Abstract: Various pattern transfer and etching steps can be used to create features. Conventional photolithography steps can be used in combination with pitch-reduction techniques to form superimposed, pitch-reduced patterns of crossing elongate features that can be consolidated into a single layer. Planarizing techniques using a filler layer and a protective layer are disclosed. Portions of an integrated circuit having different heights can be etched to a common plane.

Abstract: The present invention is generally directed to a system for controlling placement of nanoparticles, and methods of using same. In one illustrative embodiment, the device includes a substrate and a plurality of funnels in the substrate, wherein each of the funnels comprises an inlet opening and an elongated, rectangular shaped outlet opening. In one illustrative embodiment, the method includes creating a dusty plasma comprising a plurality of carbon nanotubes, positioning a mask between the dusty plasma and a desired target for the carbon nanotubes, the mask having a plurality of openings extending therethrough, and extinguishing the dusty plasma to thereby allow at least some of the carbon nanotubes in the dusty plasma to pass through at least some of the plurality of openings in the mask and land on the target.

Abstract: A method of producing a compartment specification for an application, the method comprising executing the application; determining resource requests made by the executing application; and recording the resource requests in the compartment specification.

Abstract: Various pattern transfer and etching steps can be used to create features. Conventional photolithography steps can be used in combination with pitch-reduction techniques to form superimposed, pitch-reduced patterns of crossing elongate features that can be consolidated into a single layer. Planarizing techniques using a filler layer and a protective layer are disclosed. Portions of an integrated circuit having different heights can be etched to a common plane.

Abstract: Certain embodiments of the invention relate to an access control system for controlling access to file system objects stored in a digital file system store. The system provides a first compartment rule type for granting a first permission to an entity, associated with a respective compartment to which the rule is applied, to lookup a directory object in a directory path and list the contents of the said directory object, and a second compartment rule type for granting a second permission to an entity, associated with a respective compartment to which the rule is applied, to lookup a directory object in a directory path and not to list the contents of the said directory object.

Abstract: Methods of etching substrates employing a trim process for critical dimension control for integrated circuits are disclosed. In one embodiment, the method of etching includes providing a first hard mask layer over a target layer; providing a second hard mask layer over the first hard mask layer; providing a photoresist layer over the second hard mask layer; forming a pattern in the photoresist layer; transferring the pattern into the second hard mask layer; and trimming the second hard mask layer with the photoresist layer on top of the second hard mask layer. The top surface of the second hard mask layer is protected by the photoresist and the substrate is protected by the overlying first hard mask layer during the trim etch, which can therefore be aggressive.

Abstract: Methods of etching substrates employing a trim process for critical dimension control for integrated circuits are disclosed. In one embodiment, the method of etching includes providing a first hard mask layer over a target layer; providing a second hard mask layer over the first hard mask layer; providing a photoresist layer over the second hard mask layer; forming a pattern in the photoresist layer; transferring the pattern into the second hard mask layer; and trimming the second hard mask layer with the photoresist layer on top of the second hard mask layer. The top surface of the second hard mask layer is protected by the photoresist and the substrate is protected by the overlying first hard mask layer during the trim etch, which can therefore be aggressive.

Abstract: Methods of etching substrates employing a trim process for critical dimension control for integrated circuits are disclosed. In one embodiment, the method of etching includes providing a first hard mask layer over a target layer; providing a second hard mask layer over the first hard mask layer; providing a photoresist layer over the second hard mask layer; forming a pattern in the photoresist layer; transferring the pattern into the second hard mask layer; and trimming the second hard mask layer with the photoresist layer on top of the second hard mask layer. The top surface of the second hard mask layer is protected by the photoresist and the substrate is protected by the overlying first hard mask layer during the trim etch, which can therefore be aggressive.

Abstract: The present invention is generally directed to a system for controlling placement of nanoparticles, and methods of using same. In one illustrative embodiment, the device includes a substrate and a plurality of funnels in the substrate, wherein each of the funnels comprises an inlet opening and an elongated, rectangular shaped outlet opening. In one illustrative embodiment, the method includes creating a dusty plasma comprising a plurality of carbon nanotubes, positioning a mask between the dusty plasma and a desired target for the carbon nanotubes, the mask having a plurality of openings extending therethrough, and extinguishing the dusty plasma to thereby allow at least some of the carbon nanotubes in the dusty plasma to pass through at least some of the plurality of openings in the mask and land on the target.

Abstract: A method of producing a compartment specification for an application, the method comprising executing the application; determining resource requests made by the executing application; and recording the resource requests in the compartment specification.

Abstract: The present invention is generally directed to a system for controlling placement of nanoparticles, and methods of using same. In one illustrative embodiment, the device includes a substrate and a plurality of funnels in the substrate, wherein each of the funnels comprises an inlet opening and an elongated, rectangular shaped outlet opening. In one illustrative embodiment, the method includes creating a dusty plasma comprising a plurality of carbon nanotubes, positioning a mask between the dusty plasma and a desired target for the carbon nanotubes, the mask having a plurality of openings extending therethrough, and extinguishing the dusty plasma to thereby allow at least some of the carbon nanotubes in the dusty plasma to pass through at least some of the plurality of openings in the mask and land on the target.

Abstract: Certain embodiments of the invention relate to an access control system for controlling access to file system objects stored in a digital file system store. The system provides a first compartment rule type for granting a first permission to an entity, associated with a respective compartment to which the rule is applied, to lookup a directory object in a directory path and list the contents of the said directory object, and a second compartment rule type for granting a second permission to an entity, associated with a respective compartment to which the rule is applied, to lookup a directory object in a directory path and not to list the contents of the said directory object.

Abstract: Certain embodiments of the invention relate to an access control system defining one or more compartments and providing rules, which are applied to the compartment(s), to control access to network services by entities that are associated with a said compartment, the rules comprising at least a first kind of rule for controlling access to network services that use dynamically-assigned communications ports.

Abstract: The present invention discloses a method and system for processing accrual and redemption package offerings in loyalty programs. The method includes identifying a set of accrual package offerings, identifying a plurality of loyalty members satisfying a set of package conditions, calculating accruals for each of the plurality of loyalty members and crediting the loyalty member accounts, and identifying a set of loyalty partners and debiting loyalty partner accounts. The method and system of the present invention enables loyalty programs to fully automate the process of setting up and managing accruals and redemption packages. The present invention also discloses a method and system of recalculating the accrual transactions.

Abstract: A method for changing or migrating a voice messaging system comprises the steps of creating a new version of a mailbox for at least one user; and using the new version for a period of time before removing an old version of the mailbox. Significantly, the change or migration is effected such that there is substantially no system interruption. The changes may include making a software upgrade; moving a logical or physical device from a first location to a second location or from a first computer system to a second computer system; and making a change from a first version of the application to a second version. The migration may be a complete migration in which all devices are migrated or a partial migration in which only selected devices are migrated. Once the change or migration begins, any new inputs or calls to a device are routed first to the new application and, if the new application is not yet ready to receive the input, then to the old application.