Patents by Inventor MURATA MANUFACTURING CO., LTD.

MURATA MANUFACTURING CO., LTD. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130122347
    Abstract: A power storage device having: a laminated body formed by providing a separator layer between a first electrode which is one of a cathode and an anode and a second electrode which is the other electrode; an electrolyte; and a package which houses the laminated body and the electrolyte. At least two first electrode composite sheets are included which are each obtained by integrating a first collector electrode, a first electrode active material layer provided on one principal surface of the first collector electrode, and a separator layer covering at least part of the one principal surface, and the other principal surface of the first collector electrode of one first electrode composite sheet out of the at least two first electrode composite sheets is opposed to, and bonded to, the other principal surface of the first collector electrode of the other first electrode composite sheet.
    Type: Application
    Filed: December 28, 2012
    Publication date: May 16, 2013
    Applicant: Murata Manufacturing Co., Ltd.
    Inventor: Murata Manufacturing Co., Ltd.
  • Publication number: 20130119953
    Abstract: A DC-DC converter operates as a step-down chopper using a main switch element, a sub switch element, an inductor and a capacitor. A sub switch control signal generating circuit discharges a capacitor with a voltage that is proportional to a difference between a voltage of a power supply input unit and a voltage of a power supply output unit when a PGATE signal is at an “L” level, and charges the capacitor with a voltage that is proportional to the voltage of the power supply output unit when an NGATE signal is at an “H” level. The sub switch element is forcibly turned off and reverse flow of an inductor current is prevented even at the time of a light load as a result of the voltage of the capacitor being generated as an NCTL signal. Thus, reverse flow of an inductor current is prevented and a high-efficiency DC-DC converter is provided without the use of a high-speed comparator or any other kind of comparator.
    Type: Application
    Filed: January 7, 2013
    Publication date: May 16, 2013
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventor: MURATA MANUFACTURING CO., LTD.
  • Publication number: 20130112466
    Abstract: An electronic component in which a direction identification mark can be easily formed includes a laminate including a plurality of laminated insulating material layers and a mounting surface parallel or substantially parallel to a z-axis direction. A directional coupler including a main line and a sub-line is included in the laminate. A direction identification mark is provided on an upper surface of the laminate which is parallel or substantially parallel to the mounting surface, and is defined by a via-hole conductor portion, which is obtained by filling a via hole provided in the insulating material layers with a conductor, being exposed from the upper surface.
    Type: Application
    Filed: December 26, 2012
    Publication date: May 9, 2013
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventor: Murata Manufacturing Co., Ltd.
  • Publication number: 20130113595
    Abstract: A monolithic ceramic electronic component including coil conductors is capable of reducing the number of stacked ceramic layers without sacrifice of the performance of coils and be capable of increasing the number of turns of the coils without increasing the size in. In the monolithic ceramic electronic component, coil conductors having more than one turn for one ceramic layer are formed. The coil conductors include surface coil conductors that are located along surfaces of sequentially stacked ceramic layers and intra-layer coil conductors that are located inside the ceramic layers so as not to extend beyond the thickness of the individual ceramic layers. The surface coil conductors and the intra-layer coil conductors are connected in series with connecting portions therebetween.
    Type: Application
    Filed: December 26, 2012
    Publication date: May 9, 2013
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventor: MURATA MANUFACTURING CO., LTD.
  • Publication number: 20130113560
    Abstract: A high-frequency module including a power amplifying circuit includes a high-frequency power amplifying element, a matching circuit, and a driving power-supply circuit. The high-frequency power amplifying element includes a high-frequency amplifying circuit and a directional coupler. A first end of a main line of the directional coupler is connected to an output terminal of a latter-stage amplifying circuit of the high-frequency amplifying circuit. A second end of the main line of the directional coupler is connected through an output matching circuit to a high-frequency signal output terminal of the high-frequency power amplifying element. The output terminal of the latter-stage amplifying circuit is also connected to a second driving power-supply voltage application terminal of the high-frequency power amplifying element. The second driving power-supply voltage application terminal is connected to the high-frequency signal output terminal by a connecting conductor.
