Patents by Inventor Mutsuya Takahashi
Mutsuya Takahashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11530785Abstract: A method for manufacturing a laminated substrate includes removing a portion not covered with a resist layer from a laminated substrate with an etchant to form a wiring, the laminated substrate including: a base layer including a mesa portion having a trapezoidal cross section, the mesa portion having a first inclined surface extending downward and outward from a top surface and a second inclined surface having an eaves-shaped portion protruding outward from the top surface; a wiring layer formed on an upper surface of the base layer; and the resist layer formed on an upper surface of the wiring layer and having a shape corresponding to a shape of the wiring, and the wiring is arranged at a position where the wiring covers a whole of the eaves-shaped portion of the second inclined surface.Type: GrantFiled: July 8, 2021Date of Patent: December 20, 2022Assignee: FUJIFILM Business Innovation Corp.Inventors: Seiji Ono, Yoshinao Kondo, Mutsuya Takahashi
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Publication number: 20220268407Abstract: A method for manufacturing a laminated substrate includes removing a portion not covered with a resist layer from a laminated substrate with an etchant to form a wiring, the laminated substrate including: a base layer including a mesa portion having a trapezoidal cross section, the mesa portion having a first inclined surface extending downward and outward from a top surface and a second inclined surface having an eaves-shaped portion protruding outward from the top surface; a wiring layer formed on an upper surface of the base layer; and the resist layer formed on an upper surface of the wiring layer and having a shape corresponding to a shape of the wiring, and the wiring is arranged at a position where the wiring covers a whole of the eaves-shaped portion of the second inclined surface.Type: ApplicationFiled: July 8, 2021Publication date: August 25, 2022Applicant: FUJIFILM Business Innovation Corp.Inventors: Seiji Ono, Yoshinao Kondo, Mutsuya Takahashi
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Patent number: 9802402Abstract: A method of manufacturing a heating device includes preparing a substrate having a curved surface; and forming a heating body on the substrate, the heating body generating heat with a supply of electric current. The forming of the heating body includes pressing a screen toward the substrate with an aid of a pressing member while rotating the substrate and moving the screen, and transferring application liquid that is to form the heating body to the substrate through the screen. In the forming of the heating body, the pressing member is in contact with the screen at a position on an upstream side with respect to a transfer position in a direction of movement of the screen.Type: GrantFiled: August 9, 2016Date of Patent: October 31, 2017Assignee: FUJI XEROX CO., LTD.Inventors: Kazuhiro Hayashi, Koichi Haga, Shuichi Yamada, Mutsuya Takahashi, Michiaki Murata
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Publication number: 20170253019Abstract: A method of manufacturing a heating device includes preparing a substrate having a curved surface; and forming a heating body on the substrate, the heating body generating heat with a supply of electric current. The forming of the heating body includes pressing a screen toward the substrate with an aid of a pressing member while rotating the substrate and moving the screen, and transferring application liquid that is to form the heating body to the substrate through the screen. In the forming of the heating body, the pressing member is in contact with the screen at a position on an upstream side with respect to a transfer position in a direction of movement of the screen.Type: ApplicationFiled: August 9, 2016Publication date: September 7, 2017Applicant: FUJI XEROX CO., LTD.Inventors: Kazuhiro HAYASHI, Koichi HAGA, Shuichi YAMADA, Mutsuya TAKAHASHI, Michiaki MURATA
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Patent number: 9735056Abstract: A semiconductor piece manufacturing method includes: a process of forming a groove on a front surface side including a first groove portion having a first width from a front surface of a substrate and a second groove portion that is positioned in a lower part that communicates with the first groove portion and has a second width larger than the first width; and a process of forming a groove on a rear surface side having a width greater than the first width along the second groove portion from a rear surface of the substrate by a rotating cutting member.Type: GrantFiled: October 26, 2015Date of Patent: August 15, 2017Assignee: FUJI XEROX CO., LTD.Inventors: Mutsuya Takahashi, Shuichi Yamada, Michiaki Murata
