Abstract: A replaceable light emitting diode (LED) package assembly has a separate structure and manufacturing process of the LED package. The LED die and a set of fluorescent material are located on a substrate. The fluorescent material device can be arranged selectively to match a required emission color according to the characteristic of wavelength of the LED die and not only is blended precisely to provide the required color but also reduces the rate of defects for the individual components of the assembly.

Abstract: A structure and manufacturing of a gallium nitride light emitting diode discloses a transparent conductive window layer comprising a diffusion barrier layer, an ohmic contact layer, and a window layer. By using the added domain contact layer, the diffusion barrier layer and the P-type semiconductor layer of the light emitting diode are put into ohimc contact. And then, the rising of the contact resistivity is barred by applying the diffusion barrier layer to block the diffusion of the window layer from the contact with the domain contact layer so as to lower down the operating voltage and advance the transparency.

Abstract: A gallium nitride (GaN) vertical light emitting diode (LED) structure and a method of separating a substrate and a thin film thereon in the GaN vertical LED are described. The structure has a metal reflective layer for reflecting light. The method provides a laser array over the substrate. A laser light emitted by the laser array is least partially be transparent to the substrate and its energy may be absorbed by the thin film. The thin film is irradiated through the substrate. The substrate is then separated from the thin film.

Abstract: A manufacturing method and device for white light emitting comprise at least two light emitting layers capable of emitting the light with the wavelengths of ?1 and ?2. Upon absorbing the light with the wavelength of one light emitting layer by at least one kind of fluorescent material, the light with the wavelength of ?3 is emitted and then mixed together with the light with the other wavelength so as to output the white light for use. Then, the fluorescent material formed on the light emitting layer of the light emitting device is packed together with said light emitting device, and then the assembly is the white light emitting device with high color rendering index of this invention.

Abstract: The present invention relates to a GaN-based heterostructure photodiode comprising a P type layer, an N type layer, and an activity layer between the P type layer and the N type layer. The P type layer, the N type layer and the activity layer are made of GaN-based composition, and the activity layer is doped with borons so as to modulate the band gap between the P type layer and the N type layer. Therefore, the breakdown voltage can be increased and the light receiving ability can be promoted so that the photodiode to be a light receiving element can has a better performance for light detection.

Abstract: A method for fabricating GaN-based LED is provided. The method first forms a first contact spreading metallic layer on top of the texturing surface of the p-type ohmic contact layer. The method then forms a second and a third contact spreading metallic layers on top of the first contact spreading layer. The p-type transparent metallic conductive layer composed of the three contact spreading metallic layers, after undergoing an alloying process within an oxygenic or nitrogenous environment under a high temperature, would have a superior conductivity. The p-type transparent metallic conductive layer could enhance the lateral contact uniformity between the p-type metallic electrode and the p-type ohmic contact layer, so as to avoid the localized light emission resulted from the uneven distribution of the second contact spreading metallic layer within the third contact spreading metallic layer. The GaN-based LED's working voltage and external quantum efficiency are also significantly improved.

Abstract: A high light efficiency of GaN-series of light emitting diode and its manufacturing method thereof disclose a process and structure of a p-type semiconductor layer of surface texture structure generation. The optical waveguide effect can be interrupted and the possibility of hexagonal shaped pits defect generated can be reduced through said texture structure. The method explores that controlling the tension and compression of strain while a p-type cladding layer and a p-type transition layer are generated, and then a p-type ohmic contact is formed on said p-type transition layer. Through the control and its structure of said epitaxial growth process, the surface of said p-type semiconductor layer is with texture structure to increase external quantum efficiency and its operation life.

Abstract: An epitaxial structure of GaN based compound semiconductor comprises a substrate; a single crystal of boron phosphide buffer layer on the substrate; a first buffer layer composed of group III nitride at a temperature from 200 to 800 degree C. formed on the boron phosphide buffer layer; and a second buffer layer composed of group III nitride at a temperature from 800 degree formed on the first buffer layer.

Abstract: A GaN-based composition semiconductor light-emitting element and its window layer structure includes a substrate where several epitaxy layers are sequentially formed and a window layer formed on the epitaxy layers so as to construct a light-emitting element. Each of the epitaxy layers and the window layer is composed of GaN-based composition. Boron atoms are doped in the window layer so as to increase the band gap of the window layer and decrease the refractive index. By appropriately doping the boron atoms, the activity rate of the P-type will be increased so as to increase the electric conductivity. Furthermore, by increasing the thickness of the window layer, the probability of defect generation can be reduced.

Abstract: A method of forming a group-III nitride semiconductor layer on a light-emitting device. First, a substrate is provided. Next, a buffer layer is formed on the substrate. A hydrogen treatment is performed on the buffer layer. Finally, a group-III nitride semiconductor layer is formed on the buffer layer. According to the present invention, a hydrogen treatment is performed on the buffer to prevent corrosion during subsequent process and remove particles from the buffer layer. Thus, the structure of the epitaxy layer following formed on the buffer layer is enhanced.

Abstract: The present invention relates to a GaN-based heterostructure photodiode comprising a P type layer, an N type layer, and an activity layer between the P type layer and the N type layer. The P type layer, the N type layer and the activity layer are made of GaN-based composition, and the activity layer is doped with borons so as to modulate the band gap between the P type layer and the N type layer. Therefore, the breakdown voltage can be increased and the light receiving ability can be promoted so that the photodiode to be a light receiving element can has a better performance for light detection.

