Abstract: A method for manufacturing an electronic device including a semiconductor memory may include forming a first carbon electrode material, surface-treating the first carbon electrode material to decrease a surface roughness of the first carbon electrode material, and forming a second carbon electrode material on the treated surface of the first carbon electrode material. The second carbon electrode material may have a thickness that is greater than a thickness of the first carbon electrode material.

Abstract: A method for manufacturing an electronic device including a semiconductor memory may include forming a first carbon electrode material, surface-treating the first carbon electrode material to decrease a surface roughness of the first carbon electrode material, and forming a second carbon electrode material on the treated surface of the first carbon electrode material. The second carbon electrode material may have a thickness that is greater than a thickness of the first carbon electrode material.

Abstract: A method for manufacturing an electronic device including a semiconductor memory may include forming a first carbon electrode material, surface-treating the first carbon electrode material to decrease a surface roughness of the first carbon electrode material, and forming a second carbon electrode material on the treated surface of the first carbon electrode material. The second carbon electrode material may have a thickness that is greater than a thickness of the first carbon electrode material.

Abstract: A method for manufacturing an electronic device including a semiconductor memory may include forming a first carbon electrode material, surface-treating the first carbon electrode material to decrease a surface roughness of the first carbon electrode material, and forming a second carbon electrode material on the treated surface of the first carbon electrode material. The second carbon electrode material may have a thickness that is greater than a thickness of the first carbon electrode material.

Abstract: An electronic device includes a semiconductor memory. The semiconductor memory includes a write circuit and a memory cell. The write circuit is suitable for generating a first write current having a lower level than a melting current and a second write current having a higher level than the melting current during a set program operation. The memory cell is suitable for storing a data value corresponding to a write data signal, based on the first and second write currents.

Abstract: A method for manufacturing an electronic device including a semiconductor memory may include forming a first carbon electrode material, surface-treating the first carbon electrode material to decrease a surface roughness of the first carbon electrode material, and forming a second carbon electrode material on the treated surface of the first carbon electrode material. The second carbon electrode material may have a thickness that is greater than a thickness of the first carbon electrode material.

Abstract: An electronic device may include a semiconductor memory. The semiconductor memory may include: a first variable resistance layer including antimony (Sb); a second variable resistance layer including antimony (Sb) with a content different from that of the first variable resistance layer, the second variable resistance layer having a crystallization speed different from that of the first variable resistance layer; and a first electrode interposed between the first variable resistance layer and the second variable resistance layer.

Abstract: A semiconductor memory includes: a first line; a second line spaced apart from the first line and extending in a first direction; a third line spaced apart from the second line and extending in a second direction; a first memory cell disposed between the first and second lines at an intersection region of the first and second lines, the first memory cell including a first selection element layer, a first electrode, and a first insert electrode interposed between the first selection element layer and the first electrode; and a second memory cell disposed between the second and third lines at an intersection region of the second and third lines, the second memory cell including a second selection element layer, a second electrode, and a second insert electrode interposed between the second selection element layer and the second electrode.

Abstract: A method for manufacturing an electronic device including a semiconductor memory may include forming a first carbon electrode material, surface-treating the first carbon electrode material to decrease a surface roughness of the first carbon electrode material, and forming a second carbon electrode material on the treated surface of the first carbon electrode material. The second carbon electrode material may have a thickness that is greater than a thickness of the first carbon electrode material.

Abstract: An electronic device may include a semiconductor memory. The semiconductor memory may include: a first variable resistance layer including antimony (Sb); a second variable resistance layer including antimony (Sb) with a content different from that of the first variable resistance layer, the second variable resistance layer having a crystallization speed different from that of the first variable resistance layer; and a first electrode interposed between the first variable resistance layer and the second variable resistance layer.

Abstract: An electronic device includes a semiconductor memory. The semiconductor memory includes a write circuit and a memory cell. The write circuit is suitable for generating a first write current having a lower level than a melting current and a second write current having a higher level than the melting current during a set program operation. The memory cell is suitable for storing a data value corresponding to a write data signal, based on the first and second write currents.

