Patents by Inventor Myung-jun Park
Myung-jun Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240123548Abstract: Embodiments relate to laser welding methods, monitoring methods, and monitoring systems for a secondary battery. A laser welding method for a secondary battery includes performing laser welding on a positive electrode base having a thin-film shape in which a plurality of positive electrode base tabs are formed at a side, a negative electrode base having a thin-film shape in which a plurality of negative electrode base tabs are formed at a side, and a thin-film multi-tab to be joined to each of the positive electrode base and the negative electrode base, a welded portion in which the multi-tab is welded with the positive electrode base and the negative electrode base being melting-joined by using a laser such that a plurality of welding spots is formed on the welded portion.Type: ApplicationFiled: December 22, 2023Publication date: April 18, 2024Inventors: Jae Hoon ROH, Sang Hyun RYU, Myung Jun PARK, Seong Bae AN, Yong Gyu AN, Hee Dong JUNG, Jin Gyu HEO
-
Patent number: 11957495Abstract: An X-ray imaging apparatus includes an imaging device configured to capture a camera image of a target; a controller configured to stitch a plurality of X-ray images of respective divided regions of the target to generate one X-ray image of the target; and a display configured to display a settings window that provides a GUI for receiving a setting of an X-ray irradiation condition for the respective divided regions, and display the camera image in which positions of the respective divided regions are displayed.Type: GrantFiled: December 15, 2021Date of Patent: April 16, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ho Jun Lee, Ju Hwan Kim, Se Hui Kim, Seung-Hoon Kim, Si Won Park, Phill Gu Jung, Duhgoon Lee, Myung Jin Chung, Do Hyeong Hwang, Sung Jin Park
-
Publication number: 20240116135Abstract: An apparatus for manufacturing a secondary battery includes: an index table configured to receive a secondary battery cell, the secondary battery cell including an electrode assembly, a can accommodating the electrode assembly, and an electrode tab between the electrode assembly and the can to electrically connect the electrode assembly to the can; a laser scanner configured to irradiate laser onto an outer surface of the can to weld the electrode tab to the can; and a controller configured to variably control the laser scanner according to an operation of the index table.Type: ApplicationFiled: August 18, 2023Publication date: April 11, 2024Inventors: Yong Gyu AN, Tae Jin YOON, Su Sang CHO, Seong Bae AN, Sang Hyun RYU, Jae Hoon ROH, Myung Jun PARK
-
Patent number: 11939505Abstract: Provided are a silicon nitride film etching composition, a method of etching a silicon nitride film using the same, and a manufacturing method of a semiconductor device. Specifically, a silicon nitride film may be stably etched with a high selection ratio relative to a silicon oxide film, and when the composition is applied to an etching process at a high temperature and a semiconductor manufacturing process, not only no precipitate occurs but also anomalous growth in which the thickness of the silicon oxide film is rather increased does not occur, thereby minimizing defects and reliability reduction.Type: GrantFiled: August 30, 2021Date of Patent: March 26, 2024Assignee: ENF Technology Co., Ltd.Inventors: Dong Hyun Kim, Hyeon Woo Park, Sung Jun Hong, Myung Ho Lee, Myung Geun Song, Hoon Sik Kim, Jae Jung Ko, Myong Euy Lee, Jun Hyeok Hwang
-
Publication number: 20240091819Abstract: Proposed are a substrate processing apparatus having improved substrate drying performance by separately providing a chemical liquid supply nozzle and a gas supply nozzle; and a substrate processing method.Type: ApplicationFiled: March 6, 2023Publication date: March 21, 2024Applicant: SEMES CO., LTD.Inventors: Ju Hwan LEE, Hyeon Jun LEE, So Young PARK, Myung A JEON
-
Patent number: 11935701Abstract: A capacitor component includes a body including dielectric layers, first and second internal electrodes, laminated in a first direction, facing each other, and first and second cover portions, disposed on outermost portions of the first and second internal electrodes, and first and second external electrodes, respectively disposed on both external surfaces of the body in a second direction, perpendicular to the first direction, and respectively connected to the first and second internal electrodes. An indentation including a glass is disposed at at least one of boundaries between the first internal electrodes and the first external electrode or one of boundaries between the second internal electrodes and the second external electrode.Type: GrantFiled: April 4, 2023Date of Patent: March 19, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jang Yeol Lee, Ji Hong Jo, Yoo Jeong Lee, Myung Jun Park, Jong Ho Lee, Hye Young Choi, Jae Hyun Lee, Hyun Hee Gu
