Abstract: An array substrate including a display area having a plurality of subpixels is provided. The plurality of subpixels includes a plurality of first subpixels in a display-bonding sub-area and a plurality of second subpixels in a regular display sub-area. The array substrate includes a plurality of thin film transistors on a first side of the base substrate and respectively in the plurality of subpixels. A respective one of the plurality of first subpixels includes a bonding pad on a second side of a base substrate; a lead line electrically connecting a respective one of a plurality of thin film transistors to the bonding pad; and a via extending through the base substrate. The lead line is unexposed in the array substrate. The lead line extends from the first side to the second side of the base substrate through the via, to connect to the bonding pad.

Abstract: An array substrate, a method for preparing the array substrate, and a backlight module are disclosed. Before electroplating a first metal layer on a pattern of a seed layer, the method further includes: forming a pattern of a compensation electrode wire electrically connected with a lead electrode on a side, where the lead electrode is formed, of a base substrate. The compensation electrode wire is at least on a second side of a wiring region, the pattern of the lead electrode is formed at a first side of the wiring region, and the first side and the second side are different sides. In the electroplating process, the lead electrode is connected with a negative pole of a power supply, the compensation electrode wire is electrically connected with the lead electrode, thus an area of an electroplating negative pole generating electric field lines is increased by utilizing the compensation electrode wire.

Abstract: An array substrate including a display area having a plurality of subpixels is provided. The plurality of subpixels includes a plurality of first subpixels in a display-bonding sub-area and a plurality of second subpixels in a regular display sub-area. The array substrate includes a plurality of thin film transistors on a first side of the base substrate and respectively in the plurality of subpixels. A respective one of the plurality of first subpixels includes a bonding pad on a second side of a base substrate; a lead line electrically connecting a respective one of a plurality of thin film transistors to the bonding pad; and a via extending through the base substrate. The lead line is unexposed in the array substrate. The lead line extends from the first side to the second side of the base substrate through the via, to connect to the bonding pad.

Abstract: A display backboard and a manufacturing method thereof, and a display device are provided. The display backboard includes: a driving substrate; a plurality of driving electrodes on the driving substrate; and a plurality of connection structures respectively on the plurality of driving electrodes. The connection structure includes: at least one conductive component on the driving electrode; and a restriction component on a side of the driving electrodes provided with the at least one conductive component and in at least a part of a peripheral region of the at least one conductive component. The restriction component protrudes from the driving electrode and has a first height in a direction perpendicular to the driving substrate.

Abstract: A display backboard and a manufacturing method thereof, and a display device are provided. The display backboard includes: a driving substrate; a plurality of driving electrodes on the driving substrate; and a plurality of connection structures respectively on the plurality of driving electrodes. The connection structure includes: at least one conductive component on the driving electrode; and a restriction component on a side of the driving electrodes provided with the at least one conductive component and in at least a part of a peripheral region of the at least one conductive component. The restriction component protrudes from the driving electrode and has a first height in a direction perpendicular to the driving substrate.

Abstract: The present disclosure relates to an element pickup device, a method for manufacturing the same and a method for using the same. The element pickup device includes: a first substrate and a second substrate oppositely disposed; a spacing part located between the first substrate and the second substrate, wherein the spacing part is spaced apart from each other to define a flow channel for liquid; and an element pickup part including an opening located in the second substrate and in communication with the flow channel.

Abstract: The present disclosure relates to a method of manufacturing an array substrate. The method of manufacturing an array substrate may include forming a main via hole in a substrate, filling a first conductive material in the main via hole, and forming a pixel circuit layer on a first surface of the substrate. The pixel circuit layer may include a first via hole. An orthographic projection of the first via hole on the substrate may at least partially overlap the corresponding main via hole.

Abstract: The present disclosure relates to a display substrate, a display device, and a method for manufacturing a display substrate. The display substrate includes a base substrate having a first side and a second side opposite to the first side, a via provided in the base substrate, a thin film transistor provided on the first side of the base substrate, a first conductive structure provided on the first side of the base substrate, wherein a first sub-portion of the first conductive structure is located in the via, and wherein a material of the first conductive structure is the same as a material of a source/drain electrode of the thin film transistor.

Abstract: A display backboard and a manufacturing method thereof, and a display device are provided. The display backboard includes: a driving substrate; a plurality of driving electrodes on the driving substrate; and a plurality of connection structures respectively on the plurality of driving electrodes. The connection structure includes: at least one conductive component on the driving electrode; and a restriction component on a side of the driving electrodes provided with the at least one conductive component and in at least a part of a peripheral region of the at least one conductive component. The restriction component protrudes from the driving electrode and has a first height in a direction perpendicular to the driving substrate.

Abstract: A method for manufacturing an array substrate and an array substrate are provided. The method includes: providing a base substrate; forming a driving circuit layer at a side of the base substrate; and forming a functional device layer at a side of the driving circuit layer. Forming the driving circuit layer includes forming at least one first lead layer. Forming the first lead layer includes: forming a conductive seed layer at the side of the base substrate; forming a removable pattern-defining layer on a surface of the conductive seed layer, the removable pattern-defining layer being provided with a lead opening exposing a part of the conductive seed layer; forming, in the lead opening, a metal plating layer on the surface of the conductive seed layer; removing the removable pattern-defining layer; and removing a part of the conductive seed layer not covered by the metal plating layer.

