Patents by Inventor Mun Leong

Mun Leong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090309238
    Abstract: A molded flip chip package with enhanced adhesion between mold and die backside interface and the method of fabricating the package are described. The package is less prone to mold-die delamination. In an embodiment of the invention, the package has a die with a die frontside (die bottom side) attached to a substrate and a die backside (die top side). A first material is disposed on a portion of the die backside. A second material encapsulates the first material and the die backside.
    Type: Application
    Filed: June 13, 2008
    Publication date: December 17, 2009
    Inventor: Mun Leong Loke
  • Publication number: 20070205501
    Abstract: A method of packaging includes placing a restrainer on a package during processing. The method includes clipping the restrainer in place and then exposing the package to high temperatures. After processing the restrainer is removed. An alternative process attaches a component die to a substrate having a cavity in a first surface. The process may then include dispensing and curing an underfill material in the cavity, and attaching a lid to the first surface of the substrate.
    Type: Application
    Filed: March 19, 2007
    Publication date: September 6, 2007
    Applicant: Intel Corporation
    Inventors: Michael Lee, Mun Leong Loke, Soon Chuan Ong, Hooi Jin Teng, Lisa Lee, Altaf Hasan
  • Patent number: 7208342
    Abstract: A method of packaging includes placing a restrainer on a package during processing. The method includes clipping the restrainer in place and then exposing the package to high temperatures. After processing the restrainer is removed. An alternative process attaches a component die to a substrate having a cavity in a first surface. The process may then include dispensing and curing an underfill material in the cavity, and attaching a lid to the first surface of the substrate.
    Type: Grant
    Filed: May 27, 2004
    Date of Patent: April 24, 2007
    Assignee: Intel Corporation
    Inventors: Michael Keat Lye Lee, Mun Leong Loke, Soon Chuan Ong, Hooi Jin Teng, Lisa Yung Hui Lee, Altaf Hasan
  • Publication number: 20070062279
    Abstract: A system for measuring gait kinematics information during exercise of a subject comprising a fixing member adapted for fixing onto the trunk of the body of the subject; an acceleration sensor attached to the fixing member for sensing the vertical acceleration of the trunk of the body of the subject; and a microprocessor coupled to the acceleration sensor adapted to receive the vertical acceleration data from the acceleration sensor, and to compute and derive the speed and distance traversed by the subject, and to communicate the speed and distance information. In the preferred embodiment, a heart-rate monitoring device is also provided.
    Type: Application
    Filed: September 16, 2005
    Publication date: March 22, 2007
    Inventors: Raymond Chan, Mun Leong
  • Patent number: 7180377
    Abstract: A hybrid frequency synthesizer includes an analog phase lock loop (PLL), a digital PLL, and a control circuit to control an output oscillator. The control circuit assigns control of the output oscillator between the analog PLL and/or the digital PLL depending on a state of lock of the analog PLL and/or the digital PLL. During a frequency acquisition mode, the digital PLL provides a coarse control of the output oscillator. During a phase capture mode, the analog PLL provides a fine control and the digital PLL provides a coarse control of the output oscillator. During the phase capture mode, the analog PLL control signal and the digital PLL control signal may be given a percentage of control over the output oscillator depending on the state of lock of the analog PLL and/or the digital PLL. During a phase lock mode, the analog PLL controls the output oscillator.
    Type: Grant
    Filed: January 18, 2005
    Date of Patent: February 20, 2007
    Assignee: Silicon Clocks Inc.
    Inventors: Colin Wai Mun Leong, Jagdeep Singh Bal, Richard Miller
  • Patent number: 7084709
    Abstract: A hybrid frequency synthesizer includes an analog phase lock loop (PLL), a PLL, and a control circuit to control an output oscillator. The control circuit combines a control signal from the analog PLL with a control signal from the digital PLL to form a composite control signal. The composite control signal is conditioned depending on a state of lock of the analog PLL and/or the digital PLL. The composite signal controls the phase and frequency of the output oscillator. The analog control signal and the digital PLL control signal may be given a percentage of over the hybrid frequency synthesizer depending on the state of lock of the PLL and/or the digital PLL. The composite control signal provides both rapid, accurate, and robust acquisition by the digital PLL, and a smooth transition thereafter to low noise phase lock by the analog PLL.