Abstract: The present invention relates to a GaN-based composition semiconductor light-emitting element and its window layer structure. This light-emitting element comprises a substrate, where several epitaxy layers are sequentially form, and a window layer formed on the epitaxy layers so as to construct a light-emitting element. Each of the epitaxy layers and the window layer is composed of GaN-based composition. Borons are doped in the window layer so as to increase the band gap of the window layer and decrease the refractive index. By appropriately doping the borons, the activity rate of the P-type will be increased so as to increase the electric conductivity. Furthermore, by increasing the thickness of the window layer, the probability of defect generation can be reduced.

Abstract: The present invention discloses a light emitting diode (LED) by using a P-type ZnTe layer or a ZnSe layer as a substrate. To match the lattice between the substrate and blue light LED of cubic crystal, a BP(boron phosphide) buffer layer of single crystal is formed on the substrate. When the blue light LED emits blue light of wavelength from 450 nm to 470 nm, the ZnTe or ZnSe substrate absorbs the blue light and emits yellow-green light of wavelength 550 nm. Thus, white light is produced by mixing the blue light and the yellow-green light.

Abstract: A light-emitting device with reduced lattice mismatch. The light-emitting device comprises a substrate having a first lattice constant, a first buffer multilayer deposited on the substrate, a second buffer multilayer deposited on the first buffer multilayer, and a GaN base epitaxial layer deposited on the second buffer multilayer. The lattice constant of the first buffer multilayer ranges from the first lattice constant at the bottom of the first buffer multilayer to a second lattice constant at the top of the first buffer multilayer. The lattice constant of the second buffer multilayer ranges from the second lattice constant at the bottom of the second buffer multilayer to a third lattice constant at the top of the second buffer multilayer.

Abstract: The present invention discloses a light emitting diode (LED) by using a P-type ZnTe layer or a ZnSe layer as a substrate. To match the lattice between the substrate and blue light LED of cubic crystal, a BP(boron phosphide) buffer layer of single crystal is formed on the substrate. When the blue light LED emits blue light of wavelength from 450 nm to 470 nm, the ZnTe or ZnSe substrate absorbs the blue light and emits yellow-green light of wavelength 550 nm. Thus, white light is produced by mixing the blue light and the yellow-green light.

Abstract: The invention provides a method of manufacturing an optical-gate transistor. A BP buffer layer is formed on a silicone substrate first, and a first AIN layer is then formed for offsetting strain in the layers deposited on the first AIN layer. Subsequently, a GaN layer and an n-type AIN layer are successively deposited to form a hetero-junction at the interface. A selective epitaxy or anisotropic etching of a GaN-group material is conducted to form a prism-shaped, light-receiving layer with a cubic lattice. The prism-shaped, light-receiving layer focuses incident light to induce electrons in the n-type AIN layer, which then form a high-speed 2DEG in the GaN layer, thereby increasing the power and sensitivity of the transistor being controlled by illumination.

Abstract: The invention provides a method of manufacturing an optical-gate transistor. A BP buffer layer is formed on a silicone substrate first, and a first AIN layer is then formed for offsetting strain in the layers deposited on the first AIN layer. Subsequently, a GaN layer and an n-type AIN layer are successively deposited to form a hetero-junction at the interface. A selective epitaxy or anisotropic etching of a GaN-group material is conducted to form a prism-shaped, light-receiving layer with a cubic lattice. The prism-shaped, light-receiving layer focuses incident light to induce electrons in the n-type AIN layer, which then form a high-speed 2DEG in the GaN layer, thereby increasing the power and sensitivity of the transistor being controlled by illumination.

Abstract: A light-emitting device with reduced lattice mismatch. The light-emitting device comprises a substrate having a first lattice constant, a first buffer multilayer deposited on the substrate, a second buffer multilayer deposited on the first buffer multilayer, and a GaN base epitaxial layer deposited on the second buffer multilayer. The lattice constant of the first buffer multilayer ranges from the first lattice constant at the bottom of the first buffer multilayer to a second lattice constant at the top of the first buffer multilayer. The lattice constant of the second buffer multilayer ranges from the second lattice constant at the bottom of the second buffer multilayer to a third lattice constant at the top of the second buffer multilayer.

Abstract: A method of forming a group-III nitride semiconductor layer on a light-emitting device. First, a substrate is provided. Next, a buffer layer is formed on the substrate. A hydrogen treatment is performed on the buffer layer. Finally, a group-III nitride semiconductor layer is formed on the buffer layer. According to the present invention, a hydrogen treatment is performed on the buffer to prevent corrosion during subsequent process and remove particles from the buffer layer. Thus, the structure of the epitaxy layer following formed on the buffer layer is enhanced.

Abstract: A method of epitaxial lateral overgrowth. First, a silicon substrate is provided. Next, a selective growth mask is formed on the substrate. The selective growth mask is patterned to form a plurality of opening windows between the adjacent patterned selective growth masks so as to expose the surface of the substrate thereon. Finally, a BP epitaxial layer is formed by vertically overgrowing the BP epitaxial layer on the surface of the substrate in the opening windows until the BP epitaxial layer is thicker than the patterned selective growth mask, and laterally overgrowing the BP epitaxial layer on the patterned selective growth mask.