Abstract: A method of making provides a smooth surface of a pinned or free layer interfacing a barrier layer in a tunnel junction sensor wherein the smooth surface is an oxidized monolayer of the pinned or free layer. After sputter depositing the pinned or free layer the layer is subjected to an oxygen (O2) atmosphere which is extremely low for a very short duration. In a preferred embodiment of the invention a partial thickness of the barrier layer is provided with a smooth surface by the same process after which a remainder thickness of the barrier layer is deposited and the barrier layer is exposed to oxygen (O2) to form an oxide of the deposited metal.

Abstract: A sputtering system is provided with a substrate and a sputtering material layer that are located in a sputtering chamber. The sputtering material layer has a sputtering surface where atoms of the material are sputtered and the substrate has a forming surface with a site where atoms of the sputtered material are to be formed. The sputtering material layer has a sputtering center which is located at a center of the atoms to be sputtered and the aforementioned site has a periphery with a forming center at a center of the periphery. The sputtering center is offset from the forming center so that shadowing at outer extremities of photoresist masks near the periphery of the substrate is minimized.

Abstract: In one illustrative example of the invention, a spin valve sensor includes a free layer structure; an antiparallel (AP) pinned layer structure; and a non-magnetic electrically conductive spacer layer in between the free layer structure and the AP pinned layer structure. The AP pinned layer structure includes a first AP pinned layer; a second AP pinned layer; and an antiparallel coupling (APC) layer formed between the first and the second AP pinned layer. One of the first and the second AP pinned layers consists of cobalt and the other one includes cobalt-iron. The pure cobalt may be provided in the first AP pinned layer or the second AP pinned layer. Advantageously, the use of cobalt in one of the AP pinned layers increases the ?r/R of the spin valve sensor.

Abstract: A GMR read head for a magnetic head, in which the hard bias layers are fabricated immediately next to the side edges of the free magnetic layer, and such that the midplane of the hard bias layer and the midplane of the free magnetic layer are approximately coplanar. The positioning of the hard bias layer is achieved by depositing a thick hard bias seed layer, followed by an ion milling step is to remove seed layer sidewall deposits. Thereafter, the hard bias layer is deposited on top of the thick seed layer. Alternatively, a first portion of the hard bias seed layer is deposited, followed by an ion milling step to remove sidewall deposits. A thin second portion of the seed layer is next deposited, and the hard bias layer is then deposited.

Abstract: A method for improving hard bias properties of layers of a magnetoresistance sensor is disclosed. Properties of the hard bias layer are improved using a seedlayer structure that includes at least a first layer of silicon and a second layer comprising chromium or chromium molybdenum. Further, benefits are achieved when the seedlayer structure includes a layer of tantalum.

Abstract: A method of making a read sensor which defines its stripe height before its trackwidth using photoresist layers formed without undercuts is disclosed. The photoresist layers are removed using chemical-mechanical polishing (CMP) lift-off techniques instead of using conventional solvents. In particular, a first photoresist layer is formed in a central region over a plurality of read sensor layers. End portions of the read sensor layers around the first photoresist layer are removed by ion milling to define the stripe height for the read sensor. Next, insulator layers are deposited where the end portions of the read sensor layers were removed. The first photoresist layer is then removed through mechanical interaction with a CMP pad. In subsequently defining the trackwidth for the read sensor, a second photoresist layer is formed in a central region over the remaining read sensor layers.

Abstract: An apparatus having improved hard bias properties of layers of a magnetoresistance sensor is disclosed. Properties of the hard bias layer are improved using a seedlayer structure that includes at least a layer of silicon and a layer comprising chromium or chromium molybdenum. Further, benefits are achieved when the seedlayer structure includes a layer of tantalum.

