Abstract: A cooling system for efficiently cooling large-scale data storage devices embedded in a vehicle, and a smart vehicle including the same are disclosed. The storage device cooling system includes a storage housing section located at a ceiling-mounted structure of a vehicle, provided with an indoor space thereof in which a plurality of storage devices is kept and an opening/closing device configured to open or close the indoor space, a sensing circuit configured to detect a temperature of the indoor space, and an opening/closing controller configured to control operations of the opening/closing device in response to the temperature detected by the sensing circuit.

Abstract: A semiconductor module includes a module board, an interposer on the module board, and a processing device and a memory stack that are disposed side by side on the interposer, wherein the memory stack includes a base die, and a memory die on the base die, wherein the memory die includes an outer bank region, a central TSV region, first and second inner bank regions, and a first non-central TSV region, wherein the central TSV region is disposed between the outer bank region and the second inner bank region, and the first non-central TSV region is disposed between the first inner bank region and the second inner bank region.

Abstract: A semiconductor apparatus may include: a pad unit including a plurality of pads; a memory cell array coupled to the pad unit through input/output signal lines; and a pad configuration control circuit configured to change a pad configuration of the pad unit by dividing the plurality of pads into a plurality of groups and setting the plurality of groups to different modes, respectively.

Abstract: A memory module may include: a plurality of stacked memory chips; a memory controller; and an interposer connected between the plurality of memory chips and the memory controller.