Patents by Inventor Mozhgan Mansuri

Mozhgan Mansuri has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250252300
    Abstract: An example optical neural network includes a first layer having a laser responsive to an input signal to transmit an optical signal, a second layer having a photodetector to generate an electrical signal based on the optical signal, and a third layer having a memory array to store weights of the optical neural network, the third layer to generate an output signal based on the electrical signal and at least one of the weights.
    Type: Application
    Filed: March 28, 2025
    Publication date: August 7, 2025
    Inventors: Hechen Wang, Songtao Liu, Ram Kumar Krishnamurthy, Mozhgan Mansuri, Haisheng Rong
  • Patent number: 12334892
    Abstract: An integrated circuit having a transmission-line-based resonant clock distribution network for distributing a clock signal to one or more nodes, the integrated circuit including a transmission-line-based resonant network formed by one or more clock distribution units. Each clock distribution unit includes a transmission line segment having first and second ends and a resonant circuit connected to the transmission line segment at a position equidistant from the first end and the second end, where the resonant circuit includes an inductor connected in parallel with a capacitor such that the resonant circuit, along with the transmission line segment, collectively has a resonant frequency about a frequency of the clock signal.
    Type: Grant
    Filed: September 22, 2021
    Date of Patent: June 17, 2025
    Assignee: Intel Corporation
    Inventors: Susnata Mondal, Mozhgan Mansuri
  • Publication number: 20250192974
    Abstract: Embodiments herein relate to a clock distribution network. In one aspect, the network includes a resonant transmission line-based architecture which includes a single inductive-capacitance (LC) termination along the distribution and an additional capacitive termination at the end of the distribution to independently tune the primary and secondary resonance frequencies of the network and perform 3rd-harmonic filtering. The LC termination can include a coil inductor or a short-circuited termination line with parallel conductors to provide an inductance.
    Type: Application
    Filed: December 8, 2023
    Publication date: June 12, 2025
    Inventors: Susnata Mondal, Mozhgan Mansuri
  • Publication number: 20250175317
    Abstract: Embodiments herein relate to a phase interpolator for interpolating phases of input clock signals. In a series of interpolating cells, each cell receives clock signals having a phase offset between them and outputs an interpolated clock signal having a phase between the phases of the input clock signals. The received clock signals control the on and off time for first and second current sources of the interpolator cell. Additionally, a pulldown transistor is controlled by an internally-generated clock signal from a previous cell in the series, and each cell outputs an internally-generated clock signal that is fed to the next cell in the series to control its pulldown transistor. As a result, the duty cycle of the interpolated clock signal is made constant. A programmable common mode voltage removes any systematic direct current (DC) error in transferring the pulldown signal from one interpolator cell to another.
    Type: Application
    Filed: November 27, 2023
    Publication date: May 29, 2025
    Inventors: Soumya Bose, Chen Yuan, Susnata Mondal, Mozhgan Mansuri
  • Publication number: 20250160059
    Abstract: A micro-LED includes a light emitter between a pair of reflective metasurfaces formed from nanostructures. The metasurfaces have different levels of reflectivity, with one metasurface reflecting nearly all light, and the other metasurface allowing some light to pass through. The reflections of the light within the micro-LED result in an improved radiation recombination rate, which results in an increased modulation speed. In addition, the light emitted from the micro-LED has a relatively narrow divergence angle and narrow emission linewidth, making the micro-LED suitable for optical communications.
    Type: Application
    Filed: November 14, 2023
    Publication date: May 15, 2025
    Applicant: Intel Corporation
    Inventors: Khaled Ahmed, Joshua Fryman, Junyi Qiu, Mozhgan Mansuri, James Jaussi
  • Publication number: 20250147233
    Abstract: A wavelength multiplexing optical fiber transmitter, receiver, or transceiver where multiple emitters and/or photodetectors of different center wavelengths are coupled to a single optical fiber core terminus through multiple waveguides, which may be directly printed in free space. The optical assemblies described are suitable for optical data link applications, for example, to reduce a number of optical fibers needed for a given bandwidth or increase the bandwidth of a give number of optical fibers. Bidirectional fiber termination may also be implemented with an emitter and a photodetector pair coupled to a single optical fiber core terminus through multiple waveguides.
