Abstract: A deposition source having a constant deposition rate and high reproducibility, and a deposition apparatus including the deposition source includes: a heating chamber having a linear opening portion; and a cover including a plurality of holes and attached to the linear opening portion of the heating chamber. The distances between the holes formed on the cover vary along a long side direction of the linear opening portion of the heating chamber. The number of holes formed on the cover along a long side direction of the linear opening portion of the heating chamber can also vary.

Abstract: A method of manufacturing an organic light emitting device by using a facing target sputtering apparatus is provided. The method includes forming a first electrode on a substrate; forming an organic film on the first electrode; and forming a second electrode on the organic film by using a facing target sputtering apparatus. Accordingly, an electrode film is formed on the organic light emitting device at a low temperature without deterioration of the electrode film due to plasma, it is possible to improve light emitting efficiency and electro-optical characteristics of the organic light emitting device.

Abstract: An inductively coupled plasma chemical vapor deposition apparatus comprises a reaction gas spray nozzle capable of evenly spraying reaction gas onto a rectangular substrate, a radio frequency (RF) antenna capable of uniformly forming a plasma source in a rectangular shape, and a rectangular mask maintained at a low temperature so as to uniformly form a thin film on the rectangular substrate used for a flat panel display device.