Patents by Inventor Muxin Di

Muxin Di has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200411566
    Abstract: The present disclosure provides a display backplane and a method for manufacturing the same, a display panel and a display device, and relates to the field of display technology. The display backplane includes a first backplane and a second backplane. The first backplane includes a first substrate, and a first thin film transistor, on the first substrate, configured to drive a light emitting unit. The second backplane, which is attached to a surface of the first substrate facing away from the first thin film transistor, includes a second substrate and at least one second thin film transistor located between the second substrate and the first substrate.
    Type: Application
    Filed: January 9, 2019
    Publication date: December 31, 2020
    Inventors: Zhiwei LIANG, Yingwei LIU, Haixu LI, Muxin DI, Qingzhao LIU
  • Publication number: 20200328266
    Abstract: The present disclosure relates to a method of manufacturing an array substrate. The method of manufacturing an array substrate may include forming a main via hole in a substrate, filling a first conductive material in the main via hole, and forming a pixel circuit layer on a first surface of the substrate. The pixel circuit layer may include a first via hole. An orthographic projection of the first via hole on the substrate may at least partially overlap the corresponding main via hole.
    Type: Application
    Filed: November 13, 2019
    Publication date: October 15, 2020
    Applicant: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Yingwei Liu, Qi Yao, Ke Wang, Zhanfeng Cao, Zhiwei Liang, Muxin Di, Guangcai Yuan, Xue Jiang, Dongni Liu
  • Publication number: 20200273786
    Abstract: Embodiments of the present disclosure provide an array substrate, a display device, a method for manufacturing an array substrate, a method for manufacturing a display device, and a spliced display device. The array substrate includes: a base substrate in which a through hole is provided; a filling portion disposed in the through hole, including a recessed structure and made from a flexible material; an electrically conductive pattern disposed on the filling portion and at least partially located in the recessed structure; and a film layer disposed on a side of the electrically conductive pattern facing away from the base substrate.
    Type: Application
    Filed: August 2, 2019
    Publication date: August 27, 2020
    Inventors: Muxin Di, Zhiwei Liang, Yingwei Liu, Ke Wang, Zhanfeng Cao, Renquan Gu, Qi Yao, Jaiil Ryu
  • Patent number: 10726237
    Abstract: A fingerprint identification sensor, a method of fabricating the same, and a fingerprint identification apparatus are provided. The fingerprint identification sensor includes: a substrate; a plurality of sensor units on the substrate, each of the sensor units comprising a thin film transistor and a photosensitive device; wherein the thin film transistor comprises a source and a drain, an active layer and a gate, the source and the drain being arranged substantially in a direction perpendicular to the substrate surface.
    Type: Grant
    Filed: August 17, 2018
    Date of Patent: July 28, 2020
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Zhiwei Liang, Yingwei Liu, Wenqian Luo, Qingzhao Liu, Muxin Di
  • Publication number: 20200135775
    Abstract: Embodiments of the present disclosure provide a display substrate, a method for manufacturing a display substrate, and a display device. The method for manufacturing the display substrate includes: providing a seed layer on a first carrier substrate and forming a base substrate covering the seed layer; forming a first connection terminal on a side of the base substrate away from the first carrier substrate, the first connection terminal electrically connecting to the seed layer; removing the first carrier substrate to expose the seed layer; and forming a second connection terminal electrically connecting to the seed layer.
    Type: Application
    Filed: October 29, 2019
    Publication date: April 30, 2020
    Inventors: Hua Huang, Changhan Hsieh, Muxin Di, Xiaoyan Zhu
  • Publication number: 20200042761
    Abstract: A fingerprint identification sensor, a method of fabricating the same, and a fingerprint identification apparatus are provided. The fingerprint identification sensor includes: a substrate; a plurality of sensor units on the substrate, each of the sensor units comprising a thin film transistor and a photosensitive device; wherein the thin film transistor comprises a source and a drain, an active layer and a gate, the source and the drain being arranged substantially in a direction perpendicular to the substrate surface.
    Type: Application
    Filed: August 17, 2018
    Publication date: February 6, 2020
    Inventors: Zhiwei Liang, Yingwei Liu, Wenqian Luo, Qingzhao Liu, Muxin Di