Abstract: In one illustrative example of the invention, a spin valve sensor of a magnetic head has a sensor stack structure which includes a free layer structure and an antiparallel (AP) pinned layer structure separated by a spacer layer. A capping layer structure formed over the sensor stack structure includes a layer of cobalt (e.g. pure cobalt, oxidized cobalt, or cobalt-iron) as well as a layer of tantalum formed over it. Advantageously, the cobalt layer in the capping layer structure enhances the GMR and soft magnetic properties for thinner freelayer structures while maintaining a desirable slightly negative magnetostriction.

Abstract: In one illustrative embodiment of the invention, a spin valve sensor of a magnetic head has a free layer structure; an antiparallel (AP) self-pinned layer structure; and a non-magnetic electrically conductive spacer layer in between the free layer structure and the AP self-pinned layer structure. The AP self-pinned layer structure includes a first AP pinned layer; a second AP pinned layer; an antiparallel coupling (APC) layer formed between the first and the second AP pinned layers. At least one of the first and the second AP pinned layers is made of cobalt having no iron content. The other AP pinned layer may be formed of cobalt, cobalt-iron, or other suitable material. The use of cobalt in the AP self-pinned layer structure increases its magnetostriction to increase the self-pinning effect. Preferably, the first AP pinned layer is cobalt-iron and the second AP pinned layer is cobalt which provides for both an increase in magnetostriction and magnetoresistive coefficient ?r/R of the sensor.

Abstract: A magnetic head includes a seed layer structure comprising Al2O3, Ta, and NiFeCr seed layers. An antiparallel (AP) pinned layer structure is formed above the NiFeCr seed layer. A free layer is positioned above the AP pinned layer structure.

Abstract: A magnetic head having a spin valve sensor that is fabricated utilizing an Al2O3, NiMn0, Si seed layer upon which a PtMn spin valve sensor layer structure is subsequently fabricated. In the preferred embodiment, the Si layer has a thickness of approximately 20 ? and the PtMn layer has a thickness of approximately 120 ?. An alternative fabrication process of the Si layer includes the overdeposition of the layer to a first thickness of from 15 ? to 45 ? followed by the etching back of the seed layer of approximately 5 ? to approximately 15 ? to its desired final thickness of approximately 20 ?. The Si layer results in an improved crystal structure to the subsequently fabricated PtMn and other spin valve sensor layers, such that the fabricated spin valve is thinner and exhibits increased ?R/R and reduced coercivity.

Abstract: A spin valve sensor includes an antiparallel (AP) pinned layer structure which is self-pinned without the assistance of an antiferromagnetic (AFM) pinning layer. A free layer of the spin valve sensor has first and second wing portions which extend laterally beyond a track width of the spin valve sensor and are exchange coupled to first and second AFM pinning layers. Magnetic moments of the wing portions of the free layer are pinned parallel to the ABS and parallel to major planes of the layers of the sensor for magnetically stabilizing the central portion of the free layer which is located within the track width.

Abstract: A method of forming a read sensor that has a very narrow track width is disclosed. The method involves forming a thin lift-off mask over a central region of a sensor layer, which is subsequently ion-milled and deposited with hard bias and lead layers. The thin lift-off mask is made by forming a release layer over the sensor layer; forming a hardmask layer over the release layer; forming a photoresist layer over the hardmask layer; imaging and developing the photoresist layer such that end portions of the photoresist layer are removed and a central portion of the photoresist layer remains; reactive ion etching (RIE) the hardmask layer such that end portions of the hardmask layer are removed and a central portion of the hardmask layer remains; stripping the central portion of the photoresist layer; and etching the release layer such that end portions of the release layer are removed and a central portion of the release layer remains.

Abstract: A spin valve sensor has an antiparallel (AP) pinned layer structure which has ferromagnetic first and second AP pinned layers that are separated by an antiparallel coupling layer. The first and second AP pinned layers are self-pinned antiparallel with respect to one another without the assistance of an antiferromagnetic (AFM) pinning layer. First and second hard bias layers interface first and second side surfaces of the spin valve sensor and the sensor has a central portion that extends between the first and second hard bias layers. First and second lead layers overlay the first and second hard bias layers and overlay first and second end portions of the central portion so that a distance between the first and second lead layers defines a track width that is less than a distance between the first and second hard bias layers.

