Patents by Inventor Mun Choi

Mun Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11987582
    Abstract: Pharmaceutical compositions and methods of using maleate salts of triazolopyrazine derivatives are provided. In some aspects, the pharmaceutical compositions have improved storage stability and pharmacokinetic properties. The maleate salts of triazolopyrazine derivatives bind competitively to the phosphorylation site of c-MET kinase and can be used for the treatment or prevention of various hyper proliferative disorders.
    Type: Grant
    Filed: May 10, 2021
    Date of Patent: May 21, 2024
    Assignee: ABION Inc.
    Inventors: Jun Young Choi, Kyung Eui Park, Yeong Mun Kim
  • Publication number: 20240151469
    Abstract: A heat treatment apparatus includes a furnace body in which a material is transferred and heat treated, a sagger disposed inside the furnace body and configured to receive and transport the material, a roller configured to transport the sagger, and a heater disposed at a position apart from the sagger. The sagger seated on the roller includes a plurality of saggers. The heater includes an upper heater disposed above the sagger and a lower heater disposed under the sagger, based on a third direction which is a height direction of the furnace body, and the lower heater is disposed closer to the roller than to a bottom surface of the furnace body.
    Type: Application
    Filed: August 17, 2023
    Publication date: May 9, 2024
    Inventors: Sung Mun LEE, Shin Pil KANG, Young Jin CHOI
  • Publication number: 20240121375
    Abstract: The present disclosure relates to a stereoscopic surface display device, and more particularly, to a stereoscopic surface display device including: a light source unit including a plurality of optical elements; and a stereoscopic display unit disposed on the light source unit. The stereoscopic display unit includes: a polymer layer; and a light absorption layer buried in the polymer layer. The stereoscopic display unit includes a plurality of cell areas arranged in two-dimension, the light absorption layer is disposed in the plurality of cell areas, the plurality of optical elements vertically overlap the plurality of cell areas, respectively, and each of the plurality of cell areas has a stereoscopic shape.
    Type: Application
    Filed: October 6, 2023
    Publication date: April 11, 2024
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Sung Ryul YUN, Seongcheol MUN, Inwook HWANG, Mi Jeong CHOI
  • Publication number: 20240087277
    Abstract: A control method of a fastening tool for fastening a component part includes photographing a fastening portion of the component part through a camera portion mounted on the fastening tool. The control method includes pre-processing that rotates an input image, which has been photographed by the camera portion, to match with representative model image. The control method includes estimating the fastening portion through an inference process through a convolutional neural network (CNN) algorithm-based image classification work on a video input image of a same fastening portion finished with the pre-processing work. The control method also includes setting a torque value that is matched with a recognized fastening portion when a probability value of the fastening portion in the inference process exceeds a predetermined reference ratio.
    Type: Application
    Filed: November 15, 2023
    Publication date: March 14, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, INHA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION
    Inventors: Tae Mun Hwang, DongHa Jeong, Byung Cheol Song, Dong Yoon Choi
  • Patent number: 11921929
    Abstract: Provided is a stereoscopic surface display device including a stereoscopic display unit having a cell area, wherein the stereoscopic display unit includes a first flexible layer, a first optical waveguide and a first optical output unit in the first flexible layer, wherein the first optical output unit are disposed in the cell area, a first light source disposed on a side of the stereoscopic display unit, wherein the first optical waveguide connects the first light source and the first optical output unit, a first photothermal response layer on the first flexible layer, wherein the first photothermal response layer is configured to receive output light emitted from the first optical output unit and emit thermal energy, and a shape deformation layer on the first photothermal response layer, wherein the shape deformation layer is configured to generate bending deformation by receiving the thermal energy from the first photothermal response layer.
    Type: Grant
    Filed: February 7, 2023
    Date of Patent: March 5, 2024
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Sung Ryul Yun, Seung Koo Park, Inwook Hwang, Seongcheol Mun, Mi Jeong Choi
  • Publication number: 20240021570
    Abstract: Provided is a bonding apparatus. The bonding apparatus includes a stage configured to accommodate a substrate, a laser light source configured to provide laser light to devices on the substrate, and a bonding plate provided between the laser light source and the stage and configured to provide the devices on the substrate. The bonding plate includes a transparent substrate; a transparent layer below the transparent substrate; an device adhesion layer below the transparent layer and a reflective pattern provided above or below the transparent substrate and the transparent layer.
    Type: Application
    Filed: July 5, 2023
    Publication date: January 18, 2024
    Inventors: Jiho JOO, Yong Sung EOM, CHANMI LEE, Ki Seok JANG, GWANG-MUN CHOI, KWANG-SEONG CHOI, Jin Hyuk OH
  • Publication number: 20230396168
    Abstract: A 3-level converter includes: an inductor connected in series between a switching node and an output terminal from which an output voltage is output, an output capacitor connected between the output terminal and a ground terminal, a first switch connected between an input terminal to which an input voltage is input and a top plate node, a second switch connected between the top plate node and the switching node, a third switch connected between the switching node and a bottom plate node, a fourth switch connected between the bottom plate node and a ground terminal, a flying capacitor connected between the top plate node and the bottom plate node, balancing switches connected between the switching node and a balancing node, a top balancing capacitor connected between the input terminal and the balancing node, and a bottom balancing capacitor connected between the balancing node and a ground terminal.