    Type: Application
    Filed: October 22, 2012
    Publication date: May 9, 2013
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventor: Murata Manufacturing Co., Ltd.
  • Publication number: 20130112754
    Abstract: A reader/writer antenna module includes a flexible substrate that includes a first base portion, a second base portion and a bending portion that connects the first base portion and the second base portion to each other. The flexible substrate has a structure that is folded by utilizing the flexibility of the bending portion such that a first main surface of the first base portion and a first main surface of the second base portion face each other, and a magnetic layer is provided between an antenna conductor and the chip component in the folded structure.
    Type: Application
    Filed: December 31, 2012
    Publication date: May 9, 2013
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventor: MURATA MANUFACTURING CO., LTD.
  • Publication number: 20130115810
    Abstract: An outer conductor has a substantially cylindrical shape extending in an axial direction. A center conductor has a substantially cylindrical shape extending in the axial direction, and is provided inside the outer conductor. An insulator fixes the center conductor relative to the outer conductor. The center conductor is provided with a hole that communicates with the inside and the outside of the center conductor. The insulator extends, via the hole, to the inside of the center conductor from the outside.
    Type: Application
    Filed: October 26, 2012
    Publication date: May 9, 2013
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventor: MURATA MANUFACTURING CO., LTD.
  • Publication number: 20130106529
    Abstract: In an electronic component, a main line includes a spiral-shaped portion having a central axis that is parallel or substantially parallel to a z-axis direction. A sub line is electromagnetically coupled with the main line to define a directional coupler, and includes a spiral-shaped portion having a central axis that is parallel or substantially parallel to the z-axis direction. Outer electrodes are provided on an end surface of a multilayer body and are respectively electrically connected to the two ends of the main line. Outer electrodes are provided on an end surface of the multilayer body and are respectively electrically connected to the two ends of the sub line. A region in which the main line is provided and a region in which the sub line is provided are superposed with each other in the z-axis stacking direction.
    Type: Application
    Filed: December 20, 2012
    Publication date: May 2, 2013
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventor: Murata Manufacturing Co., Ltd.
  • Publication number: 20130107579
    Abstract: A switching power supply apparatus includes a low-side switching control unit and a high-side switching control unit. The low-side switching control unit includes a low-side turn-off circuit that turns off a low-side switching element behind a delay time when reversal of the polarity of a winding voltage of a transformer is detected during a period in which a drive voltage signal is supplied to the low-side switching element. The high-side switching control unit includes a high-side turn-on delay circuit that delays a time from the time when the polarity of the winding voltage of the transformer is reversed to a time when a high-side switching element is turned on. The delay time of the low-side turn-off delay circuit is set so as to be shorter than the delay time of the high-side turn-on delay circuit.
    Type: Application
    Filed: October 26, 2012
    Publication date: May 2, 2013
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventor: Murata Manufacturing Co., Ltd.
  • Publication number: 20130105697
    Abstract: Provided is a light emitting ceramic such as a wavelength conversion ceramic or a radiation-to-light conversion ceramic, which emits light when radiation or light enters the ceramic, and which has a short light emission decay time. The light emitting ceramic is obtained by applying a heat treatment in a reducing atmosphere to a ceramic containing, as its main constituent, a pyrochlore compound represented by ABOw where A includes at least one of La, Y, Gd, Yb, and Lu, and 0 to 5 mol % of Bi; B is at least one of Sn, Zr, and Hf; and w is a positive number for maintaining electroneutrality.
    Type: Application
    Filed: November 29, 2012
    Publication date: May 2, 2013
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventor: MURATA MANUFACTURING CO., LTD.
