Abstract: A multilayer ceramic capacitor includes a body and an external electrode on the body. The body includes a dielectric layer and an internal electrode. The external electrode includes an electrode layer connected to the internal electrode, a first plating portion on the electrode layer, and a second plating portion on the first plating portion. The first plating portion includes a plurality of plating layers in which a tin (Sn)-plated layer and a nickel (Ni)-plated layer are alternately stacked.

Abstract: A multilayer capacitor includes a body including an internal electrode alternately disposed with a dielectric layer, and an external electrode disposed on the body. The external electrode includes a first electrode layer contacting the internal electrode, an oxide layer disposed on the first electrode layer and including a metal oxide and glass, and a second electrode layer disposed on the oxide layer.

Abstract: A multilayer seed pattern inductor includes: a magnetic body containing a magnetic material; and an internal coil part encapsulated in the magnetic body, wherein the internal coil part includes a seed pattern and a surface plating layer disposed on the seed pattern, the seed pattern being formed as two or more layers.

Abstract: A ceramic electronic component includes a body including a dielectric layer and first and second internal electrodes, a first external electrode including a first electrode layer electrically connected to the first internal electrode, a first inorganic insulating layer disposed on the first electrode layer, and a first plating layer disposed on the first inorganic insulating layer, a second external electrode including a second electrode layer electrically connected to the second internal electrode, a second inorganic insulating layer disposed on the second electrode layer, and a second plating layer disposed on the second inorganic insulating layer, and a third inorganic insulating layer disposed on the body and connected to the first and second inorganic insulating layers. The first, second and third inorganic insulating layers comprise one or more of SiO2, Al2O3 and ZrO2, and the first, second and third inorganic insulating layers have a thickness within a range from 20 nm to 150 nm.

Abstract: A chip electronic component includes a magnetic main body including an insulating substrate and a coil conductor pattern disposed on at least one surface of the insulating substrate, and external electrodes formed on opposite ends of the magnetic main body so as to be connected to an end of the coil conductor pattern. The coil conductor pattern includes a pattern plating layer and a first plating layer disposed on the pattern plating layer, and a thickness of the first plating layer of innermost and outermost coil conductor patterns of the coil conductor pattern is greater than a thickness of the first plating layer of an inner coil conductor pattern disposed between the innermost and outermost coil conductor patterns.

Abstract: A capacitor includes a capacitor body having upper and lower surfaces and end surfaces connecting the upper and lower surfaces; and an external electrode disposed on a surface of the capacitor body and having a first electrode layer, a second electrode layer, and a third electrode layer. The second electrode layer includes metal and resin and is interposed between the first electrode layer and the third electrode layer, and a portion of the second electrode layer covering the end surface of the capacitor body has a thickness less than that of a portion of the first electrode layer covering the end surface of the capacitor body.

Abstract: A multilayer ceramic electronic part includes a body portion including an internal electrode and a dielectric layer, a first electrode layer disposed on at least one surface of the body portion and electrically connected to the internal electrode, and a conductive resin layer disposed on the first electrode layer and including a first conductivity-type metal particle, a second conductivity-type metal, and a base resin. The second conductivity-type metal has a melting point lower than a curing temperature of the base resin.

Abstract: A multilayer seed pattern inductor includes: a magnetic body containing a magnetic material; and an internal coil part encapsulated in the magnetic body, wherein the internal coil part includes a seed pattern and a surface plating layer disposed on the seed pattern, the seed pattern being formed as two or more layers.

Abstract: There is provided a conductive resin composition including epoxy resin, copper powder particles, and non-nitrogen-based hardeners.

Abstract: A multilayer seed pattern inductor includes: a magnetic body containing a magnetic material; and an internal coil part encapsulated in the magnetic body, wherein the internal coil part includes a seed pattern and a surface plating layer disposed on the seed pattern, the seed pattern being formed as two or more layers.

Abstract: There is provided a multilayer ceramic capacitor including a ceramic body including a plurality of dielectric layers and having first and second main surfaces opposing each other, first and second side surfaces opposing each other, and first and second end surfaces opposing each other, a plurality of internal electrodes having the dielectric layer interposed therebetween, electrode layers formed on the first and second end surfaces of the ceramic body and electrically connected to the plurality of internal electrodes, and an impact absorption layer formed on the electrode layer so that an edge thereof is exposed.

