Patents by Inventor Mun Leong

Mun Leong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11965968
    Abstract: An optical sensing system comprising: a processing circuit; an optical sensor, configured to sense first optical data respectively in first sensing time intervals; and a TOF (Time of Flight) optical sensor, configured to sense second optical data respectively in second sensing time intervals. The processing circuit computes a distance between a first object and the optical sensing system according to the second optical data. The first sensing time intervals do not overlap with the second sensing time intervals.
    Type: Grant
    Filed: December 3, 2020
    Date of Patent: April 23, 2024
    Assignee: PixArt Imaging Inc.
    Inventors: Zi Hao Tan, Joon Chok Lee, Keen-Hun Leong, Sai Mun Lee
  • Publication number: 20230255286
    Abstract: Provided are nitrile gloves comprising manganese dioxide, that may have improved permeation resistance, especially improved permeation resistance against hydrogen peroxide. Provided also are methods for preparing the nitrile gloves and improving the permeation resistance of nitrile gloves.
    Type: Application
    Filed: August 2, 2021
    Publication date: August 17, 2023
    Inventors: Wei Kit Chee, Kam Hon @ Kwan Kam Onn Kuan, Mun Leong Kuan, Eu Jin Kuan, Fook Chuan Lai, Mei Ling Cheah, Sze Hui Lim
  • Patent number: 11271877
    Abstract: A chat message from a user to a primary chat bot service is received. A secondary chat bot service is automatically evaluated and selected to handle the chat message, wherein the secondary chat bot service is selected from a plurality of candidate secondary chat bot services that includes at least one chat bot service provided by a third-party entity external to an entity providing the primary chat bot service. The chat message is forwarded to the selected secondary chat bot service.
    Type: Grant
    Filed: July 16, 2020
    Date of Patent: March 8, 2022
    Assignee: ServiceNow, Inc.
    Inventors: Gaurav Goyal, Yong Liang, Vivien Wai Mun Leong, Shipra Gupta, Kakarla V V D L Narayana
  • Publication number: 20220021630
    Abstract: A chat message from a user to a primary chat bot service is received. A secondary chat bot service is automatically evaluated and selected to handle the chat message, wherein the secondary chat bot service is selected from a plurality of candidate secondary chat bot services that includes at least one chat bot service provided by a third-party entity external to an entity providing the primary chat bot service. The chat message is forwarded to the selected secondary chat bot service.
    Type: Application
    Filed: July 16, 2020
    Publication date: January 20, 2022
    Inventors: Gaurav Goyal, Yong Liang, Vivien Wai Mun Leong, Shipra Gupta, Kakarla V. V. D. L. Narayana
  • Patent number: 10103300
    Abstract: A light emitting device includes a light emitting element on a substrate, and a lens element that includes a cavity within which the light emitting element is situated, and is optically aligned with the light emitting element. A strip of adhesive that attaches the lens element to the substrate substantially surrounds the light emitting element, but includes a gap that facilitates release of material from the cavity during the attachment of the lens element to the substrate. When the lens element is placed upon the substrate, the adhesive is partially cured to provide a relatively high shear strength before the light emitting device is transported or subjected to other processes. To provide compatibility with subsequent processes or applications, and to protect the light emitting element from the environment, the gap in each device is sealed with a sealing material.
    Type: Grant
    Filed: May 12, 2015
    Date of Patent: October 16, 2018
    Assignee: Lumileds LLC
    Inventors: Chee Mun Leong, Li Lian Foong, Kwong Ho Tiong, Ruen Ching Law
  • Patent number: 9808039
    Abstract: The present invention reduces the minimum detectable volume of a piece of a glove in the detection using a metal detector. A glove made of a rubber or resin film which contains magnetic particles, wherein the quantity of the magnetic particles is 0.2 to less than 40 mass % relative to the whole of the film; and the magnetic particles comprise secondary particles formed by the agglomeration of primary particles.
    Type: Grant
    Filed: June 12, 2014
    Date of Patent: November 7, 2017
    Assignees: Midori Anzen Co. Ltd., Hartalega SDN BHD
    Inventors: Norihide Enomoto, Taichi Ogawa, Daisuke Hirama, Kam Hon Kuan, Mun Leong Kuan, Eu Jin Kuan, Mei Ling Cheah, Bin Mat Satar Mohd Zaidi
  • Publication number: 20170170108
    Abstract: Chip carriers having variably-sized solder pads, and integrated circuit packages incorporating such chip carriers are described. In an example, an integrated circuit package includes an integrated circuit electrically connected with a chip carrier having solder pads of different sizes. The integrated circuit may deliver high speed signals to smaller solder pads and low speed signals to larger solder pads. More particularly, the solder pads having smaller pad dimensions may better match impedance of a high speed signal line as compared to the solder pads having larger pad dimensions.