  • Publication number: 20130108061
    Abstract: A piezoelectric device is provided with a sound source IC, an amplifier for amplifying a sound source from the sound source IC, a piezoelectric speaker for generating sound based on a drive signal from amplifier, an MPU for performing a predetermined control process on the drive signal, a memory for storing temperature dependency information about the piezoelectric constant (d14) and Young's modulus E of the piezoelectric speaker, and a temperature sensor for detecting an ambient temperature. MPU has correcting unit, compares a detected result of the temperature sensor with the temperature dependency information, and performs temperature correction on the drive signal serving as an acoustic signal based on a compared result. The piezoelectric speaker outputs the acoustic signal temperature-corrected by correcting unit.
    Type: Application
    Filed: December 20, 2012
    Publication date: May 2, 2013
    Applicants: A School Corporation Kansai University, MURATA MANUFACTURING CO., LTD.
    Inventors: MURATA MANUFACTURING CO., LTD., A School Corporation Kansai University
  • Publication number: 20130107418
    Abstract: A dielectric ceramic composition that contains, as its main constituent, (Ba1-x-yCaxSry)(Ti1-z-wZrzHfw)O3 (in the formula, 0?x+y?0.2, 0?z+w?0.1), and contains CuO and Bi2O3, and the dielectric ceramic composition has a feature that the total content of the CuO and Bi2O3 is 10 parts by weight or more with respect to 100 parts by weight of the main constituent, and the molar ratio CuO/(CuO+Bi2O3) is 0.5 or less.
    Type: Application
    Filed: December 14, 2012
    Publication date: May 2, 2013
    Applicant: Murata Manufacturing Co., Ltd.
    Inventor: Murata Manufacturing Co., Ltd.
  • Publication number: 20130099353
    Abstract: An ESD protection device includes a semiconductor substrate including input/output electrodes and a rewiring layer provided on a surface of the semiconductor substrate. An ESD protection circuit is provided on or in an outer layer of the semiconductor substrate, and the input/output electrodes are connected to the ESD protection circuit. The rewiring layer includes interlayer wiring lines, in-plane wiring lines, and post electrodes. First ends of the interlayer wiring lines disposed in the thickness direction are connected to the input/output electrodes disposed on the surface of the semiconductor substrate, and second ends of the interlayer wiring lines are connected to first ends of the in-plane wiring lines routed in plan view. Prismatic post electrodes are provided between second ends of the in-plane wiring lines and terminal electrodes.
    Type: Application
    Filed: November 30, 2012
    Publication date: April 25, 2013
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventor: Murata Manufacturing Co., Ltd.
  • Publication number: 20130099994
    Abstract: In an antenna apparatus, a first current is induced in a first booster conductor by a current flowing through a coil conductor of a power feed antenna, and the first current circulates along a circumference of the first booster conductor. A second current is induced in a second booster conductor by the current flowing through the coil conductor of the power feed antenna, and the second current circulates along a circumference of the second booster conductor. A third current is induced in the first booster conductor by the second current flowing through the second booster conductor, and the third current circulates along the circumference of the first booster conductor. Thus, the antenna apparatus is much less influenced by nearby metallic objects and a shape of an included radiation plate may be more freely determined without requiring a highly accurate positional relationship between the radiation plate and the coil conductor.
    Type: Application
    Filed: December 6, 2012
    Publication date: April 25, 2013
    Applicant: Murata Manufacturing Co., Ltd.
    Inventor: Murata Manufacturing Co., Ltd.
  • Publication number: 20130093536
    Abstract: A multilayer electronic component and a multilayer electronic component manufacturing method are capable of easily controlling the degree of magnetic field coupling between inductors. Via-hole conductors are arranged so that they extend in a lamination direction in a laminate, and function as a first inductor. Via-hole conductors are arranged so that they extend in the lamination direction in the laminate, and function as a second inductor. A first capacitor and the first inductor define a first resonance circuit. A second capacitor and the second inductor define a second resonance circuit. The via-hole conductors are arranged in a first insulating layer so that they are spaced apart from each other by a first distance. The via-hole conductors are arranged in a second insulating layer so that they are spaced apart from each other by a second distance that is different from the first distance.