-
Patent number: 11930179Abstract: An image encoding/decoding method is provided. An image decoding method of the present invention may comprise deriving an intra-prediction mode of a current luma block, deriving an intra-prediction mode of a current chroma block based on the intra-prediction mode of the current luma block, generating a prediction block of the current chroma block based on the intra-prediction mode of the current chroma block, and the deriving of an intra-prediction mode of a current chroma block may comprise determining whether or not CCLM (Cross-Component Linear Mode) can be performed for the current chroma block.Type: GrantFiled: December 27, 2019Date of Patent: March 12, 2024Assignees: Electronics and Telecommunications Research Institute, INDUSTRY ACADEMY COOPERATION FOUNDATION OF SEJONG UNI, CHIPS & MEDIA, INC, INDUSTRY-UNIVERSITY COOPERATION FOUNDATION KOREA AEROSPACE UNIVERSITYInventors: Sung Chang Lim, Jung Won Kang, Ha Hyun Lee, Jin Ho Lee, Hui Yong Kim, Yung Lyul Lee, Ji Yeon Jung, Nam Uk Kim, Myung Jun Kim, Yang Woo Kim, Dae Yeon Kim, Jae Gon Kim, Do Hyeon Park
-
Patent number: 11921781Abstract: A background music providing method includes: based on a user command for executing a content recognition mode being received, obtaining a data corresponding to the content, reproduced on the display apparatus, in the content recognition mode; transmitting the obtained data to an external source; obtaining information corresponding to the content based on the data from the external source; and displaying a result UI corresponding to the obtained information on the display apparatus.Type: GrantFiled: September 12, 2019Date of Patent: March 5, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ji-hun Park, Myung-jae Kim, Young-jun Ryu, Jang-ho Jin
-
Patent number: 11897054Abstract: Embodiments relate to laser welding methods, monitoring methods, and monitoring systems for a secondary battery. A laser welding method for a secondary battery includes performing laser welding on a positive electrode base having a thin-film shape in which a plurality of positive electrode base tabs are formed at a side, a negative electrode base having a thin-film shape in which a plurality of negative electrode base tabs are formed at a side, and a thin-film multi-tab to be joined to each of the positive electrode base and the negative electrode base, a welded portion in which the multi-tab is welded with the positive electrode base and the negative electrode base being melting-joined by using a laser such that a plurality of welding spots is formed on the welded portion.Type: GrantFiled: February 10, 2021Date of Patent: February 13, 2024Assignee: Samsung SDI Co., Ltd.Inventors: Jae Hoon Roh, Sang Hyun Ryu, Myung Jun Park, Seong Bae An, Yong Gyu An, Hee Dong Jung, Jin Gyu Heo
-
Patent number: 11901130Abstract: A multilayer electronic component, in which the external electrode may be thinned to secure capacitance per unit volume, while securing the external electrode at a corner in a specific thickness or higher with improved reliability for moisture resistance.Type: GrantFiled: January 17, 2023Date of Patent: February 13, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jin Soo Park, Myung Jun Park, Hyun Hee Gu, Bum Soo Kim, Yeon Song Kang, Duk Hyun Chun, Chung Eun Lee
-
Publication number: 20230411074Abstract: A multilayer electronic component includes a body including a plurality of dielectric layers and an internal electrode including a conductive material, and an external electrode disposed on the body and connected to the internal electrode. The internal electrode includes a Sn diffusion portion including Sn in a region connected to the external electrode, and a ratio of an average number of atoms of the Sn compared to an average number of atoms of the conductive material other than the Sn of the internal electrode included in the Sn diffusion portion is 3% or more and 50% or less.Type: ApplicationFiled: November 9, 2022Publication date: December 21, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Eui Hyun JO, Jin Soo PARK, Chul Seung LEE, Byung Jun JEON, Hyung Jong CHOI, Hyun Hee GU, Woo Kyung SUNG, Myung Jun PARK