    Type: Application
    Filed: November 3, 2023
    Publication date: May 8, 2025
    Applicant: Intel Corporation
    Inventors: Junyi Qiu, Mozhgan Mansuri, Beom-Taek Lee
  • Publication number: 20250112624
    Abstract: Disclosed are multi-phase coupled resonant clock generation circuits that include magnetic coupling compensation techniques. Also disclosed are resonant distribution circuits that can use inductors spaced more closely to one another.
    Type: Application
    Filed: September 29, 2023
    Publication date: April 3, 2025
    Inventors: Susnata MONDAL, Mozhgan MANSURI
  • Publication number: 20250097081
    Abstract: Embodiments herein relate to an equalizer in a communication system. In an example implementation, the communication system is an optical system including a Vertical-Cavity Surface-Emitting Laser (VCSEL). A transfer function of the equalizer has two complex-zeroes to compensate for a group delay variation due to an underdamped complex-pole pair of the VCSEL optical response. The equalizer may include a first transistor having a control gate coupled to an input path, a drain coupled to an output path, and a source, and first, second and third paths coupled between the source and ground. The first path includes, in series, a resistor, a node and a capacitor, the second path includes a second transistor having a control gate coupled to the node, and the third path includes a capacitor. A tuning process can be used to achieve a desired frequency and quality factor.
    Type: Application
    Filed: September 14, 2023
    Publication date: March 20, 2025
    Inventors: Sashank Krishnamurthy, Mozhgan Mansuri
  • Publication number: 20250007759
    Abstract: Methods and apparatus are disclosed for complex-zero equalizers. An example circuit comprises driver circuitry including a first input, and equalizer circuitry including a second input, a first output coupled to the first input, a transistor including a gate terminal, a drain terminal, and a source terminal, the gate terminal coupled to the second input and the drain terminal coupled to the first output, an inductor including a first inductor terminal and a second inductor terminal, the first inductor terminal coupled to the source terminal of the transistor, a resistor coupled to the second inductor terminal, and a capacitor including a first terminal and a second terminal coupled to the source terminal and to the first inductor terminal and the second terminal coupled to ground.
    Type: Application
    Filed: June 29, 2023
    Publication date: January 2, 2025
    Inventors: Susnata Mondal, Mozhgan Mansuri
  • Publication number: 20240242067
    Abstract: Systems, apparatuses and methods include technology that executes, with a first plurality of panels, a first matrix-matrix multiplication operation of a first layer of an optical neural network (ONN) to generate output optical signals based on input optical signals that pass through an optical path of the ONN, and weights of the first layer of the ONN. The first plurality of panels includes an input panel, a weight panel and a photodetector panel. The executing includes generating, with the input panel, the input optical signals, where the input optical signals represent an input to the first matrix-matrix multiplication operation of the first layer of the ONN, representing, with the weight panel, the weights of the first layer of the ONN, and generating, with the photodetector panel, output photodetector signals based on the output optical signals that are generated based on the input optical signals and the weights.
    Type: Application
    Filed: March 29, 2024
    Publication date: July 18, 2024
    Inventors: Songtao Liu, Haisheng Rong, Mozhgan Mansuri, Ram Krishnamurthy
  • Patent number: 11722128
    Abstract: An apparatus is provided, where the apparatus includes a plurality of components; a first circuitry to generate a clock signal, and to supply the clock signal to the plurality of components; a second circuitry to estimate, for each of two or more components of the plurality of components, a corresponding duty cycle of the clock signal received at the corresponding component, wherein two or more duty cycles corresponding to the two or more components are determined; a third circuitry to determine an average of the two or more duty cycles; and a fourth circuitry to correct a duty cycle of the clock signal generated by the first circuitry, based at least in part on the average.