    Type: Application
    Filed: November 30, 2012
    Publication date: April 18, 2013
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventor: MURATA MANUFACTURING CO., LTD.
  • Publication number: 20130092933
    Abstract: An ultraviolet sensor has a p-type semiconductor layer composed of a solid solution of NiO and ZnO, and an n-type semiconductor layer composed of ZnO and joined to the p-type semiconductor layer such that a part of the surface of the p-type semiconductor layer is exposed. In the p-type semiconductor layer, trivalent Ni is contained in a crystal grain in a state of being solid-solved with the solid solution of NiO and ZnO. The trivalent Ni can be contained in the crystal grain of the p-type semiconductor layer by adding NiOOH to NiO and ZnO, and firing the resulting mixture. Thereby, an inexpensive ultraviolet sensor capable of being downsized, which can easily detect the intensity of ultraviolet light by a photovoltaic power without utilizing a peripheral circuit can be realized.
    Type: Application
    Filed: December 6, 2012
    Publication date: April 18, 2013
    Applicant: Murata Manufacturing Co., Ltd.
    Inventor: MURATA MANUFACTURING CO., LTD.
  • Publication number: 20130093558
    Abstract: An electronic component that can be prevented from being shifted from a normal mount position and can be manufactured with a low cost is provided. The component is configured by stacking a plurality of insulating layers and a plurality of inner conductors provided on the respective insulating layers. The connection conductors have respective exposure portions that are each exposed between corresponding ones of the insulating layers at a surface of the stack. An outer electrode is formed, for example, by plating on the lower surface so that the exposure portions are covered with the outer electrode. The plurality of exposure portions do not have uniform thicknesses or are not arranged at uniform intervals in the stacking direction.
    Type: Application
    Filed: December 4, 2012
    Publication date: April 18, 2013
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventor: Murata Manufacturing Co., Ltd.
  • Publication number: 20130093557
    Abstract: A laminate has a structure in which magnetic layers and a non-magnetic layer containing glass are stacked. A coil is incorporated in the laminate. The magnetic permeability ?2 in portions (low-magnetic-permeability portions), of the magnetic layers, which are adjacent to the non-magnetic layer and into which the glass diffuses is lower than the magnetic permeability ?1 in portions (high-magnetic-permeability portions), of the magnetic layers, which are not adjacent to the non-magnetic layer.
    Type: Application
    Filed: October 12, 2012
    Publication date: April 18, 2013
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventor: MURATA MANUFACTURING CO., LTD.
  • Publication number: 20130092419
    Abstract: The multilayer substrate includes: a plurality of dielectric layers stacked on one another; a first conductor pattern 20 which is disposed along a principal surface 12a of a dielectric layer 12 and which is electrically connected to a ground; and second conductor patterns 22 and 24 which are disposed along the principal surface of a dielectric layer and which are opposed to the first conductor pattern 20 only through the dielectric layers therebetween, the second conductor patterns 22 and 24 forming inductor elements. Only the dielectric layers that sandwich the first conductor pattern 20 therebetween are bonded to each other via openings 20a through 20h formed in the first conductor pattern 20. As viewed from the stacking direction, the second conductor patterns substantially entirely overlap a portion other than the openings 20a through 20h in the first conductor pattern 20.
    Type: Application
    Filed: October 11, 2012
    Publication date: April 18, 2013
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventor: Murata Manufacturing Co., Ltd.
  • Publication number: 20130094163
    Abstract: A surface mount electronic component that includes a resin case, metal terminals, and a sealing metal plate that are molded integrally by insert molding. A hollow casing part and a through hole are formed in the case. The through hole leads from the hollow casing part to a surface of the case. The metal plate seals the through hole. The metal plate has a coefficient of linear expansion that is different from a coefficient of linear expansion of the case so that deformation to unseal the through hole occurs when heated.
    Type: Application
    Filed: December 6, 2012
    Publication date: April 18, 2013
    Applicant: Murata Manufacturing Co., Ltd.
    Inventor: MURATA MANUFACTURING CO., LTD.