Abstract: The present invention relates to a modifier represented by Formula 1, a method of preparing the same, a modified conjugated diene-based polymer having a high modification ratio which includes a modifier-derived functional group, and a method of preparing the polymer.

Abstract: The present invention relates to a modifier represented by Formula 1, a method for preparing the same, a modified conjugated diene-based polymer including a functional group derived from the modifier and having a high modification ratio, and a method for preparing the polymer.

Abstract: A both terminal-modified conjugated diene-based polymer, which includes a functional group derived from a modification polymerization initiator and a functional group derived from a modifier, and has excellent affinity with a filler and improved mechanical properties and viscoelasticity properties, and a method for preparing the same.

Abstract: The present invention relates to a modified conjugated diene-based polymer having controlled degree of branching, excellent affinity with a filler, and excellent processability properties and compounding properties, a method for preparing the same, and a rubber composition including the same. The modified conjugated diene-based polymer is prepared using a modifier represented by Formula 1 to include a functional group derived from the modifier in at least one terminal of the polymer chain: 1—wherein R1 to R3 and n are described herein.

Abstract: Provided is a method of fabricating a semiconductor package. The method of fabricating the semiconductor package include preparing a lower element including a lower substrate, a lower electrode, an UBM layer, and a reducing agent layer, providing an upper element including an upper substrate, an upper electrode, and a solder bump layer, providing a pressing member on the upper substrate to press the upper substrate to the lower substrate, and providing a laser beam passing through the pressing member to bond the upper element to the lower element.

Abstract: Provided is a composition for conductive adhesive. The composition for conductive adhesive includes a heterocyclic compound containing oxygen and including at least one of an epoxy group or oxetane group, a reductive curing agent including an amine group and a carboxyl group, and a photoinitiator, wherein a mixture ratio of the heterocyclic compound and the reductive curing agent satisfies Conditional Expression 1 below. 0.5?(b+c)/a?1.5, a>0, b?0, c>0??[Conditional Expression 1] where ‘a’ denotes a mole number of a heterocycle in the heterocyclic compound, ‘b’ denotes a mole number of hydrogen bonded to a nitrogen atom of the amine group included in the reductive curing agent, and ‘c’ denotes a mole number of the carboxyl group.

Abstract: The present invention relates to a modifier represented by Formula 1, a method of preparing the same, a modified conjugated diene-based polymer having a high modification ratio which includes a modifier-derived functional group, and a method of preparing the polymer.

Abstract: The present invention relates to a modifier represented by Formula 1, a method of preparing the same, a modified conjugated diene-based polymer having a high modification ratio which includes a modifier-derived functional group, and a method of preparing the polymer.

Abstract: Provided is a wire for electric bonding, which includes a solder wire and a composition for bonding adjacent to the solder wire, the solder wire is wet when reaches to a melting point as heat is transferred, the composition for bonding includes an epoxy resin, a reducing agent, and a curing agent, the reducing agent removes a metal oxide formed on a surface of the solder wire, and the epoxy resin is cured by chemically reacting with the reducing agent and the curing agent at a curing temperature.

Abstract: Provided is a method for transferring and bonding devices. The method includes applying an adhesive layer to a carrier, arranging a plurality of devices, attaching the arranged devices to the carrier, applying a polymer film to a substrate, aligning the carrier to which the plurality of devices are attached with the substrate, bonding the plurality of devices to the substrate by radiating laser, and releasing the carrier from the substrate to which the plurality of devices are bonded.

Abstract: The present disclosure relates to a transfer and bonding method using a laser. As a plurality of devices or packages are simultaneously transferred onto a substrate from a transfer tape by irradiating a top surface of the transfer tape with a first laser, and the plurality of transferred devices or packages are simultaneously bonded to pads of a substrate by irradiating a top surface of the devices or packages with a second laser, a speed of a transfer and bonding process may be extremely maximized.

Abstract: A modified conjugated diene-based polymer represented by Formula 1, wherein a terminal of a polymer chain is modified, and a method for preparing same are provided. By including a modifier derived unit having a specific structure, a beta value affecting cold flow may be reduced through controlling the degree of branch, and accordingly, the cold flow of a polymer may be efficiently controlled and a mooney viscosity increasing ratio may be improved.

Abstract: The present invention relates to a substituted styrene-based compound represented by Formula 1 (refer to the specification and the scope of the claims), a method of preparing the styrene-based compound, a modified polymer including a functional group derived from the substituted styrene-based compound, a method of preparing the modified polymer, a rubber composition including the modified polymer, and a molded article manufactured from the rubber composition.

Abstract: The present invention relates to a modification initiator and a modified conjugated diene-based polymer including the same, and more particularly, the present invention provides a modification initiator including a compound represented by Formula 1, a modified conjugated diene-based polymer including the same, and a method of preparing a modified conjugated diene-based polymer.

Abstract: The present invention relates to a compound represented by Formula 1, a method for preparing the same, and a modified conjugated diene-based polymer having a high modification ratio and including a functional group derived from the compound.

Abstract: The present invention relates to a modification initiator and a modified conjugated diene-based polymer including the same, and more particularly, the present invention provides a modification initiator including a compound represented by Formula 1, a modified conjugated diene-based polymer including the same, and a method of preparing a modified conjugated diene-based polymer.

Abstract: The present disclosure provides a hard-coating resin composition for a hard-coating having easy processability, flexibility and high surface hardness suitable for a hard-coating agent, in which a siloxane molecule having an inorganic material characteristic is chemically bonded with an epoxy group having an organic material characteristic to form one molecule, and the siloxane molecule is made to contain a various molecular weight distribution for dense crosslinking during polymerization of the epoxy group in order to obtain high surface hardness due to the inorganic material.

Abstract: The present invention relates to a modifier represented by Formula 1, a method of preparing the same, a modified conjugated diene-based polymer having a high modification ratio which includes a modifier-derived functional group, and a method of preparing the polymer.

Abstract: The present invention relates to a compound represented by Formula 1, a method for preparing the same, and a modified conjugated diene-based polymer having a high modification ratio and including a functional group derived from the compound.

Abstract: A cleaning liquid composition is provided. More particularly, a cleaning liquid composition includes a transition metal compound represented by Chemical Formula 1 (see the detailed description of the present invention); and a hydrocarbon-based solvent, and a cleaning method of a polymerization apparatus using the same.