    Type: Application
    Filed: December 15, 2015
    Publication date: June 15, 2017
    Inventors: Chee Ling WONG, Chun Mun LAM, Lee WEI CHUNG, Mun Leong LOKE, Kang Eu ONG
  • Publication number: 20170047490
    Abstract: A light emitting device includes a light emitting element on a substrate, and a lens element that includes a cavity within which the light emitting element is situated, and is optically aligned with the light emitting element. A strip of adhesive that attaches the lens element to the substrate substantially surrounds the light emitting element, but includes a gap that facilitates release of material from the cavity during the attachment of the lens element to the substrate. When the lens element is placed upon the substrate, the adhesive is partially cured to provide a relatively high shear strength before the light emitting device is transported or subjected to other processes. To provide compatibility with subsequent processes or applications, and to protect the light emitting element from the environment, the gap in each device is sealed with a sealing material.
    Type: Application
    Filed: May 12, 2015
    Publication date: February 16, 2017
    Inventors: Chee Mun Leong, Li Lian Foong, Kwong Ho Tiong, Ruen Ching Law
  • Patent number: 9513294
    Abstract: A library of novel amino-triazolyl-BODIPY compounds is described. Particular compounds of the library serve as selective fluorescent probes for human serum albumin (HSA) and for live primary neurons. The fluorescent probe for HSA binds uniquely and specifically to the fatty acid site 1 of HSA, and thus proves a valuable and unique probe for drugs that bind to such a site on HSA. Methods of synthesis for the library compounds are also described.
    Type: Grant
    Filed: December 26, 2013
    Date of Patent: December 6, 2016
    Assignees: National University of Singapore, Agency for Science, Technology and Research
    Inventors: Young-Tae Chang, Jun Cheng Er, Cheryl Kit Mun Leong, Seong Wook Yun, Marc Vendrell Escobar, Mui Kee Tang
  • Patent number: 9423396
    Abstract: The present invention is directed to a fluorescence compound represented by structural Formula (I), with specificity to neural stem cells: (I), or a pharmaceutically acceptable salt thereof. The variables for structural Formula (I) are defined herein. Also described are methods for detection of beta cells, pancreatic islets and microglia cells, comprising using a compound of structural Formula (I) or pharmaceutically acceptable salts thereof. Compounds of structural Formula (I) can also differentiate healthy pancreatic islet cells from diabetic pancreatic islet cells.
    Type: Grant
    Filed: December 20, 2012
    Date of Patent: August 23, 2016
    Assignees: National University of Singapore, Agency for Science, Technology and Research
    Inventors: Young-Tae Chang, Sung Chan Lee, Nam-Young Kang, Seong Wook Yun, Cheryl Kit Mun Leong, Hyung Ho Ha
  • Patent number: 9397016
    Abstract: In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including receiving a coreless substrate strip, attaching solder balls to a backside of the coreless substrate strip, and forming a backside stiffening mold amongst the solder balls. Other embodiments are also disclosed and claimed.
    Type: Grant
    Filed: September 29, 2014
    Date of Patent: July 19, 2016
    Assignee: Intel Corporation
    Inventors: Weng Khoon Mong, A. Vethanayagam Rudge, Bok Sim Lim, Mun Leong Loke, Kang Eu Ong, Sih Fei Lim, Tean Wee Ong
  • Publication number: 20160150840
    Abstract: The present invention reduces the minimum detectable volume of a piece of a glove in the detection using a metal detector. A glove made of a rubber or resin film which contains magnetic particles, wherein the quantity of the magnetic particles is 0.2 to less than 40 mass % relative to the whole of the film; and the magnetic particles comprise secondary particles formed by the agglomeration of primary particles.
    Type: Application
    Filed: June 12, 2014
    Publication date: June 2, 2016
    Inventors: Norihide Enomoto, Taichi Ogawa, Daisuke Hirama, Kam Hon Kuan, Mun Leong Kuan, Eu Jin Kuan, Mei Ling Cheah, Bin Mat Satar Mohd Zaidi
  • Publication number: 20150309040
    Abstract: A library of novel amino-triazolyl-BODIPY compounds is described. Particular compounds of the library serve as selective fluorescent probes Human Serum Albumin (HSA) and for live primary neurons. The fluorescent probe for HSA binds uniquely and specifically to the fatty acid site 1 of HSA, and thus proves a valuable and unique probe for drugs that bind to such a site on HSA. Methods of synthesis for the library compounds are also described.