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Publication number: 20170212459Abstract: A fixing device includes a heating member that includes a substrate having a substantially flat portion and a recess in a surface on one side, a heating body provided on the substantially flat portion of the substrate and that generates heat with a supply of electric current, a resistive element provided in the recess of the substrate and that is connected in series to the heating body, the resistive element having a positive temperature coefficient, and a protective layer provided over the heating body and the resistive element and that protects the heating body and the resistive element; a belt member that is heated by being in contact with the surface, on the one side, of the substrate of the heating member, the belt member being rotatable; and a pressing member that is pressed against the belt member and forms a nip part.Type: ApplicationFiled: August 5, 2016Publication date: July 27, 2017Applicant: FUJI XEROX CO., LTD.Inventors: Shuichi YAMADA, Takehiro NIITSU, Koichi HAGA, Kazuhiro HAYASHI, Mutsuya TAKAHASHI, Michiaki MURATA
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Patent number: 9673080Abstract: A semiconductor piece manufacturing method includes: a process of forming a fine groove on a front surface side including a first groove portion having a width that is gradually narrowed from a front surface of a semiconductor substrate W toward a rear surface thereof; a process of attaching a dicing tape having an adhesive layer on the front surface after the fine groove on the front surface side is formed; a process of forming a groove on a rear surface side having a width greater than the width of the fine groove on the front surface side along the fine groove on the front surface side from a rear surface side of the substrate by a rotating dicing blade; and a process of separating the dicing tape from the front surface after the groove on the rear surface side is formed.Type: GrantFiled: March 30, 2016Date of Patent: June 6, 2017Assignee: FUJI XEROX CO., LTD.Inventors: Mutsuya Takahashi, Shuichi Yamada, Michiaki Murata
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Patent number: 9589812Abstract: A fabrication method of a semiconductor piece includes forming a groove that has a first groove portion, and a second groove portion which is a groove portion formed to communicate with a lower part of the first groove portion and extends toward a lower part at a steeper angle than an angle of the first groove portion, has a shape without an angle portion between the first groove portion and the second groove portion, is positioned on the front side, and is formed by dry etching; affixing a retention member including an adhesive layer to the surface in which the groove on the front side is formed; thinning the substrate from the back side of the substrate in a state in which the retention member is affixed; and removing the retention member from the surface after the thinning.Type: GrantFiled: October 15, 2015Date of Patent: March 7, 2017Assignee: FUJI XEROX CO., LTD.Inventors: Mutsuya Takahashi, Shuichi Yamada, Michiaki Murata
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Patent number: 9455173Abstract: A semiconductor piece manufacturing method includes: a process of forming a fine groove on a front surface side including a first groove portion having a width that is gradually narrowed from a front surface of a semiconductor substrate W toward a rear surface thereof; a process of attaching a dicing tape having an adhesive layer on the front surface after the fine groove on the front surface side is formed; a process of forming a groove on a rear surface side having a width greater than the width of the fine groove on the front surface side along the fine groove on the front surface side from a rear surface side of the substrate by a rotating dicing blade; and a process of separating the dicing tape from the front surface after the groove on the rear surface side is formed.Type: GrantFiled: October 16, 2015Date of Patent: September 27, 2016Assignee: FUJI XEROX CO., LTD.Inventors: Mutsuya Takahashi, Shuichi Yamada, Michiaki Murata
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Publication number: 20160211180Abstract: A semiconductor piece manufacturing method includes: a process of forming a fine groove on a front surface side including a first groove portion having a width that is gradually narrowed from a front surface of a semiconductor substrate W toward a rear surface thereof; a process of attaching a dicing tape having an adhesive layer on the front surface after the fine groove on the front surface side is formed; a process of forming a groove on a rear surface side having a width greater than the width of the fine groove on the front surface side along the fine groove on the front surface side from a rear surface side of the substrate by a rotating dicing blade; and a process of separating the dicing tape from the front surface after the groove on the rear surface side is formed.Type: ApplicationFiled: March 30, 2016Publication date: July 21, 2016Applicant: FUJI XEROX CO., LTD.Inventors: Mutsuya TAKAHASHI, Shuichi YAMADA, Michiaki MURATA