    Type: Grant
    Filed: June 24, 2021
    Date of Patent: August 8, 2023
    Assignee: Intel Corporation
    Inventors: Aaron Martin, Roger Cheng, Hari Venkatramani, Navneet Dour, Mozhgan Mansuri, Bryan Casper, Frank O'Mahony, Ganesh Balamurugan, Ajay Balankutty, Kuan Zhou, Sridhar Tirumalai, Krishnamurthy Venkataramana, Alex Thomas, Quoc Nguyen
  • Publication number: 20230196960
    Abstract: When an output of a driver circuit is coupled with a coupled-resonator network and a clock distribution network, the driver circuit generates a clock signal comprised of first and second components at first and second frequencies. The second frequency is a harmonic of the first frequency, and the first and second frequencies are in phase. In operation, the coupled-resonator network simultaneously resonates at both the first and second frequencies when coupled with the output of the driver circuit and the clock distribution network. The coupled-resonator network comprises a first inductor and a second inductor that, in operation, are both magnetically coupled and electrically coupled. The driver circuit and coupled-resonator network cooperate to provide a clock signal to the clock distribution network with improvements in slew rate and energy efficiency.
    Type: Application
    Filed: December 20, 2021
    Publication date: June 22, 2023
    Applicant: Intel Corporation
    Inventors: Susnata Mondal, Mozhgan Mansuri
  • Publication number: 20230091086
    Abstract: An integrated circuit having a transmission-line-based resonant clock distribution network for distributing a clock signal to one or more nodes, the integrated circuit including a transmission-line-based resonant network formed by one or more clock distribution units. Each clock distribution unit includes a transmission line segment having first and second ends and a resonant circuit connected to the transmission line segment at a position equidistant from the first end and the second end, where the resonant circuit includes an inductor connected in parallel with a capacitor such that the resonant circuit, along with the transmission line segment, collectively has a resonant frequency about a frequency of the clock signal.
    Type: Application
    Filed: September 22, 2021
    Publication date: March 23, 2023
    Inventors: Susnata Mondal, Mozhgan Mansuri
  • Publication number: 20220155539
    Abstract: Embodiments disclosed herein include optical packages. In an embodiment, an optical package comprises a package substrate, and a photonics die coupled to the package substrate. In an embodiment, a compute die is coupled to the package substrate, where the photonics die is communicatively coupled to the compute die by a bridge in the package substrate. In an embodiment, the optical package further comprises an optical waveguide embedded in the package substrate. In an embodiment, a first end of the optical waveguide is below the photonics die, and a second end of the optical waveguide is substantially coplanar with an edge of the package substrate.
    Type: Application
    Filed: November 19, 2020
    Publication date: May 19, 2022
    Inventors: Srinivas V. PIETAMBARAM, Brandon C. MARIN, Sameer PAITAL, Sai VADLAMANI, Rahul N. MANEPALLI, Xiaoqian LI, Suresh V. POTHUKUCHI, Sujit SHARAN, Arnab SARKAR, Omkar KARHADE, Nitin DESHPANDE, Divya PRATAP, Jeremy ECTON, Debendra MALLIK, Ravindranath V. MAHAJAN, Zhichao ZHANG, Kemal AYGÜN, Bai NIE, Kristof DARMAWIKARTA, James E. JAUSSI, Jason M. GAMBA, Bryan K. CASPER, Gang DUAN, Rajesh INTI, Mozhgan MANSURI, Susheel JADHAV, Kenneth BROWN, Ankar AGRAWAL, Priyanka DOBRIYAL
  • Publication number: 20210320652
    Abstract: An apparatus is provided, where the apparatus includes a plurality of components; a first circuitry to generate a clock signal, and to supply the clock signal to the plurality of components; a second circuitry to estimate, for each of two or more components of the plurality of components, a corresponding duty cycle of the clock signal received at the corresponding component, wherein two or more duty cycles corresponding to the two or more components are determined; a third circuitry to determine an average of the two or more duty cycles; and a fourth circuitry to correct a duty cycle of the clock signal generated by the first circuitry, based at least in part on the average.
    Type: Application
    Filed: June 24, 2021
    Publication date: October 14, 2021
    Applicant: Intel Corporation
    Inventors: Aaron Martin, Roger Cheng, Hari Venkatramani, Navneet Dour, Mozhgan Mansuri, Bryan Casper, Frank O'Mahony, Ganesh Balamurugan, Ajay Balankutty, Kuan Zhou, Sridhar Tirumalai, Krishnamurthy Venkataramana, Alex Thomas, Quoc Nguyen
  • Patent number: 11070200
    Abstract: An apparatus is provided, where the apparatus includes a plurality of components; a first circuitry to generate a clock signal, and to supply the clock signal to the plurality of components; a second circuitry to estimate, for each of two or more components of the plurality of components, a corresponding duty cycle of the clock signal received at the corresponding component, wherein two or more duty cycles corresponding to the two or more components are determined; a third circuitry to determine an average of the two or more duty cycles; and a fourth circuitry to correct a duty cycle of the clock signal generated by the first circuitry, based at least in part on the average.
