface facing the first main surface, by irradiating a laser beam toward the first main surface; and an etching process of injecting an etchant only from a position facing the second main surface of the glass substrate toward the plurality of through-holes formed in the glass substrate.
    Type: Application
    Filed: May 23, 2016
    Publication date: December 1, 2016
    Applicant: Asahi Glass Company, Limited
    Inventors: Hiroyuki YAMAUCHI, Go Takahashi, Motoshi Ono, Mamoru Isobe
  • Publication number: 20160168006
    Abstract: Disclosed is a through-hole forming method including a process of forming, by condensing and irradiating a laser beam onto an insulation substrate through a lens, a through-hole that passes through the insulation substrate in a thickness direction of the insulation substrate. A medium between the lens and the insulation substrate is air. A converging half angle ? that is calculated from a focal length f of the lens and a beam diameter d of the laser beam that enters the lens by using expression (1) satisfies expression (2): (d/2)/f=tan ? . . . ??(1), and 0.16?sin ??0.22 . . . ??(2).
    Type: Application
    Filed: December 10, 2015
    Publication date: June 16, 2016
    Applicant: Asahi Glass Company, Limited
    Inventor: Motoshi ONO
  • Publication number: 20150313020
    Abstract: A method of manufacturing a glass component includes preparing a glass substrate having a thickness greater than or equal to 300 ?m, forming first electric wires on a first surface of the glass substrate, forming a structure by joining the glass substrate via a resin layer to a support substrate such that the first surface of the glass substrate faces the resin layer, thinning the glass substrate from a second surface of the glass substrate to a thickness between 10 ?m and 80 ?m, forming through holes in the glass substrate by irradiating the glass substrate from the second surface with a laser beam, forming second electric wires on the second surface of the glass substrate such that the second electric wires are electrically connected to the corresponding first electric wires via conductors filling the through holes, and separating the glass substrate from the support substrate.
    Type: Application
    Filed: April 6, 2015
    Publication date: October 29, 2015
    Applicant: Asahi Glass Company, Limited
    Inventors: Shintaro TAKAHASHI, Motoshi ONO
  • Publication number: 20140013804
    Abstract: To provide a process for producing a glass member provided with a sealing material layer, capable of forming a sealing material layer well even in a case where the entire glass substrate cannot be heated. A sealing material layer is formed by scanning and irradiating with a laser light 9 along a frame-form coating layer 8 of a sealing material paste on a glass substrate. The scanning speed with the laser light 9 in a finishing region from a position close to an irradiation finishing position which at least partially overlaps with an already fired portion of the frame-form coating layer 8 to the irradiation finishing position, is adjusted to be slower than the scanning speed with the laser light in a scanning region along the frame-form coating layer 8.
    Type: Application
    Filed: July 8, 2013
    Publication date: January 16, 2014
    Applicant: ASAHI GLASS COMPANY, LIMITED
    Inventors: Motoshi ONO, Sohei Kawanami
  • Publication number: 20130301127
    Abstract: To provide a low-cost wave plate that does not cause any diffracted light and wavefront aberrations. The challenge is met by providing a wave plate characterized by including a first region, a second region, and a third region which are placed on a glass substrate. The first region and the second region exhibit each uniaxial birefringence at least in their portions. The third region exhibits uniaxial birefringence and is interposed between the first region and the second region. Phase advance axes of birefringence of the first region and the second region are substantially parallel to each other. A phase advance axis of birefringence of the third region is substantially orthogonal to the phase advance axes of birefringence of the first and second regions.
    Type: Application
    Filed: July 19, 2013
    Publication date: November 14, 2013
    Applicant: Asahi Glass Company, Limited
    Inventors: Gousuke Yoshida, Motoshi Ono, Mitsuru Watanabe
  • Patent number: 8491983
    Abstract: It is an object of the present invention to provide a glass substrate having plural through-holes which is not likely to peel from a silicon wafer, even though laminated on and jointed to a the silicon wafer and then subjected to heat treatment. The above object is accomplished by a glass substrate having an average thermal expansion coefficient of from 10×10?7 to 50×10?7/K within a range of from 50° C. to 300° C., having plural through-holes with a taper angle of from 0.1 to 20° and having a thickness of from 0.01 to 5 mm.