-
Patent number: 11842853Abstract: A multilayer electronic component according to an embodiment of the present disclosure includes: an electronic component body including a body having a dielectric layer and an internal electrode, and an external electrode disposed on the body; and a coating layer disposed on an external surface of the electronic component body, including one or more of silicon (Si) and fluorine (F), and having an average thickness of 5 nm or more and 15 nm or less.Type: GrantFiled: September 9, 2021Date of Patent: December 12, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hyung Jong Choi, Yoo Jeong Lee, Kwan Young Son, Woo Kyung Sung, Kyu Sik Park, Myung Jun Park, Kwang Yeun Won
-
Patent number: 11806807Abstract: Disclosed is a laser welding method for a secondary battery, in which a first electrode substrate tab and a second electrode substrate tab are laser-welded onto a first electrode uncoated region of a first electrode plate and a second electrode uncoated region of a second electrode plate, respectively, wherein the first electrode substrate tab and the second electrode substrate tab are fusion-bonded with a laser beam so as to have a preset welding pattern at welding portions thereof.Type: GrantFiled: October 27, 2021Date of Patent: November 7, 2023Assignee: SAMSUNG SDI CO., LTD.Inventors: Yong Gyu An, Hyung Bin Park, Hee Dong Jung, Jin Gyu Heo, Myung Jun Park, Jae Hoon Roh, Sang Hyun Ryu, Seong Bae An
-
Publication number: 20230260708Abstract: A multilayer electronic component includes a body including first and second surfaces opposing each other and third and fourth surfaces connected to the first and second surfaces and opposing each other, the body including dielectric layers and internal electrodes interposed between the dielectric layers, and an external electrode disposed on the body to be connected to the internal electrodes. The external electrode includes first and second plating layers respectively covering the third and fourth surfaces, a first electrode layer covering portions of the first and second surfaces and having one side surface in contact with one side surface of the first plating layer, a second electrode layer covering the portions of the first and second surfaces and having one side surface in contact with one side surface of the second plating layer, and third and fourth plating layers respectively covering the first and second plating layers.Type: ApplicationFiled: December 20, 2022Publication date: August 17, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: So Jung AN, Yoo Jeong LEE, Hyung Jong CHOI, Chung Yeol LEE, Kwang Yeun WON, Woo Kyung SUNG, Myung Jun PARK, Jong Ho LEE
-
Publication number: 20230260709Abstract: A multilayer electronic component includes a body including a plurality of internal electrodes and a dielectric layer interposed between the plurality of internal electrodes, and an external electrode including an electrode layer disposed on the body to be connected to the plurality of internal electrodes and a conductive resin layer disposed on the electrode layer. The electrode layer includes an island region.Type: ApplicationFiled: December 22, 2022Publication date: August 17, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yoo Jeong Lee, Hyung Jong Choi, Chung Yeol Lee, Kwang Yeun Won, So Jung An, Woo Kyung Sung, Myung Jun Park, Jong Ho Lee
-
Publication number: 20230260707Abstract: A capacitor component includes a body including dielectric layers, first and second internal electrodes, laminated in a first direction, facing each other, and first and second cover portions, disposed on outermost portions of the first and second internal electrodes, and first and second external electrodes, respectively disposed on both external surfaces of the body in a second direction, perpendicular to the first direction, and respectively connected to the first and second internal electrodes. An indentation including a glass is disposed at at least one of boundaries between the first internal electrodes and the first external electrode or one of boundaries between the second internal electrodes and the second external electrode.Type: ApplicationFiled: April 4, 2023Publication date: August 17, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jang Yeol Lee, Ji Hong Jo, Yoo Jeong Lee, Myung Jun Park, Jong Ho Lee, Hye Young Choi, Jae Hyun Lee, Hyun Hee Gu