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Publication number: 20160133476Abstract: A fabrication method of a semiconductor piece includes forming a groove that has a first groove portion, and a second groove portion which is a groove portion formed to communicate with a lower part of the first groove portion and extends toward a lower part at a steeper angle than an angle of the first groove portion, has a shape without an angle portion between the first groove portion and the second groove portion, is positioned on the front side, and is formed by dry etching; affixing a retention member including an adhesive layer to the surface in which the groove on the front side is formed; thinning the substrate from the back side of the substrate in a state in which the retention member is affixed; and removing the retention member from the surface after the thinning.Type: ApplicationFiled: October 15, 2015Publication date: May 12, 2016Inventors: Mutsuya TAKAHASHI, Shuichi YAMADA, Michiaki MURATA
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Publication number: 20160056080Abstract: A semiconductor piece manufacturing method includes: a process of forming a groove on a front surface side including a first groove portion having a first width from a front surface of a substrate and a second groove portion that is positioned in a lower part that communicates with the first groove portion and has a second width larger than the first width; and a process of forming a groove on a rear surface side having a width greater than the first width along the second groove portion from a rear surface of the substrate by a rotating cutting member.Type: ApplicationFiled: October 26, 2015Publication date: February 25, 2016Applicant: FUJI XEROX CO., LTD.Inventors: Mutsuya TAKAHASHI, Shuichi YAMADA, Michiaki MURATA
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Publication number: 20160042997Abstract: A semiconductor piece manufacturing method includes: a process of forming a fine groove on a front surface side including a first groove portion having a width that is gradually narrowed from a front surface of a semiconductor substrate W toward a rear surface thereof; a process of attaching a dicing tape having an adhesive layer on the front surface after the fine groove on the front surface side is formed; a process of forming a groove on a rear surface side having a width greater than the width of the fine groove on the front surface side along the fine groove on the front surface side from a rear surface side of the substrate by a rotating dicing blade; and a process of separating the dicing tape from the front surface after the groove on the rear surface side is formed.Type: ApplicationFiled: October 16, 2015Publication date: February 11, 2016Applicant: FUJI XEROX CO., LTD.Inventors: Mutsuya TAKAHASHI, Shuichi YAMADA, Michiaki MURATA
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Patent number: 8585278Abstract: A micro fluidic device is provided, the micro fluidic device including: at least one first introduction pipe into which first fluid is introduced; at least one second introduction pipe into which second fluid is introduced, the second introduction pipe being disposed adjacent to the first introduction pipe; a common channel connected to the first introduction pipe and the second introduction pipe, wherein in the common channel the first fluid and the second fluid are mixed; and a first group of rectification parts, the rectification parts of the first group being provided individually for the first introduction pipe or the second introduction pipe and generating a helical flow in the first fluid and the second fluid, wherein the helical flow in the first fluid and the helical flow in the second fluid have a same circumferential direction.Type: GrantFiled: October 7, 2009Date of Patent: November 19, 2013Assignee: Fuji Xerox Co., Ltd.Inventors: Mutsuya Takahashi, Masaki Hirota, Takayuki Yamada