    Type: Grant
    Filed: June 29, 2011
    Date of Patent: July 23, 2013
    Assignee: Asahi Glass Company, Limited
    Inventors: Motoshi Ono, Akio Koike
  • Patent number: 8490434
    Abstract: To provide a process for producing a glass member provided with a sealing material layer, capable of favorably forming a sealing material layer even in a case where the entire glass substrate cannot be heated. A sealing material paste prepared by mixing a sealing material containing a sealing glass and a laser absorbent with an organic binder is applied to a sealing region of a glass substrate 2 in the form of a frame. The frame-form coating layer 8 of the sealing material paste is selectively heated by irradiation with a laser light 9 along the coating layer 8 to fire the sealing material while the organic binder in the coating layer 8 is burnt out to form a sealing material layer 7. Using such a sealing material layer 7, a space between two glass substrates is sealed.
    Type: Grant
    Filed: January 20, 2012
    Date of Patent: July 23, 2013
    Assignee: Asahi Glass Company, Limited
    Inventors: Mitsuru Watanabe, Motoshi Ono
  • Patent number: 8431943
    Abstract: The present invention is intended to provide an organic LED element in which the extraction efficiency is improved up to 80% of emitted light, and provides a translucent substrate comprising a translucent glass substrate; a scattering layer formed on the glass substrate and comprising a glass which contains a base material having a first refractive index for at least one wavelength of light to be transmitted and a plurality of scattering materials dispersed in the base material and having a second refractive index different from that of the base material; and a translucent electrode formed on the scattering layer and having a third refractive index higher than the first refractive index, wherein distribution of the scattering materials in the scattering layer decreases toward the translucent electrode.
    Type: Grant
    Filed: May 7, 2010
    Date of Patent: April 30, 2013
    Assignee: Asahi Glass Company, Limited
    Inventors: Nobuhiro Nakamura, Motoshi Ono, Kenji Imakita, Hidefumi Odaka, Nao Ishibashi, Kazutaka Hayashi
  • Publication number: 20120202030
    Abstract: The present invention relates to a glass laminate including: a thin glass substrate having a first main surface and a second main surface; a supporting glass substrate having a first main surface and a second main surface, provided such that the first main surface thereof faces the first main surface of the thin glass substrate; a resin layer formed between the thin glass substrate and the supporting glass substrate, fixed to the first main surface of the supporting glass substrate and closely adhered to the first main surface of the thin glass substrate with peelability to the first main surface thereof; and an outer frame layer containing a glass sealing material and being formed by firing at an outer side of a peripheral part of the resin layer.
    Type: Application
    Filed: April 19, 2012
    Publication date: August 9, 2012
    Inventors: Satoshi KONDO, Motoshi ONO, Sohei KAWANAMI
  • Publication number: 20120111059
    Abstract: To provide a process for producing a glass member provided with a sealing material layer, capable of favorably forming a sealing material layer even in a case where the entire glass substrate cannot be heated. A sealing material paste prepared by mixing a sealing material containing a sealing glass and a laser absorbent with an organic binder is applied to a sealing region of a glass substrate 2 in the form of a frame. The frame-form coating layer 8 of the sealing material paste is selectively heated by irradiation with a laser light 9 along the coating layer 8 to fire the sealing material while the organic binder in the coating layer 8 is burnt out to form a sealing material layer 7. Using such a sealing material layer 7, a space between two glass substrates is sealed.
    Type: Application
    Filed: January 20, 2012
    Publication date: May 10, 2012
    Applicant: Asahi Glass Company, Limited
    Inventors: Mitsuru WATANABE, Motoshi Ono
  • Patent number: 8148037
    Abstract: The present invention is to provide a method for smoothing the optical surface having a concave defect of an optical component for EUVL. The present invention relates to a method for smoothing the optical surface of an optical component for EUVL, comprising irradiating, with an excimer laser having a wavelength of 250 nm or less with a fluence of 0.5 to 2.0 J/cm2, the optical surface having a concave defect of an optical component for EUV lithography (EUVL), the optical component being made of a TiO2-containing silica glass material comprising SiO2 as a main component.
    Type: Grant
    Filed: August 18, 2010
    Date of Patent: April 3, 2012
    Assignee: Asahi Glass Company, Limited
    Inventors: Motoshi Ono, Mitsuru Watanabe, Masabumi Ito
  • Patent number: 8124302
    Abstract: The present invention provides a method for smoothing an optical surface of an optical component for EUVL. Specifically, the present invention provides a method for smoothing an optical surface of an optical component for EUVL made of a silica glass material containing TiO2 and comprising SiO2 as a main component with a laser having an oscillation wavelength, to which the optical component for EUVL has an absorption coefficient of 0.01 ?m?1 or more, at a fluence of 0.3 to 1.5 J/cm2 in an atmosphere having a water vapor partial pressure of 3.6 mmHg or less.