    Type: Application
    Filed: December 26, 2013
    Publication date: October 29, 2015
    Inventors: Young-Tae Chang, Jun Cheng Er, Cheryl Kit Mun Leong, Seong Wook Yun, Marc Vendrell Escobar, Mui Kee Tang
  • Publication number: 20150076692
    Abstract: In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including receiving a coreless substrate strip, attaching solder balls to a backside of the coreless substrate strip, and forming a backside stiffening mold amongst the solder balls. Other embodiments are also disclosed and claimed.
    Type: Application
    Filed: September 29, 2014
    Publication date: March 19, 2015
    Inventors: Weng Khoon Mong, A. Vethanayagam Rudge, Bok Sim Lim, Mun Leong Loke, Kang Eu Ong, Sih Fei Lim, Tean Wee Ong
  • Publication number: 20140359794
    Abstract: The present invention is directed to a fluorescence compound represented by structural Formula (I), with specificity to neural stem cells: (I), or a pharmaceutically acceptable salt thereof. The variables for structural Formula (I) are defined herein. Also described are methods for detection of beta cells, pancreatic islets and microglia cells, comprising using a compound of structural Formula (I) or pharmaceutically acceptable salts thereof. Compounds of structural Formula (I) can also differentiate healthy pancreatic islet cells from diabetic pancreatic islet cells.
    Type: Application
    Filed: December 20, 2012
    Publication date: December 4, 2014
    Inventors: Young-Tae Chang, Sung Chan Lee, Nam-Young Kang, Seong Wook Yun, Cheryl Kit Mun Leong, Hyung Ho Ha
  • Patent number: 8847368
    Abstract: In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including receiving a coreless substrate strip, attaching solder balls to a backside of the coreless substrate strip, and forming a backside stiffening mold amongst the solder balls. Other embodiments are also disclosed and claimed.
    Type: Grant
    Filed: August 31, 2012
    Date of Patent: September 30, 2014
    Assignee: Intel Corporation
    Inventors: Weng Khoon Mong, A. Vethanayagam Rudge, Bok Sim Lim, Mun Leong Loke, Kang Eu Ong, Sih Fei Lim, Tean Wee One
  • Publication number: 20120319276
    Abstract: In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including receiving a coreless substrate strip, attaching solder balls to a backside of the coreless substrate strip, and forming a backside stiffening mold amongst the solder balls. Other embodiments are also disclosed and claimed.
    Type: Application
    Filed: August 31, 2012
    Publication date: December 20, 2012
    Inventors: Weng Khoon Mong, A. Vethanayagam Rudge, Bok Sim Lim, Mun Leong Loke, Kang Eu Ong, Sih Fei Lim, Tean Wee One
  • Patent number: 8258019
    Abstract: In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including receiving a coreless substrate strip, attaching solder balls to a backside of the coreless substrate strip, and forming a backside stiffening mold amongst the solder balls. Other embodiments are also disclosed and claimed.
    Type: Grant
    Filed: June 30, 2008
    Date of Patent: September 4, 2012
    Assignee: Intel Corporation
    Inventors: Weng Khoon Mong, A. Vethanayagam Rudge, Bok Sim Lim, Mun Leong Loke, Kang Eu Ong, Sih Fei Lim, Tean Wee Ong
  • Publication number: 20090321928
    Abstract: In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including receiving a coreless substrate strip, attaching solder balls to a backside of the coreless substrate strip, and forming a backside stiffening mold amongst the solder balls. Other embodiments are also disclosed and claimed.
    Type: Application
    Filed: June 30, 2008
    Publication date: December 31, 2009
    Inventors: Weng Khoon Mong, A. Vethanayagam Rudge, Bok Sim Lim, Mun Leong Loke, Kang Eu Ong, Sih Fei Lim, Tean Wee Ong
  • Patent number: RE44629
    Abstract: The present invention involves a method of providing an integrated circuit package having a substrate with a vent opening. The integrated circuit package includes a substrate having an opening and an integrated circuit mounted to the substrate. An underfill material is dispensed between the substrate and the integrated circuit.
    Type: Grant
    Filed: November 30, 2004
    Date of Patent: December 10, 2013
    Assignee: Intel Corporation
    Inventors: Suresh Ramalingam, Nagesh Vodrahalli, Michael J. Costello, Mun Leong Loke, Ravi V. Mahajan