    Type: Application
    Filed: April 28, 2023
    Publication date: December 7, 2023
    Applicants: SILICON MITUS, INC., Hangzhou Silicon-Magic Semiconductor Technology Co., Ltd.
    Inventors: Jae Soon Choi, Hak Hee Lee, Seok Mun Choi
  • Publication number: 20230391956
    Abstract: Provided is an organic-inorganic compound including a first structural body and a curable reactive group, wherein the first structural body may have a structure in which silane and isohexide are chemically bonded through a silyl ether bond.
    Type: Application
    Filed: June 2, 2023
    Publication date: December 7, 2023
    Inventors: GWANG-MUN CHOI, Yong Sung EOM, Jiho JOO, KWANG-SEONG CHOI, Seok-Hwan MOON, Jin Hyuk OH, Ho-Gyeong YUN, CHANMI LEE, Ki Seok JANG
  • Publication number: 20230378872
    Abstract: A 3-level buck-boost converter includes: an inductor connected in series between a switching node and a ground terminal; an output capacitor connected between an output terminal from which an output voltage is output and a ground terminal; a first switch connected between an input terminal to which an input voltage is input and a top plate node; a second switch connected between the top plate node and the switching node; a third switch connected between the switching node and a bottom plate node; a fourth switch connected between the bottom plate node and the output terminal; a flying capacitor connected between the top plate node and the bottom plate node; balancing switches connected between the switching node and the balancing node; a top balancing capacitor connected between the input terminal and the balancing node; and a bottom balancing capacitor connected between the balancing node and the output terminal.
    Type: Application
    Filed: March 30, 2023
    Publication date: November 23, 2023
    Applicants: SILICON MITUS, INC., Hangzhou Silicon-Magic Semiconductor Technology Co., Ltd.
    Inventors: Jae Soon Choi, Hak Hee Lee, Seok Mun Choi
  • Patent number: 11787883
    Abstract: The present invention relates to a modifier represented by Formula 1, a method of preparing the same, a modified conjugated diene-based polymer having a high modification ratio which includes a modifier-derived functional group, and a method of preparing the polymer.
    Type: Grant
    Filed: November 5, 2021
    Date of Patent: October 17, 2023
    Inventors: Ji Eun Kim, Won Taeck Lim, Won Mun Choi, Dae June Joe
  • Publication number: 20230326810
    Abstract: Provided are a microwave heating device and a method for manufacturing a semiconductor packaging using the same. The microwave heating device includes a microwave generator configured to generate microwaves, a microwave absorbing layer configured to receive the microwaves so as to be heated, a temperature measuring layer provided on the microwave absorbing layer, a sensor configured to detect a temperature of the temperature measuring layer, and a controller connected to the sensor and the microwave generator to determine the temperature of the microwave absorbing layer using a detection signal of the sensor, the controller being configured to control a voltage of the microwaves provided from the microwave generator based on the temperature of the microwave absorbing layer.
    Type: Application
    Filed: April 7, 2023
    Publication date: October 12, 2023
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: GWANG-MUN CHOI, Yong Sung EOM, Jiho JOO, KWANG-SEONG CHOI, Seok-Hwan MOON, Jin Hyuk OH, Ho-Gyeong YUN, CHANMI LEE, Ki Seok JANG
  • Publication number: 20230326204
    Abstract: An augmented reality (AR) device captures a first image frame of a first scene in a real world. The AR device compresses the first image frame using a same bitrate across an entirety of the first image frame to generate a first compressed image frame. The AR device wirelessly sends, to a server, the first compressed image frame. The AR device receives, from the server, object detection results that identify locations of objects depicted in the first image frame.
    Type: Application
    Filed: March 24, 2022
    Publication date: October 12, 2023
    Inventors: Jiayi Meng, Zhaoning Jonny Kong, Yu Charlie Hu, Mun Choi, Dhananjay Lal
  • Patent number: 11773191
    Abstract: The present invention relates to a modification initiator and a modified conjugated diene-based polymer including the same, and more particularly, the present invention provides a modification initiator including a compound represented by Formula 1, a modified conjugated diene-based polymer including the same, and a method of preparing a modified conjugated diene-based polymer.