Abstract: A multilayer ceramic electronic component includes: a main body; and a first external electrode disposed on a first surface of the main body and a second external electrode disposed on a second surface of the main body. The first external electrodes include a first base electrode forming an edge portion of the first surface of the main body and a first terminal electrode disposed on a portion of the first base electrode. The second external electrodes include a second base electrode forming an edge portion of the second surface of the main body and a second terminal electrode disposed on a portion of the second base electrode.

Abstract: There is provided a multilayer ceramic capacitor including a ceramic body including a plurality of dielectric layers and having first and second main surfaces opposing each other, first and second side surfaces opposing each other, and first and second end surfaces opposing each other, a plurality of internal electrodes having the dielectric layer interposed therebetween, electrode layers formed on the first and second end surfaces of the ceramic body and electrically connected to the plurality of internal electrodes, and an impact absorption layer formed on the electrode layer so that an edge thereof is exposed.

Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and internal electrodes and having first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction, base electrode layers disposed on the ceramic body and including main portions connected to the internal electrodes and extension portions extending from the main portions, and resin electrode layers disposed on the base electrode layers while leaving end portions of the extension portions exposed. A width of the extension portion is narrower than a width of the outer surface of the ceramic body on which the extension portion is disposed, measured in a direction parallel to a width direction of the extension portion.

Abstract: A multilayer ceramic capacitor may include: a ceramic body having first and second main surfaces opposing each other in a thickness direction and first and second end surfaces opposing each other in a length direction, a thickness of the ceramic body being greater than a width thereof; a first external electrode disposed on the first end surface and having a greater thickness in a region thereof adjacent to the second main surface than in a region thereof adjacent to the first main surface; a second external electrode disposed on the second end surface and having a greater thickness in a region thereof adjacent to the second main surface than in a region thereof adjacent to the first main surface; and first and second internal electrodes disposed in the ceramic body and connected to the first and second external electrodes, respectively.

Abstract: A multilayer ceramic electronic part includes a body portion including an internal electrode and a dielectric layer, a first electrode layer disposed on at least one surface of the body portion and electrically connected to the internal electrode, and a conductive resin layer disposed on the first electrode layer and including a first conductivity-type metal particle, a second conductivity-type metal, and a base resin. The second conductivity-type metal has a melting point lower than a curing temperature of the base resin.

Abstract: There is provided a multilayer ceramic capacitor including a ceramic body including a plurality of dielectric layers and having first and second main surfaces opposing each other, first and second side surfaces opposing each other, and first and second end surfaces opposing each other, a plurality of internal electrodes having the dielectric layer interposed therebetween, electrode layers formed on the first and second end surfaces of the ceramic body and electrically connected to the plurality of internal electrodes, and an impact absorption layer formed on the electrode layer so that an edge thereof is exposed.

Abstract: A capacitor includes a capacitor body having upper and lower surfaces and end surfaces connecting the upper and lower surfaces; and an external electrode disposed on a surface of the capacitor body and having a first electrode layer, a second electrode layer, and a third electrode layer. The second electrode layer includes metal and resin and is interposed between the first electrode layer and the third electrode layer, and a portion of the second electrode layer covering the end surface of the capacitor body has a thickness less than that of a portion of the first electrode layer covering the end surface of the capacitor body.

Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic body having internal electrodes formed therein; external electrodes formed on external surfaces of the ceramic body and connected to the internal electrodes; and buffer layers formed on contact surfaces between the internal electrodes and the external electrodes, among external surfaces of the ceramic body, in an interior direction of the ceramic body, wherein when a thickness of the internal electrode is denoted by Te, a number of laminated internal electrodes is denoted by N, a thickness of the buffer layer is denoted by t, and a width of a margin of the ceramic body in a length direction of the ceramic body is denoted by L, Te?0.6 ?m, N>200, and 3 ?m?t<L, so that the occurrence of radial cracks can be prevented and thus reliability can be improved.

Abstract: A multilayer ceramic electronic component includes: a main body; and a first external electrode disposed on a first surface of the main body and a second external electrode disposed on a second surface of the main body. The first external electrodes include a first base electrode forming an edge portion of the first surface of the main body and a first terminal electrode disposed on a portion of the first base electrode. The second external electrodes include a second base electrode forming an edge portion of the second surface of the main body and a second terminal electrode disposed on a portion of the second base electrode.