Abstract: A semiconductor memory includes: a first line; a second line spaced apart from the first line and extending in a first direction; a third line spaced apart from the second line and extending in a second direction; a first memory cell disposed between the first and second lines at an intersection region of the first and second lines, the first memory cell including a first selection element layer, a first electrode, and a first insert electrode interposed between the first selection element layer and the first electrode; and a second memory cell disposed between the second and third lines at an intersection region of the second and third lines, the second memory cell including a second selection element layer, a second electrode, and a second insert electrode interposed between the second selection element layer and the second electrode.

Abstract: A semiconductor memory includes: a first line; a second line; a third line; a first memory cell disposed between the first line and the second line at an intersection region of the first line and the second line, the first memory cell including a first selection element layer and a first electrode coupled to the first selection element layer; and a second memory cell disposed between the second line and the third line at an intersection region of the second line and third second line, the second memory cell including a second selection element layer and a second electrode coupled to the second selection element layer. A threshold voltage of the first selection element layer is greater than a threshold voltage of the second selection element layer, and a resistance of the second electrode is greater than a resistance of the first electrode.

Abstract: An electronic device includes a semiconductor memory. The semiconductor memory includes a write circuit suitable for generating a first write current at a first point of time corresponding to pre-write latency that is shorter than write latency and generating a second write current at a second point of time corresponding to the write latency, based on a write command signal, a write data signal, and a latency information signal, and a memory cell array suitable for storing a data value corresponding to the write data signal based on the first and second write currents.

Abstract: A semiconductor memory includes: a first line; a second line; a third line; a first memory cell disposed between the first line and the second line at an intersection region of the first line and the second line, the first memory cell including a first selection element layer and a first electrode coupled to the first selection element layer; and a second memory cell disposed between the second line and the third line at an intersection region of the second line and third second line, the second memory cell including a second selection element layer and a second electrode coupled to the second selection element layer. A threshold voltage of the first selection element layer is greater than a threshold voltage of the second selection element layer, and a resistance of the second electrode is greater than a resistance of the first electrode.

Abstract: An electronic device includes a semiconductor memory. The semiconductor memory includes a write circuit suitable for generating a first write current at a first point of time corresponding to pre-write latency that is shorter than write latency and generating a second write current at a second point of time corresponding to the write latency, based on a write command signal, a write data signal, and a latency information signal, and a memory cell array suitable for storing a data value corresponding to the write data signal based on the first and second write currents.

Abstract: An electronic device may include a semiconductor memory, and the semiconductor memory may include a plurality of memory cells each including a variable resistance layer; a substituted dielectric layer filling a space between the plurality of memory cells; and an unsubstituted dielectric layer disposed adjacent to the variable resistance layer of each of the plurality of memory cells, wherein the unsubstituted dielectric layer may include a flowable dielectric material.

Abstract: A method for reading data of a memory cell including a resistive memory element having a low resistance state and a high resistance state according to stored data and a selection element may include applying a recovery voltage to both ends of the memory cell, and applying a read voltage to both ends of the memory cell and sensing the data. The recovery voltage may be equal to or more than a second voltage obtained by adding a drift value of the memory cell to a first voltage for turning on the memory cell in a case in which the resistive memory element is in the low resistance state.

Abstract: A method for reading a data of a memory cell comprising a selection device and a resistive memory device which has a high resistance state or a low resistance state according to a data stored therein includes: applying a first read voltage to the memory cell; applying a second read voltage to the memory cell, the second read voltage having a level lower than a level of the first read voltage; and sensing the data of the memory cell while the second read voltage is applied to the memory cell.

Abstract: An electronic device may include a semiconductor memory, and the semiconductor memory may include a plurality of memory cells each including a variable resistance layer; a substituted dielectric layer filling a space between the plurality of memory cells; and an unsubstituted dielectric layer disposed adjacent to the variable resistance layer of each of the plurality of memory cells, wherein the unsubstituted dielectric layer may include a flowable dielectric material.