    Type: Grant
    Filed: October 21, 2009
    Date of Patent: February 28, 2012
    Assignee: Asahi Glass Company, Limited
    Inventors: Motoshi Ono, Mitsuru Watanabe, Mika Yokoyama
  • Patent number: 8059337
    Abstract: A wave plate is disclosed which includes a glass plate having a thickness of at least 0.1 mm and at most 5 mm. The glass plate has a plurality of strip-shaped birefringent regions substantially in parallel with a surface of the glass plate. The axial directions of the strip-shaped birefringent regions are the same with one another, and substantially in parallel with the surface of the glass plate. The wave plate has a retardation value of from 80 to 450 nm as measured with incident light having a wavelength of 540 nm.
    Type: Grant
    Filed: October 7, 2009
    Date of Patent: November 15, 2011
    Assignee: Asahi Glass Company, Limited
    Inventor: Motoshi Ono
  • Publication number: 20110252834
    Abstract: A wave plate is disclosed which includes a glass plate having a thickness of at least 0.1 mm and at most 5 mm. The glass plate has a plurality of strip-shaped birefringent regions substantially in parallel with a surface of the glass plate. The axial directions of the strip-shaped birefringent regions are the same with one another, and substantially in parallel with the surface of the glass plate. The wave plate has a retardation value of from 80 to 450 nm as measured with incident light having a wavelength of 540 nm.
    Type: Application
    Filed: June 10, 2011
    Publication date: October 20, 2011
    Inventor: Motoshi Ono
  • Publication number: 20110256344
    Abstract: It is an object of the present invention to provide a glass substrate having plural through-holes which is not likely to peel from a silicon wafer, even though laminated on and jointed to a the silicon wafer and then subjected to heat treatment. The above object is accomplished by a glass substrate having an average thermal expansion coefficient of from 10×10?7 to 50×10?7/K within a range of from 50° C. to 300° C., having plural through-holes with a taper angle of from 0.1 to 20° and having a thickness of from 0.01 to 5 mm.
    Type: Application
    Filed: June 29, 2011
    Publication date: October 20, 2011
    Inventors: Motoshi ONO, Akio KOIKE
  • Publication number: 20100315704
    Abstract: The present invention is to provide a method for smoothing the optical surface having a concave defect of an optical component for EUVL. The present invention relates to a method for smoothing the optical surface of an optical component for EUVL, comprising irradiating, with an excimer laser having a wavelength of 250 nm or less with a fluence of 0.5 to 2.0 J/cm2, the optical surface having a concave defect of an optical component for EUV lithography (EUVL), the optical component being made of a TiO2-containing silica glass material comprising SiO2 as a main component.
    Type: Application
    Filed: August 18, 2010
    Publication date: December 16, 2010
    Applicant: Asahi Glass Company, Limited
    Inventors: Motoshi Ono, Mitsuru Watanabe, Masabumi Ito
  • Publication number: 20100230667
    Abstract: The present invention is intended to provide an organic LED element in which the extraction efficiency is improved up to 80% of emitted light, and provides a translucent substrate comprising a translucent glass substrate; a scattering layer formed on the glass substrate and comprising a glass which contains a base material having a first refractive index for at least one wavelength of light to be transmitted and a plurality of scattering materials dispersed in the base material and having a second refractive index different from that of the base material; and a translucent electrode formed on the scattering layer and having a third refractive index higher than the first refractive index, wherein distribution of the scattering materials in the scattering layer decreases toward the translucent electrode.
    Type: Application
    Filed: May 7, 2010
    Publication date: September 16, 2010
    Inventors: Nobuhiro Nakamura, Motoshi Ono, Kenji Imakita, Hidefumi Odaka, Nao Ishibashi, Kazutaka Hayashi
  • Publication number: 20100068632
    Abstract: The present invention provides a method for smoothing an optical surface of an optical component for EUVL. Specifically, the present invention provides a method for smoothing an optical surface of an optical component for EUVL made of a silica glass material containing TiO2 and comprising SiO2 as a main component with a laser having an oscillation wavelength, to which the optical component for EUVL has an absorption coefficient of 0.01 ?m?1 or more, at a fluence of 0.3 to 1.5 J/cm2 in an atmosphere having a water vapor partial pressure of 3.6 mmHg or less.
    Type: Application
    Filed: October 21, 2009
    Publication date: March 18, 2010
    Applicant: Asahi Glass Company, Limited
    Inventors: Motoshi ONO, Mitsuru Watanabe, Mika Yokoyama