Abstract: A spin valve sensor has an antiparallel (AP) pinned layer structure which has ferromagnetic first and second AP pinned layers that are separated by an antiparallel coupling layer. The first and second AP pinned layers are self-pinned antiparallel with respect to one another without the assistance of an antiferromagnetic (AFM) pinning layer. The spin valve sensor further includes an in-stack longitudinal biasing layer structure which is magnetostatically coupled to the free layer for longitudinally biasing a magnetic moment of the free layer parallel to an air bearing surface and parallel to major planes of the layers of the sensor. The only AFM pinning layer employed is in the biasing layer structure so that when the magnetic spins of the AFM pinning layer are set the orientations of the magnetic moments of the AP pinned layer structure are not disturbed.

Abstract: The present invention is directed towards increasing the conductivity of the electrical lead material in the read head portion of a magnetic head, such that thinner electrical leads can be fabricated while the current carrying capacity of the leads is maintained. This increase in electrical lead conductivity is accomplished by fabricating the electrical lead upon an epitaxially matched seed layer, such that the crystalline microstructure of the electrical lead material has fewer grain boundaries, whereby the electrical conductivity of the lead material is increased. In a preferred embodiment, the electrical lead material is comprised of Rh, which has an FCC crystal structure, and the seed layer is comprised of a metal, or metal alloy having a BCC crystal structure with unit cell lattice constant dimensions that satisfy the relationship that abcc is approximately equal to 0.816afcc. In various embodiments, the seed layer is comprised of VMo or VW.

Abstract: A method makes a spin valve sensor of a magnetic read head which includes the steps of forming a ferromagnetic pinned layer structure that has a magnetic moment, forming a pinning layer exchange coupled to the pinned layer structure for pinning the magnetic moment of the pinned layer structure, forming a free layer structure, forming a nonmagnetic electrically conductive spacer layer between the free layer and the pinned layer structure and the forming of the free layer structure including the step of sputter depositing at least a first free layer composed of cobalt iron directly on the spacer layer in a nitrogen atmosphere.

Abstract: A method includes forming a nonmagnetic electrically insulative read gap material layer, forming a sensor material layer on the read gap material layer, forming a mask on the sensor material layer with a width for defining a track width of the sensor, milling exposed portions of the sensor material layer to form a sensor with first and second side walls that are spaced apart by the track width and first and second read gap material layers, continuing to mill into the first and second read gap material layers to form the first and second read gap material layers with first and second depressions, forming first and second refill gap layers in the first and second depressions and on the first and second side walls of the sensor, milling portions of the first and second refill gap layers on the first and second side walls until at least a portion of each of the first and second side walls is exposed and electrically connecting first and second hard bias and lead layers to the first and second side walls.

Abstract: A magnetic read head has a current perpendicular to the planes (CPP) sensor with a top cap layer that is ruthenium (Ru) or rhodium (Rh) or a top cap layer structure which includes a first layer of tantulum (Ta) only, a second layer of ruthenium (Ru), rhodium (Rh) or gold (Au) with the first layer being located between a spacer layer and the second layer.

Abstract: A magnetic head including an electrical lead layer that is comprised of a material having an ordered crystalline structure. In a preferred embodiment, the ordered crystalline structure of the electrical lead is epitaxially matched to the crystalline structure of the hard bias layer upon which it is formed, and there is no need for a seed layer for the electrical leads. Electrical leads having an ordered crystalline structure, particularly a B2, L10, L11, L12 and D03 structure, will have significantly reduced resistivity over the prior art electrical leads that are typically composed of rhodium or tantalum. As a result, thinner electrical leads can be fabricated which carry the same, or even greater, current than the prior art rhodium or tantalum leads. The preferred leads are comprised of NiAl having a B2 crystalline structure, and alternative embodiments are comprised of CuAu, Cu3Au, Ni3Al and Fe3Al.