    Type: Grant
    Filed: March 25, 2021
    Date of Patent: October 3, 2023
    Inventors: Min Soo Kim, Soo Yong Lee, Won Mun Choi
  • Patent number: 11702497
    Abstract: A modified conjugated diene-based polymer represented by Formula 1, wherein a terminal of a polymer chain is modified, and a method for preparing same are provided. By including a modifier derived unit having a specific structure, a beta value affecting cold flow may be reduced through controlling the degree of branch, and accordingly, the cold flow of a polymer may be efficiently controlled and a mooney viscosity increasing ratio may be improved.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: July 18, 2023
    Inventors: Soo Yong Lee, Dong Gil Lee, Won Mun Choi, Seung Ho Choi
  • Patent number: 11677060
    Abstract: Provided is a method for transferring and bonding devices. The method includes applying an adhesive layer to a carrier, arranging a plurality of devices, attaching the arranged devices to the carrier, applying a polymer film to a substrate, aligning the carrier to which the plurality of devices are attached with the substrate, bonding the plurality of devices to the substrate by radiating laser, and releasing the carrier from the substrate to which the plurality of devices are bonded.
    Type: Grant
    Filed: April 12, 2021
    Date of Patent: June 13, 2023
    Assignee: ELECTRONICS AND TELEOCMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Jiho Joo, Yong Sung Eom, Gwang-Mun Choi, Kwang-Seong Choi, Chanmi Lee, Ki Seok Jang
  • Patent number: 11618109
    Abstract: Provided is a wire for electric bonding, which includes a solder wire and a composition for bonding adjacent to the solder wire, the solder wire is wet when reaches to a melting point as heat is transferred, the composition for bonding includes an epoxy resin, a reducing agent, and a curing agent, the reducing agent removes a metal oxide formed on a surface of the solder wire, and the epoxy resin is cured by chemically reacting with the reducing agent and the curing agent at a curing temperature.
    Type: Grant
    Filed: June 30, 2021
    Date of Patent: April 4, 2023
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Gwang-Mun Choi, Yong Sung Eom, Kwang-Seong Choi, Jiho Joo, Chanmi Lee, Ki Seok Jang
  • Publication number: 20230027892
    Abstract: Provided is an electronic device including a plurality of substrate electrodes on a substrate, the substrate electrodes including initial electrodes and spare electrodes, a bonding material covering the initial electrodes and the spare electrodes, module structures respectively provided on first initial electrodes of the initial electrodes, and solders between each of the first initial electrodes and each of the module structures, wherein the spare electrodes include second spare electrodes, wherein the module structures are not provided on the second spare electrodes, wherein the bonding material on the first initial electrodes is harder than the bonding material on the second spare electrodes.
    Type: Application
    Filed: July 14, 2022
    Publication date: January 26, 2023
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: KWANG-SEONG CHOI, Yong-Sung EOM, Jiho JOO, GWANG-MUN CHOI, Seok-Hwan MOON, Ho-Gyeong YUN, CHANMI LEE, Ki-Seok JANG
  • Patent number: 11549084
    Abstract: A cleaning liquid composition is provided. More particularly, a cleaning liquid composition includes a transition metal compound represented by Chemical Formula 1 (see the detailed description of the present invention); and a hydrocarbon-based solvent, and a cleaning method of a polymerization apparatus using the same.
    Type: Grant
    Filed: August 29, 2018
    Date of Patent: January 10, 2023
    Inventors: Dae June Joe, Won Mun Choi, Eun Gyeong Lee
  • Publication number: 20220402070
    Abstract: Provided are a laser control structure and a laser bonding method using the same, and more particularly, a laser bonding method including: forming bonding portions on a substrate; providing a bonding object onto the bonding portions; providing a laser control structure onto the bonding object or the substrate; irradiating a laser toward the bonding object and the bonding portions; controlling quantity of laser light absorbed through the laser control structure; using the controlled quantity of laser light to heat the bonding portions and the bonding object to a bonding temperature; and bonding the bonding portions and the bonding object, wherein the laser control structure includes: a first substrate including a first region and a second region; a first thin film laminate on the first region; and a second thin film laminate on the second region, wherein: the first thin film laminate includes at least one first thin film layer and at least one second thin film layer, which are laminated on the first region; th
    Type: Application
    Filed: June 17, 2022
    Publication date: December 22, 2022
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Ki Seok JANG, Yong Sung EOM, GWANG-MUN CHOI, KWANG-SEONG CHOI, Jiho JOO, Seok-Hwan MOON, CHANMI LEE
  • Publication number: 20220384674
    Abstract: Provided is a method for manufacturing an electronic device. The method for manufacturing the electronic device includes mapping good elements and defective elements on a substrate, providing a first transparent structure including a first adhesive layer on the substrate, selectively providing first laser light to the defective elements to cure the first adhesive layer on the defective elements and separate the defective elements from the substrate, providing a second transparent structure including a second adhesive layer, which adheres to new elements replaced for the defective elements, on the substrate, and selectively providing second laser light to the new elements to bond the new elements to the substrate.
    Type: Application
    Filed: May 31, 2022
    Publication date: December 1, 2022
    Inventors: Jiho JOO, Yong Sung EOM, Kwang-Seong CHOI, Chanmi LEE, Gwang-Mun CHOI, Ki Seok JANG, Seok-Hwan MOON, Ho-Gyeong YUN