Abstract: An array substrate and a manufacturing method thereof, a display device and a manufacturing method thereof are provided, which belong to the technical field of display. The array substrate includes: an interposer substrate, a fan-out region and a thin-film transistor disposed on one side of the interposer substrate, and a bonding connection line disposed on the other side of the interposer substrate. The bonding connection line includes a first lead and a second lead that are insulated from each other. The interposer substrate is provided with a first interposer via hole and a second interposer via hole. The first lead is electrically connected to the thin-film transistor by a conductive structure in the first interposer via hole and the fan-out region, and the second lead is electrically connected to the thin-film transistor by a conductive structure in the second interposer via hole and the fan-out region.

Abstract: A light-emitting diode (LED) chip includes a plurality of epitaxial structures, at least one first electrode, and a plurality of second electrodes. Any two adjacent epitaxial structures of the plurality of epitaxial structures have a gap therebetween. Each epitaxial structure includes a first semiconductor pattern, a light-emitting pattern and a second semiconductor pattern stacked in sequence. First semiconductor patterns in at least two of the plurality of epitaxial structures are connected to each other to form a first semiconductor layer. A first electrode is electrically connected to the first semiconductor layer. Each second electrode is electrically connected to the second semiconductor pattern in at least one of the plurality of epitaxial structures.

Abstract: An array substrate and a manufacturing method thereof, a display device and a manufacturing method thereof are provided, which belong to the technical field of display. The array substrate includes: an interposer substrate, a thin-film transistor disposed on one side of the interposer substrate, and a bonding connection line embedded in the other side of the interposer substrate. The bonding connection line is configured to be connected to a drive circuit. An interposer via hole is arranged on the interposer substrate. A conductive structure is arranged in the interposer via hole. The thin-film transistor is electrically connected to the bonding connection line by the conductive structure.

Abstract: The disclosure relates to the technical field of display devices and discloses a display substrate, a splicing screen and a manufacturing method thereof. The display substrate includes a flexible substrate; a plurality of signal lines located at one side of the flexible substrate; a plurality of plating electrodes located at one side of the signal lines toward the flexible substrate and electrically connected to the signal lines in one-to-one correspondence; a plurality of first through holes in one-to-one correspondence to the plating electrodes and penetrating the flexible substrate and exposing the plating electrodes, the first through roles being filled with a conductive material inside; and a plurality of binding electrodes located at one side of the flexible substrate away from the signal lines and in one-to-one correspondence to the first through holes, the binding electrodes being electrically connected to corresponding plating electrode through conductive material in corresponding first through hole.

Abstract: Provided are a display structure and a preparation method thereof, and a display apparatus. The display structure includes a flexible back plate and a display substrate which are stacked, the flexible back plate including a bonding electrode for bonding to an integrated circuit chip, and the flexible back plate being bent to form a bent portion on which the bonding electrode is located.

Abstract: Disclosed are a connecting substrate and a fabrication method, a splicing screen, and a display apparatus. The connecting substrate has panel areas (10) and connecting areas (30) connecting every two adjacent panel areas (10), each panel area including a display area (20) surrounded by the connecting areas (30). The connecting substrate includes, in connecting area: a base (101); connecting wirings (102) on the base (101); an insulating layer (103) covering the plurality of connecting wirings (102) and defining a groove (106) for accommodating a display panel (107) to be spliced; through holes (105) penetrating the insulating layer (103); and connecting electrodes (104) respectively provided in the through holes (105) and coupled to the connecting wirings (102) in one-to-one correspondence. The connecting electrodes (104) are coupled to first pads (P1) on light-emitting surface of the display panel (107) to be spliced in one-to-one correspondence.

Abstract: A method of manufacturing a driving backplane for display includes: forming a first conductive pattern layer including first conductive lines on a base; and forming a second conductive pattern layer including electrode groups and second conductive lines on a side of the first conductive pattern layer away from the base. The first conductive lines and the second conductive lines cross and are insulated from each other; an electrode group includes a first electrode and a second electrode electrically connected to a corresponding second conductive line. Orthogonal projections, on the base, of the first electrode and a corresponding first conductive line have an overlapping region, and a portion of the first electrode, whose orthogonal projection on the base is located in the overlapping region, is in contact with a portion of the first conductive line, whose orthogonal projection on the base is located in the overlapping region.

Abstract: Disclosed herein is a photoelectric sensor, display panel and their manufacturing method. The photoelectric sensor may comprise a photodeformable unit and a piezoelectric unit in contact with the photodeformable unit.

Abstract: A display substrate, a manufacturing method thereof and a display apparatus are provided. The display substrate includes a base substrate structure and a display structure on the base substrate structure, the display structure includes a plurality of light emitting units and is divided into multiple light-transmissive regions and multiple opaque regions; and a driving circuit for driving the display structure to display and comprising a pixel driving circuit between the base substrate structure and the display structure, and a peripheral circuit driving the pixel driving circuit and arranged on a side of the base substrate structure distal to the display structure and in the opaque regions, and the peripheral circuit is coupled to the pixel driving circuit through at least one through hole formed in the base substrate structure. The display substrate can realize frameless display, which is beneficial to realize seamless splicing display of a plurality of display substrates.

Abstract: A display substrate and a display device are provided. The display substrate includes a backplane including a plurality of pixel regions; and light emitting units arranged in one-to-one correspondence with the plurality of pixel regions. Each light emitting unit includes light emitting sub-units arranged in a plurality of rows and a plurality of columns, each row of light emitting sub-units includes a plurality of light emitting sub-units arranged along a row direction, each column of light emitting sub-units includes one light emitting sub-unit, and orthographic projections of light emitting regions of two adjacent columns of light emitting sub-units on a first straight line extending along a column direction are not overlapped; and in each light emitting unit, there is no gap between orthographic projections of the light emitting regions of the two adjacent columns of light emitting sub-units on a second straight line extending along the row direction.