Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.

Abstract: An apparatus for manufacturing an organic material includes an outer tube including an internal accommodating space, and at least one loading inner tube and at least one collecting inner tube disposed in the accommodation space, the loading inner tube including a mesh boat disposed in a first direction in which the loading inner tube extends.

Abstract: A display apparatus comprises a display panel for displaying an image, a touch sensor above the display panel, at least one opening formed in the touch sensor, and a shielding member formed in the touch sensor to cover the opening.

Abstract: An organic light emitting display device realizes slimness, having flexibility, and effectively reducing or preventing visibility of reflected external light, which includes an organic light emitting panel, a first adhesive layer on the organic light emitting panel, a touch electrode array being in contact with the first adhesive layer, a separation layer on the touch electrode array, and a cover film on the separation layer.

Abstract: An organic light emitting display device realizes slimness, having flexibility, and effectively reducing or preventing visibility of reflected external light, which includes an organic light emitting panel, a first adhesive layer on the organic light emitting panel, a touch electrode array being in contact with the first adhesive layer, a separation layer on the touch electrode array, and a cover film on the separation layer.

Abstract: An organic light emitting display device realizes slimness, having flexibility, and effectively reducing or preventing visibility of reflected external light, which includes an organic light emitting panel, a first adhesive layer on the organic light emitting panel, a touch electrode array being in contact with the first adhesive layer, a separation layer on the touch electrode array, and a cover film on the separation layer.

Abstract: An organic light emitting display device realizes slimness, having flexibility, and effectively reducing or preventing visibility of reflected external light, which includes an organic light emitting panel, a first adhesive layer on the organic light emitting panel, a touch electrode array being in contact with the first adhesive layer, a separation layer on the touch electrode array, and a cover film on the separation layer.

Abstract: An organic light emitting display device realizes slimness, having flexibility, and effectively reducing or preventing visibility of reflected external light, which includes an organic light emitting panel, a first adhesive layer on the organic light emitting panel, a touch electrode array being in contact with the first adhesive layer, a separation layer on the touch electrode array, and a cover film on the separation layer.

Abstract: An organic light emitting display device realizes slimness, having flexibility, and effectively reducing or preventing visibility of reflected external light, which includes an organic light emitting panel, a first adhesive layer on the organic light emitting panel, a touch electrode array being in contact with the first adhesive layer, a separation layer on the touch electrode array, and a cover film on the separation layer.

Abstract: A chemical vapor deposition apparatus is equipped to control the width of a gas discharge path between a susceptor and an inner surface of a chamber without having to resort to redesign and remanufacturing of the apparatus. The chemical vapor deposition apparatus includes: a chamber; a susceptor positioned inside the chamber and on which a substrate can be loaded; a shower head injecting a processing gas toward the substrate; and a guide unit detachably installed inside the chamber to guide the processing gas such that the processing gas injected from the shower head is discharged through a chamber hole formed in the chamber.

Abstract: Disclosed herein is a vacuum processing apparatus for performing a desired process for a substrate after establishing a vacuum atmosphere therein. More particularly, the vacuum processing apparatus includes a vacuum chamber, which is divided into a chamber body and an upper cover. The upper cover is configured to be easily opened away from and closed to the chamber body.

Abstract: Disclosed herein is a vacuum processing apparatus for performing a desired process for a substrate after establishing a vacuum atmosphere therein. More particularly, the vacuum processing apparatus includes a vacuum chamber, which is divided into a chamber body and an upper cover. The upper cover is configured to be easily opened away from and closed to the chamber body.

Abstract: Disclosed herein is a vacuum processing apparatus for performing a desired process for a substrate after establishing a vacuum atmosphere therein. More particularly, the vacuum processing apparatus includes a vacuum chamber, which is divided into a chamber body and an upper cover. The upper cover is configured to be easily opened away from and closed to the chamber body.

Abstract: Disclosed herein is a vacuum processing apparatus for performing a desired process for a substrate after establishing a vacuum atmosphere therein. More particularly, the vacuum processing apparatus includes a vacuum chamber, which is divided into a chamber body and an upper cover. The upper cover is configured to be easily opened away from and closed to the chamber body.

Abstract: A chemical vapor deposition apparatus is equipped to control the width of a gas discharge path between a susceptor and an inner surface of a chamber without having to resort to redesign and remanufacturing of the apparatus. The chemical vapor deposition apparatus includes: a chamber; a susceptor positioned inside the chamber and on which a substrate can be loaded; a shower head injecting a processing gas toward the substrate; and a guide unit detachably installed inside the chamber to guide the processing gas such that the processing gas injected from the shower head is discharged through a chamber hole formed in the chamber.

Abstract: A gas injection unit allows uniform cooling thereof via smooth flow of coolant and can be easily manufactured. The gas injection unit for a chemical vapor deposition apparatus includes, inter alia: a gas distribution housing; a cooling housing positioned between the gas distribution housing and a processing chamber where a deposition process is performed, and formed with a coolant inlet through which coolant is introduced, and a coolant outlet through which the coolant is discharged; a processing gas pipe of which one end is opened to the gas distribution housing and the other end is opened to the processing chamber, the processing gas pipe penetrating the cooling housing; and a first wall part positioned inside the cooling housing such that an inside of the cooling housing is partitioned into a central path and a peripheral path, and formed with a penetration hole such that the central path communicates with the peripheral path.

Abstract: Disclosed herein is a vacuum processing apparatus for performing a desired process for a substrate after establishing a vacuum atmosphere therein. More particularly, the vacuum processing apparatus includes a vacuum chamber, which is divided into a chamber body and an upper cover. The upper cover is configured to be easily opened away from and closed to the chamber body.

Abstract: Disclosed herein is a vacuum processing apparatus for performing a desired process for a substrate after establishing a vacuum atmosphere therein. More particularly, the vacuum processing apparatus includes a vacuum chamber, which is divided into a chamber body and an upper cover. The upper cover is configured to be easily opened away from and closed to the chamber body.

Abstract: Disclosed herein is a vacuum processing apparatus for performing a desired process for a substrate after establishing a vacuum atmosphere therein. More particularly, the vacuum processing apparatus includes a vacuum chamber, which is divided into a chamber body and an upper cover. The upper cover is configured to be easily opened away from and closed to the chamber body.

Abstract: Disclosed herein is a vacuum processing apparatus for performing a desired process for a substrate after establishing a vacuum atmosphere therein. More particularly, the vacuum processing apparatus includes a vacuum chamber, which is divided into a chamber body and an upper cover. The upper cover is configured to be easily opened away from and closed to the chamber body.