    Type: Grant
    Filed: September 27, 2018
    Date of Patent: July 20, 2021
    Assignee: Intel Corporation
    Inventors: Aaron Martin, Roger Cheng, Hari Venkatramani, Navneet Dour, Mozhgan Mansuri, Bryan Casper, Frank O'Mahony, Ganesh Balamurugan, Ajay Balankutty, Kuan Zhou, Sridhar Tirumalai, Krishnamurthy Venkataramana, Alex Thomas, Quoc Nguyen
  • Patent number: 11003534
    Abstract: Embodiments of the invention are generally directed to systems, methods, and apparatuses for hybrid memory. In one embodiment, a hybrid memory may include a package substrate. The hybrid memory may also include a hybrid memory buffer chip attached to the first side of the package substrate. High speed input/output (HSIO) logic supporting a HSIO interface with a processor. The hybrid memory also includes packet processing logic to support a packet processing protocol on the HSIO interface. Additionally, the hybrid memory also has one or more memory tiles that are vertically stacked on the hybrid memory buffer.
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: May 11, 2021
    Assignee: Intel Corporation
    Inventors: Bryan K. Casper, Stephen R. Mooney, David Dunning, Mozhgan Mansuri, James E. Jaussi
  • Patent number: 10956268
    Abstract: Embodiments of the invention are generally directed to systems, methods, and apparatuses for hybrid memory. In one embodiment, a hybrid memory may include a package substrate. The hybrid memory may also include a hybrid memory buffer chip attached to the first side of the package substrate. High speed input/output (HSIO) logic supporting a HSIO interface with a processor. The hybrid memory also includes packet processing logic to support a packet processing protocol on the HSIO interface. Additionally, the hybrid memory also has one or more memory tiles that are vertically stacked on the hybrid memory buffer.
    Type: Grant
    Filed: August 1, 2019
    Date of Patent: March 23, 2021
    Assignee: Intel Corporation
    Inventors: Bryan K. Casper, Stephen R. Mooney, David Dunning, Mozhgan Mansuri, James E. Jaussi
  • Patent number: 10923164
    Abstract: An apparatus is provided which comprises: a first power supply rail to provide a first power supply; second and third power supply rails to provide second and third power supplies, respectively, wherein a voltage level of the first power supply is higher than a voltage level of each of the second and third power supplies; a first driver circuitry coupled to the first power supply rail and the second power supply rail; a second driver circuitry coupled to the third power supply rail, and coupled to the first driver circuitry; and a stack of transistors of N conductivity type coupled to the first power supply rail, and to the second driver circuitry.
    Type: Grant
    Filed: September 29, 2018
    Date of Patent: February 16, 2021
    Assignee: Intel Corporation
    Inventors: Hariprasath Venkatram, Mohammed G. Mostofa, Rajesh Inti, Roger K. Cheng, Aaron Martin, Christopher Mozak, Pavan Kumar Kappagantula, Hsien-Pao Yang, Mozhgan Mansuri, James Jaussi, Harishankar Sridharan
  • Publication number: 20200233746
    Abstract: Embodiments of the invention are generally directed to systems, methods, and apparatuses for hybrid memory. In one embodiment, a hybrid memory may include a package substrate. The hybrid memory may also include a hybrid memory buffer chip attached to the first side of the package substrate. High speed input/output (HSIO) logic supporting a HSIO interface with a processor. The hybrid memory also includes packet processing logic to support a packet processing protocol on the HSIO interface. Additionally, the hybrid memory also has one or more memory tiles that are vertically stacked on the hybrid memory buffer.
    Type: Application
    Filed: April 9, 2020
    Publication date: July 23, 2020
    Inventors: Bryan K. CASPER, Stephen R. Mooney, David Dunning, Mozhgan Mansuri, James E. Jaussi