Patents by Inventor Mun Choi

Mun Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11359037
    Abstract: The present invention relates to a modifier represented by Formula 1, a method of preparing the same, a modified conjugated diene-based polymer having a high modification ratio which includes a modifier-derived functional group, and a method of preparing the polymer.
    Type: Grant
    Filed: August 14, 2020
    Date of Patent: June 14, 2022
    Inventors: Seung Ho Choi, Dae June Joe, Won Taeck Lim, Won Mun Choi
  • Patent number: 11319386
    Abstract: The present invention relates to a modifier represented by Formula 1, a method for preparing the same, a modified conjugated diene-based polymer including a functional group derived from the modifier and having a high modification ratio, and a method for preparing the polymer.
    Type: Grant
    Filed: October 18, 2018
    Date of Patent: May 3, 2022
    Inventors: Ji Eun Kim, Eun Gyeong Lee, Dae June Joe, Won Mun Choi
  • Patent number: 11319394
    Abstract: A both terminal-modified conjugated diene-based polymer, which includes a functional group derived from a modification polymerization initiator and a functional group derived from a modifier, and has excellent affinity with a filler and improved mechanical properties and viscoelasticity properties, and a method for preparing the same.
    Type: Grant
    Filed: September 3, 2018
    Date of Patent: May 3, 2022
    Inventors: Min Soo Kim, Soo Yong Lee, Won Mun Choi
  • Publication number: 20220127405
    Abstract: The present invention relates to a modified conjugated diene-based polymer having controlled degree of branching, excellent affinity with a filler, and excellent processability properties and compounding properties, a method for preparing the same, and a rubber composition including the same. The modified conjugated diene-based polymer is prepared using a modifier represented by Formula 1 to include a functional group derived from the modifier in at least one terminal of the polymer chain: 1—wherein R1 to R3 and n are described herein.
    Type: Application
    Filed: July 13, 2020
    Publication date: April 28, 2022
    Applicant: LG Chem, Ltd.
    Inventors: Dong Gil Lee, Soo Yong Lee, Seung Ho Choi, Won Mun Choi
  • Publication number: 20220102603
    Abstract: Provided is a method of fabricating a semiconductor package. The method of fabricating the semiconductor package include preparing a lower element including a lower substrate, a lower electrode, an UBM layer, and a reducing agent layer, providing an upper element including an upper substrate, an upper electrode, and a solder bump layer, providing a pressing member on the upper substrate to press the upper substrate to the lower substrate, and providing a laser beam passing through the pressing member to bond the upper element to the lower element.
    Type: Application
    Filed: August 11, 2021
    Publication date: March 31, 2022
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Kwang-Seong CHOI, Yong Sung EOM, Jiho JOO, Gwang-Mun CHOI, Seok-Hwan MOON, Chanmi LEE, Ki Seok JANG
  • Publication number: 20220077099
    Abstract: Provided is a composition for conductive adhesive. The composition for conductive adhesive includes a heterocyclic compound containing oxygen and including at least one of an epoxy group or oxetane group, a reductive curing agent including an amine group and a carboxyl group, and a photoinitiator, wherein a mixture ratio of the heterocyclic compound and the reductive curing agent satisfies Conditional Expression 1 below. 0.5?(b+c)/a?1.5, a>0, b?0, c>0??[Conditional Expression 1] where ‘a’ denotes a mole number of a heterocycle in the heterocyclic compound, ‘b’ denotes a mole number of hydrogen bonded to a nitrogen atom of the amine group included in the reductive curing agent, and ‘c’ denotes a mole number of the carboxyl group.
    Type: Application
    Filed: September 7, 2021
    Publication date: March 10, 2022
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Gwang-Mun CHOI, Yong-Sung EOM, Kwang-Seong CHOI, Jiho JOO, Ki-Seok JANG, Chanmi LEE
  • Publication number: 20220056172
    Abstract: The present invention relates to a modifier represented by Formula 1, a method of preparing the same, a modified conjugated diene-based polymer having a high modification ratio which includes a modifier-derived functional group, and a method of preparing the polymer.
    Type: Application
    Filed: November 5, 2021
    Publication date: February 24, 2022
    Applicant: LG Chem, Ltd.
    Inventors: Ji Eun Kim, Won Taeck Lim, Won Mun Choi, Dae June Joe
  • Patent number: 11230618
    Abstract: The present invention relates to a modifier represented by Formula 1, a method of preparing the same, a modified conjugated diene-based polymer having a high modification ratio which includes a modifier-derived functional group, and a method of preparing the polymer.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: January 25, 2022
    Inventors: Ji Eun Kim, Won Taeck Lim, Won Mun Choi, Dae June Joe
  • Publication number: 20210402525
    Abstract: Provided is a wire for electric bonding, which includes a solder wire and a composition for bonding adjacent to the solder wire, the solder wire is wet when reaches to a melting point as heat is transferred, the composition for bonding includes an epoxy resin, a reducing agent, and a curing agent, the reducing agent removes a metal oxide formed on a surface of the solder wire, and the epoxy resin is cured by chemically reacting with the reducing agent and the curing agent at a curing temperature.
    Type: Application
    Filed: June 30, 2021
    Publication date: December 30, 2021
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: GWANG-MUN CHOI, Yong Sung EOM, KWANG-SEONG CHOI, Jiho JOO, CHANMI LEE, Ki Seok JANG
  • Publication number: 20210320236
    Abstract: Provided is a method for transferring and bonding devices. The method includes applying an adhesive layer to a carrier, arranging a plurality of devices, attaching the arranged devices to the carrier, applying a polymer film to a substrate, aligning the carrier to which the plurality of devices are attached with the substrate, bonding the plurality of devices to the substrate by radiating laser, and releasing the carrier from the substrate to which the plurality of devices are bonded.
