Patents by Inventor Mukul Renavikar

Mukul Renavikar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated heat spreader with intermetallic layer and method for making
    Publication number: 20060220226
    Abstract: Integrated heat spreader and die coupled with solder in a manner forming an intermetallic compound having a higher liquidus temperature than the liquidus temperature of the solder used to create the intermetallic compound are described herein.
    Type: Application
    Filed: March 30, 2005
    Publication date: October 5, 2006
    Applicant: Intel Corporation
    Inventors: Mukul Renavikar, Susheel Jadhav
  • FORMING AN INTERMEDIATE LAYER IN INTERCONNECT JOINTS AND STRUCTURES FORMED THEREBY
    Publication number: 20060110916
    Abstract: Methods of forming a microelectronic structure are described. Those methods comprise forming a first adhesion layer on a conductive layer, forming an intermediate layer on the first adhesion layer, and forming a barrier layer on the intermediate layer, wherein the intermediate layer comprises a coefficient of thermal expansion that is approximately between the coefficient of thermal expansion of the first adhesion layer and the coefficient of thermal expansion of the barrier layer.
    Type: Application
    Filed: November 19, 2004
    Publication date: May 25, 2006
    Inventors: Mukul Renavikar, John Barnak
  • Creation of electron traps in metal nitride and metal oxide electrodes in polymer memory devices
    Publication number: 20050227377
    Abstract: An embodiment of the invention reduces damage caused to a polymer ferroelectric layer in a polymer ferroelectric memory device by creating excess holes in the insulating metal nitride and/or metal oxide layers between the metal electrodes and polymer ferroelectric layer. The excess holes in the metal nitride and/or metal oxide trap electrons injected by the metal electrodes under AC bias that would otherwise damage the polymer ferroelectric layer.
    Type: Application
    Filed: March 31, 2004
    Publication date: October 13, 2005
    Inventors: Mukul Renavikar, Gudbjorg Oskarsdottir