    Type: Grant
    Filed: November 19, 2004
    Date of Patent: August 1, 2006
    Inventors: Colin Wai Mun Leong, Richard Miller, Jagdeep Singh Bal
  • Publication number: 20060010374
    Abstract: Systems and methods for defining at least one visual-display characteristic of at least one user-interface control are disclosed. In accordance with various embodiments of the invention, a dialog template specifies at least one style selector for the at least one user-interface control. A transformation module extracts the at least one style selector from the dialog template. A style sheet defines at least one visual-display-characteristic value that is applicable to the at least one user-interface control and that is associated with the at least one style selector. A style sheet-parsing engine uses the at least one style selector to retrieve the at least one visual-display-characteristic value from the style sheet. And a user-interface-control-drawing module draws the at least one user-interface control in accordance with the at least one visual-display-characteristic value retrieved by the style sheet-parsing engine.
    Type: Application
    Filed: July 9, 2004
    Publication date: January 12, 2006
    Applicant: Microsoft Corporation
    Inventors: Robert Corrington, Song Zou, Kathryn Rasmussen, Thomas Layson, Gamage Viriththamulla, Derek Westcott, Diane Shambaugh, Jalayne Boni, Seung Yang, Paul Cutsinger, Robert Rugge, Douglas Koenig, Nathan Bower, Mun Leong
  • Publication number: 20050044168
    Abstract: Remote sites are connected to a server located on a computer network. One or more of the remote sites sends a request to connect to the server. The server then provides one or more server processes to allow connection and subsequent transfer of data between the server and the remote site. After connection, the server provides for the collection of utilisation information concerning utilisation of one or more server resources. The utilisation information can be processed to provide for modification in the number of server processes to ensure that one or more of the resources used by the server operate at a pre-determined utilisation.
    Type: Application
    Filed: December 3, 2001
    Publication date: February 24, 2005
    Applicant: Agency for Science Technology and Research
    Inventors: Hwee Pang, Lim Wong, Mun Leong
  • Patent number: 6713366
    Abstract: A method that includes, obtaining a substrate, placing a reinforcing layer over a first side of the substrate; and thinning the substrate by removing material from an opposite side of the substrate.
    Type: Grant
    Filed: June 12, 2002
    Date of Patent: March 30, 2004
    Assignee: Intel Corporation
    Inventors: Weng Khoon Mong, Yew Wee Cheong, Eng Chiang Gan, Mun Leong Loke
  • Publication number: 20030235937
    Abstract: A method that includes, obtaining a substrate, placing a reinforcing layer over a first side of the substrate; and thinning the substrate by removing material from an opposite side of the substrate.
    Type: Application
    Filed: June 12, 2002
    Publication date: December 25, 2003
    Inventors: Weng Khoon Mong, Yew Wee Cheong, Eng Chiang Gan, Mun Leong Loke
  • Patent number: 6490166
    Abstract: The present invention involves a method of providing an integrated circuit package having a substrate with a vent opening. The integrated circuit package includes a substrate having an opening and an integrated circuit mounted to the substrate. An underfill material is dispensed between the substrate and the integrated circuit.
    Type: Grant
    Filed: June 11, 1999
    Date of Patent: December 3, 2002
    Assignee: Intel Corporation
    Inventors: Suresh Ramalingam, Nagesh Vodrahalli, Michael J. Costello, Mun Leong Loke, Ravi V. Mahajan
  • Publication number: 20020156869
    Abstract: A method for transferring one of a plurality of data stored in a sub-computer system to a target computer system using a mobile device is provided. In such a method, the mobile device initiates the process by sending instructions to a central computer system via a first network. The instructions designate a first piece of data to be transmitted as well as the target computer system to which the first piece of data is to be transmitted. According to the instructions, the central computer system retrieves the designated first piece of data from the sub-computer system. The first piece of data then is transmitted from the central computer system to the target computer system.
    Type: Application
    Filed: August 2, 2001
    Publication date: October 24, 2002
    Inventors: Mun Leong Wong, Ngee Chuan Tan, John Isaac Chandan Gomes, Gay Kheun Tan, Chuan Yew Ker