-
Publication number: 20230238182Abstract: A multilayer electronic component includes a body including a dielectric layer and a first internal electrode and a second internal electrode and having first to sixth surfaces, a first external electrode including a first connection portion on the third surface, a first band portion on the first surface, and a third band portion on the second surface, a second external electrode including a second connection portion on the fourth surface, a second band portion on the first surface, and a fourth band portion on the second surface, an insulating layer disposed on the second surface and extending onto the first and second connection portions, a first plating layer disposed on the first band portion, and a second plating layer disposed on the second band portion. The insulating layer includes glass, and a region disposed on the second surface in the insulating layer has a convex shape in the first direction.Type: ApplicationFiled: September 13, 2022Publication date: July 27, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hyung Jong CHOI, Yoo Jeong LEE, Chung Yeol LEE, Kwang Yeun WON, So Jung AN, Kang Ha LEE, Woo Kyung SUNG, Myung Jun PARK, Jong Ho LEE
-
Publication number: 20230230770Abstract: A multilayer electronic component includes: a body having first and second surfaces opposing each other in a first direction, and third and fourth surfaces connected to first and second surfaces and opposing each other in a second direction; a first external electrode including a first connection portion disposed on the third surface, a first band portion extending from the first connection portion onto a portion of the first surface, and a third band portion extending from the first connection portion onto a portion of the second surface; a second external electrode including a second connection portion disposed on the fourth surface, and a second band portion extending from the second connection portion onto a portion of the first surface; an insulating layer including a silicone-based resin and disposed on the first and second connection portions.Type: ApplicationFiled: September 1, 2022Publication date: July 20, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: So Jung AN, Hyung Jong CHOI, Yoo Jeong LEE, Chung Yeol LEE, Kwang Yeun WON, Woo Kyung SUNG, Myung Jun PARK, Jong Ho LEE
-
Publication number: 20230230765Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes stacked in a first direction with the dielectric layer interposed therebetween and external electrodes including a first electrode layer connected to the internal electrodes and including Ni, and a second electrode layer disposed on the first electrode layer and including an Ni—Cu alloy. A Cu content of the second electrode layer is 70 mol to 90 mol compared to 100 mol of the total content of Ni and Cu of the second electrode layer.Type: ApplicationFiled: December 14, 2022Publication date: July 20, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jin Soo PARK, Eui Hyun JO, Jun Hyeong KIM, Ha Jeong KIM, Hyun Hee GU, Woo Kyung SUNG, Myung Jun PARK, Byung Jun JEON, Chul Seung LEE
-
Publication number: 20230223195Abstract: A multilayer electronic component includes: a body including a dielectric layer and internal electrodes alternately disposed while having the dielectric layer interposed therebetween; a first external electrode including a first connection portion and first and third band portions extending from ends of the first connection portion; a second external electrode including a second connection portion and second and fourth band portions extending from the second connection portion; an insulating layer disposed on the first and second connection portions and covering a top surface of the body and the third and fourth band portions; first and second plating layers disposed on the first and second band portions, respectively. An end of the plating layer and an end of the insulating layer contact with each other, and a thickness of the end of the plating layer and a thickness of the end of the insulating layer decreases toward the contact point.Type: ApplicationFiled: October 25, 2022Publication date: July 13, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hyung Jong CHOI, Yoo Jeong LEE, Chung Yeol LEE, Kwang Yeun WON, So Jung AN, Kang Ha LEE, Woo Kyung SUNG, Myung Jun PARK, Jong Ho LEE