Abstract: A wireless IC device processing a high-frequency signal is arranged in an electrical product main body, and an input-output terminal of the wireless IC device is coupled to at least a portion of a power cable externally extending from the electrical product main body

Abstract: In order to prevent the ingress of moisture into a void section of a component main body of a ceramic electronic component, at least the component main body of the ceramic electronic component is provided with water repellency using a water repellent agent. The water repellent agent is dissolved in a supercritical fluid such as, a supercritical CO2 fluid, as a solvent to provide at least the component main body with water repellency. After providing the water repellency, the water repellent agent on the outer surface of the component main body is removed. As the water repellent agent, a silane coupling agent may be used.

Abstract: An outer conductor portion includes an outer conductor and a pair of outer terminals. The outer conductor is formed into a substantially cylindrical shape extending in the z-axis direction. The outer terminals are drawn toward the positive z-axis direction side of the outer conductor. In a plan view in the z-axis direction, the outer terminals are each bent in a direction outwardly from the outer conductor, and face each other across the outer conductor. An insulator has two sides, an upper surface in contact with a positive z-axis direction-side end portion of the outer conductor, and a lower surface in contact with the outer terminals at the sides, and thereby is nipped by the outer conductor portion in the z-axis direction. A central conductor is attached to the insulator, and is provided in a region surrounded by the outer conductor.

Abstract: Provided is a laminated ceramic capacitor which produces excellent lifetime characteristics in a high-temperature loading test even when dielectric layers are reduced in thickness. The dielectric ceramic contains, as its main constituent, a compound represented by the general formula (Ba1-x-yCaxRey)(Ti1-zMz)O3 (where Re is at least one or more elements selected from among La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, and Y, and M is at least one or more elements selected from among Mg, Mn, Al, Cr, and Zn), 0?x?0.2, 0.002?y?0.1, and 0.001?z?0.05. This dielectric ceramic has crystal grains of 20 nm or more and 150 nm or less in average grain size.

Abstract: A wireless IC device that improves radiation gain without increasing substrate size and easily adjusts impedance, includes a multilayer substrate including laminated base layers. On a side of an upper or first main surface of the multilayer substrate, a wireless IC element is arranged to process a high-frequency signal. On a side of a lower or second main surface of the multilayer substrate, a first radiator is provided and is coupled to the wireless IC element via a feeding circuit including first interlayer conductors. On the side of the first main surface, a second radiator is provided and is coupled to the first radiator via second interlayer conductors.

Abstract: In a directional coupler, sub-lines or main lines are electromagnetically coupled to each other to degrade isolation characteristics. A capacitor is located between the sub-lines or between the main lines to cause the isolation characteristics to have poles in order to improve the isolation characteristics of the directional coupler.

Abstract: An ultrasonic generator that includes an ultrasonic generating element and a first acoustic path. The ultrasonic generating element includes a frame including a through hole in its central portion, a first transducer being flat-shaped and bonded to a first principal surface of the frame, and a second transducer being flat-shaped and bonded to a second principal surface of the frame and is configured to generate ultrasonic waves in a buckling tuning-fork vibration mode where the first transducer and the second transducer vibrate in mutually opposite phases. The first acoustic path is disposed so as to be adjacent to at least one of both principal surfaces of the ultrasonic generating element and configured to compress the ultrasonic waves generated from the ultrasonic generating element and to allow the ultrasonic waves to propagate therethrough in a direction along the principal surface of the ultrasonic generating element.

Abstract: A high-frequency module has a structure including balanced terminals, with high design flexibility and good transmission characteristics. Wiring patterns to be connected to balanced terminals of SAW filters of SAW duplexers are located on a second layer to a sixth layer of a layered body. The characteristic impedances of first wiring patterns defining a pair of parallel or substantially parallel lines match, the characteristic impedances of second wiring patterns defining a pair of parallel or substantially parallel lines match, the characteristic impedances of third wiring patterns defining a pair of parallel or substantially parallel lines match, and the characteristic impedances of fourth wiring patterns defining a pair of parallel or substantially parallel lines match.

Abstract: A stack is configured by stacking magnetic layers and non-magnetic layers, and has a rectangular-parallelepiped shape. A coil is provided in the stack, and has a coil axis that is substantially parallel to a stacking direction of the stack. The stacking direction and the coil axis are not parallel to sides that configure the stack.

Abstract: A method of manufacturing a boundary acoustic wave device includes the steps of forming an electrode on a first medium layer, forming a second medium layer so as to cover the electrode on the first medium layer, and forming a sound absorbing layer on an external surface of the second medium layer. The sound absorbing layer has an acoustic velocity of transverse waves that is lower than an acoustic velocity of transverse waves of the second medium layer.

Abstract: An electromagnetic-coupling module including a radio IC chip and a feeder circuit board on which the radio IC chip is mounted and a feeder circuit including a resonant circuit having a predetermined resonant frequency is attached to an article. The article has a radiation element that radiates a transmission signal supplied from the feeder circuit of the electromagnetic-coupling module via electromagnetic coupling and that supplies a received reception signal to the feeder circuit via the electromagnetic coupling.