    Type: Application
    Filed: April 12, 2021
    Publication date: October 14, 2021
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Jiho JOO, Yong Sung EOM, GWANG-MUN CHOI, KWANG-SEONG CHOI, CHANMI LEE, Ki Seok JANG
  • Publication number: 20210252620
    Abstract: The present disclosure relates to a transfer and bonding method using a laser. As a plurality of devices or packages are simultaneously transferred onto a substrate from a transfer tape by irradiating a top surface of the transfer tape with a first laser, and the plurality of transferred devices or packages are simultaneously bonded to pads of a substrate by irradiating a top surface of the devices or packages with a second laser, a speed of a transfer and bonding process may be extremely maximized.
    Type: Application
    Filed: February 18, 2021
    Publication date: August 19, 2021
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: KWANG-SEONG CHOI, Yong Sung EOM, Jiho JOO, Seok-Hwan MOON, Ho-Gyeong YUN, Ki Seok JANG, GWANG-MUN CHOI
  • Publication number: 20210253767
    Abstract: A modified conjugated diene-based polymer represented by Formula 1, wherein a terminal of a polymer chain is modified, and a method for preparing same are provided. By including a modifier derived unit having a specific structure, a beta value affecting cold flow may be reduced through controlling the degree of branch, and accordingly, the cold flow of a polymer may be efficiently controlled and a mooney viscosity increasing ratio may be improved.
    Type: Application
    Filed: December 20, 2019
    Publication date: August 19, 2021
    Applicant: LG Chem, Ltd.
    Inventors: Soo Yong Lee, Dong Gil Lee, Won Mun Choi, Seung Ho Choi
  • Patent number: 11059927
    Abstract: The present invention relates to a substituted styrene-based compound represented by Formula 1 (refer to the specification and the scope of the claims), a method of preparing the styrene-based compound, a modified polymer including a functional group derived from the substituted styrene-based compound, a method of preparing the modified polymer, a rubber composition including the modified polymer, and a molded article manufactured from the rubber composition.
    Type: Grant
    Filed: December 1, 2016
    Date of Patent: July 13, 2021
    Inventors: Min Soo Kim, Won Mun Choi, Dae June Joe
  • Publication number: 20210206885
    Abstract: The present invention relates to a modification initiator and a modified conjugated diene-based polymer including the same, and more particularly, the present invention provides a modification initiator including a compound represented by Formula 1, a modified conjugated diene-based polymer including the same, and a method of preparing a modified conjugated diene-based polymer.
    Type: Application
    Filed: March 25, 2021
    Publication date: July 8, 2021
    Applicant: LG Chem, Ltd.
    Inventors: Min Soo Kim, Soo Yong Lee, Won Mun Choi
  • Patent number: 11021548
    Abstract: The present invention relates to a compound represented by Formula 1, a method for preparing the same, and a modified conjugated diene-based polymer having a high modification ratio and including a functional group derived from the compound.
    Type: Grant
    Filed: September 5, 2018
    Date of Patent: June 1, 2021
    Inventors: Seung Ho Choi, Ji Eun Kim, Won Mun Choi, Dae June Joe
  • Patent number: 10995157
    Abstract: The present invention relates to a modification initiator and a modified conjugated diene-based polymer including the same, and more particularly, the present invention provides a modification initiator including a compound represented by Formula 1, a modified conjugated diene-based polymer including the same, and a method of preparing a modified conjugated diene-based polymer.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: May 4, 2021
    Inventors: Min Soo Kim, Soo Yong Lee, Won Mun Choi
  • Patent number: 10858539
    Abstract: The present disclosure provides a hard-coating resin composition for a hard-coating having easy processability, flexibility and high surface hardness suitable for a hard-coating agent, in which a siloxane molecule having an inorganic material characteristic is chemically bonded with an epoxy group having an organic material characteristic to form one molecule, and the siloxane molecule is made to contain a various molecular weight distribution for dense crosslinking during polymerization of the epoxy group in order to obtain high surface hardness due to the inorganic material.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: December 8, 2020
    Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Byeong-Soo Bae, Ji-Hoon Ko, Gwang-Mun Choi
  • Publication number: 20200369804
    Abstract: The present invention relates to a modifier represented by Formula 1, a method of preparing the same, a modified conjugated diene-based polymer having a high modification ratio which includes a modifier-derived functional group, and a method of preparing the polymer.
    Type: Application
    Filed: August 14, 2020
    Publication date: November 26, 2020
    Applicant: LG Chem, Ltd.
    Inventors: Seung Ho Choi, Dae June Joe, Won Taeck Lim, Won Mun Choi
  • Publication number: 20200369790
    Abstract: The present invention relates to a compound represented by Formula 1, a method for preparing the same, and a modified conjugated diene-based polymer having a high modification ratio and including a functional group derived from the compound.
    Type: Application
    Filed: September 5, 2018
    Publication date: November 26, 2020
    Applicant: LG Chem, Ltd.
    Inventors: Seung Ho Choi, Ji Eun Kim, Won Mun Choi, Dae June Joe
  • Publication number: 20200362273
    Abstract: A cleaning liquid composition is provided. More particularly, a cleaning liquid composition includes a transition metal compound represented by Chemical Formula 1 (see the detailed description of the present invention); and a hydrocarbon-based solvent, and a cleaning method of a polymerization apparatus using the same.
    Type: Application
    Filed: August 29, 2018
    Publication date: November 19, 2020
    Applicant: LG Chem, Ltd.
    Inventors: Dae June Joe, Won Mun Choi, Eun Gyeong Lee