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Publication number: 20100229987Abstract: A micro fluidic device is provided, the micro fluidic device including: at least one first introduction pipe into which first fluid is introduced; at least one second introduction pipe into which second fluid is introduced, the second introduction pipe being disposed adjacent to the first introduction pipe; a common channel connected to the first introduction pipe and the second introduction pipe, wherein in the common channel the first fluid and the second fluid are mixed; and a first group of rectification parts, the rectification parts of the first group being provided individually for the first introduction pipe or the second introduction pipe and generating a helical flow in the first fluid and the second fluid, wherein the helical flow in the first fluid and the helical flow in the second fluid have a same circumferential direction.Type: ApplicationFiled: October 7, 2009Publication date: September 16, 2010Applicant: FUJI XEROX CO., LTD.Inventors: Mutsuya TAKAHASHI, Masaki HIROTA, Takayuki YAMADA
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Patent number: 7708950Abstract: A microfluidic device includes a processing layer and a temperature control layer. The processing layer applies a predetermined process to a subject fluid. The temperature control layer is disposed adjacent to the processing layer to give a predetermined temperature environment to the processing layer.Type: GrantFiled: August 18, 2005Date of Patent: May 4, 2010Assignee: Fuji Xerox Co., Ltd.Inventors: Takayuki Yamada, Kazuaki Tabata, Mutsuya Takahashi, Yoshihisa Yamazaki
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Patent number: 7632470Abstract: A microstructure includes first and second plates. The first plate defines a recess. The second plate is bonded to the first plate to block an opening of the recess to thereby form a closed vacuum space or a closed space filled with inert gas.Type: GrantFiled: August 18, 2005Date of Patent: December 15, 2009Assignee: Fuji Xerox Co., Ltd.Inventors: Kazuaki Tabata, Takayuki Yamada, Mutsuya Takahashi, Yoshihisa Yamazaki
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Patent number: 7473569Abstract: A manufacturing method for a three-dimensional structural body includes sequentially bonding/transferring and laminating plural cross-sectional form members, each held in space above a first substrate through a coupling member and a frame member and corresponding to a slice pattern of the three-dimensional structural body, onto a second substrate.Type: GrantFiled: February 3, 2004Date of Patent: January 6, 2009Assignee: Fuji Xerox Co., Ltd.Inventors: Daisuke Nagao, Takayuki Yamada, Mutsuya Takahashi, Hiroyuki Hotta, Takashi Ozawa, Teiichi Suzuki
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Publication number: 20070256774Abstract: A method of and system for manufacturing a microstructure having high form accuracy and a manufacturing system is disclosed. On a rough motion stage having a predetermined positioning accuracy and a large stroke length, a fine motion stage having a small stroke length and a higher positioning accuracy is placed. First, the rough motion stage is moved to a desired position. By use of a mirror placed on a laser length measuring machine and the fine motion stage, the current position of a thin film member on the fine motion stage is precisely measured. This measurement value is feed-backed to a stage control device, and a difference between the current position and a target position is calculated by an error correcting unit. Thus, an error correcting instruction value is generated to move the fine motion stage to the target position. Thus, an error of the rough motion stage is corrected.Type: ApplicationFiled: July 18, 2007Publication date: November 8, 2007Inventors: Takeshi Tsuno, Takayuki Goto, Satoshi Tawara, Masato Kinouchi, Shin Asano, Osamu Hasegawa, Takayuki Yamada, Mutsuya Takahashi
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Publication number: 20070065595Abstract: A substrate on which a plurality of thin films having a plurality of cross-sections corresponding to the cross-section of a micro-structure are formed is placed on a substrate holder. The substrate holder is elevated to bond a thin film formed on the substrate to the surface of a stage, and by lowering the substrate holder, the thin film is separated from the substrate and transferred to the stage side. The transfer process is repeated to laminate a plurality of thin films on the stage and to form the micro-structure. Accordingly, there are provided a micro-structure having high dimensional precision, especially high resolution in the lamination direction, which can be manufactured from a metal or an insulator such as ceramics and can be manufactured in the combined form of structural elements together, and a manufacturing method and an apparatus thereof.Type: ApplicationFiled: November 20, 2006Publication date: March 22, 2007Applicant: FUJI XEROX CO., LTD.Inventors: Takayuki Yamada, Mutsuya Takahashi, Masaki Nagata