Abstract: A resonant circuit and an antenna device achieve a low resonance frequency without increasing a coil size, and improve communication performance. In the resonant circuit, two coil-shaped conductors are arranged so as to be opposed to each other with a dielectric sheet interposed therebetween. The two coil-shaped conductors are, at the opposed portions thereof, coupled with a capacitance interposed therebetween, and wound so that electric currents flowing through the respective conductors trend in the same direction in a planar view. The opposed area in at least a portion of the outermost windings and/or innermost windings of the coil-shaped conductors is larger as compared with the opposed area in any other winding, and the respective ends of the conductors define power feeding units.

Abstract: A piezoelectric thin-film resonator includes a piezoelectric thin film which includes aluminum nitride containing Sc and which has a concentration distribution such that the concentration of Sc is non-uniform in a thickness direction of the piezoelectric thin film; a first electrode; a second electrode facing the first electrode across the piezoelectric thin film; and a substrate supporting a piezoelectric vibrating section defined by the piezoelectric thin film and the first and second electrodes.

Abstract: A capacitor arrangement assisting method wherein data entered by a user, such as the width w of a power supply wiring, the thickness h of a dielectric between the power supply wiring and a ground plane, the ESLcap of a capacitor, and a target frequency fT and a target impedance ZT of an IC, are received, the maximum allowable wiring length lmax of the power supply wiring is calculated on the basis of the received width w of the power supply wiring, the thickness h of the dielectric, the ESLcap of the capacitor, and the target impedance ZT of the IC at the target frequency fT, and the calculated maximum allowable wiring length lmax is displayed.

Abstract: Provided is a method for producing a piezoelectric thin-film element including a piezoelectric thin-film layer having good surface morphology and high crystallinity. The method includes forming a lower electrode layer on a substrate; forming a piezoelectric thin-film buffer layer on the lower electrode layer at a relatively low film-formation temperature; forming a piezoelectric thin-film layer on the piezoelectric thin-film buffer layer at a film-formation temperature that is higher than the film-formation temperature for the piezoelectric thin-film buffer layer; and forming an upper electrode layer on the piezoelectric thin-film layer.

Abstract: Unwanted radiation is reduced in a high-frequency signal transmission line that includes a ground conductor provided with an opening that overlaps a signal line. A dielectric element assembly has a relative dielectric constant ?1 and has a first principal surface and a second principal surface. A signal line is provided in the dielectric element assembly. A ground conductor is provided in the dielectric element assembly and on the first principal surface side with respect to the signal line, faces the signal line, and is provided with an opening that overlaps the signal line. A high dielectric constant layer has a relative dielectric constant ?2 higher than the relative dielectric constant ?1 and is provided on the first principal surface so as to overlap the opening.

Abstract: An antenna device which includes a coil conductor and a booster conductor. The coil conductor is defined by wound loop-shaped conductors and includes a first opening at a winding center and two ends connected to a feeding circuit. The booster conductor includes a coupling conductor portion and a frame-shaped radiation conductor portion. The coupling conductor portion includes a second opening overlapped at least partially by the first opening, is split in a portion thereof by a slit, and is electromagnetically coupled to the coil conductor. The frame-shaped radiation conductor portion includes a third opening and is connected to the coupling conductor portion.

Abstract: An external circuit is connected to a polarity detection terminal of a switching control IC. An increased value of the voltage of a pulse signal input to the polarity detection terminal at the time of the activation of a power supply changes in response to this external circuit. Accordingly, owing to the external circuit connected to the polarity detection terminal, the validity/invalidity of a standby mode is set. When the standby mode is validated, a blanking frequency changes in response to the voltage of a feedback terminal, and a switching loss in a light load is reduced. Accordingly, a switching control circuit and a switching power supply apparatus are configured that are able to set the validity/invalidity of the standby mode or select the method of the standby mode without using a dedicated terminal.

Abstract: In a directional coupler, a laminated body includes a plurality of insulator layers that are laminated to one another. A main line and a sub-line are embedded in the laminated body, include spiral-shaped portions including central axes parallel or substantially parallel to a z-axis direction, and are electromagnetically coupled to each other. The main line and the sub-line have the same or substantially the same shape and are provided within regions coinciding or substantially coinciding with each other in a y-axis direction.

Abstract: An antenna element having directionality in a zenith direction, which includes a first radiation electrode and a second radiation electrode which face each other across a slit on a cuboid dielectric block, is arranged closer to one of corners of a substrate and so as that a longer length direction thereof is aligned to one side of the substrate. A first end portion of the first radiation electrode is connected to a ground electrode of the substrate, and a first end portion of the second radiation electrode is directly connected to a feed portion of the substrate or through a capacitance. When the antenna element is to be mounted on a left corner of the substrate, a position of the slit on the dielectric block is shifted from a center of the dielectric block toward a center of an antenna element mounted side of the substrate.