Patents by Inventor Nag B. Patibandla

Nag B. Patibandla has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11404612
    Abstract: A light-emitting device includes a plurality of light-emitting diodes, a first cured composition over a first subset of the light-emitting diodes, and a second cured composition over a second subset of light-emitting diodes. The first cured composition includes a first photopolymer and a blue photoluminescent material that is an organic, organometallic, or polymeric material, embedded in the first photopolymer. The second cured composition includes a second photopolymer and a nanomaterial embedded in the second photopolymer. The nanomaterial is selected to emit red or green light in response.
    Type: Grant
    Filed: August 28, 2020
    Date of Patent: August 2, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Yingdong Luo, Lisong Xu, Sivapackia Ganapathiappan, Hou T. Ng, Byung Sung Kwak, Mingwei Zhu, Nag B. Patibandla
  • Patent number: 11367643
    Abstract: A method for printing on a substrate includes printing a support structure by printing a liquid precursor material and curing the liquid precursor material, printing one or more alignment markers by printing the liquid precursor material outside the support structure and curing the liquid precursor material, positioning a substrate within the support structure, performing a registration of the substrate using the one or more alignment markers, and printing one or more device structures on the substrate while registered by printing and curing the liquid precursor material.
    Type: Grant
    Filed: April 2, 2020
    Date of Patent: June 21, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Daihua Zhang, Hou T. Ng, Nag B. Patibandla, Sivapackia Ganapathiappan, Yingdong Luo, Kyuil Cho, Han-Wen Chen
  • Publication number: 20220189933
    Abstract: A multi-color display includes a backplane having backplane circuitry, an array of micro-LEDs electrically integrated with backplane circuitry of the backplane, a cover layer spanning the LEDs and having a plurality of recesses, and first and second color conversion layers. Each recess of the plurality of recesses positioned over a corresponding micro-LED from the plurality of micro-LEDs, the first color conversion layer is in each recess over a first plurality of LEDs to convert the illumination from the first plurality of LEDs to light of a first color, and the second color conversion layer is in each recess over a second plurality of LEDs to convert the illumination from the second plurality of LEDs to light of a different second color.
    Type: Application
    Filed: January 28, 2022
    Publication date: June 16, 2022
    Inventors: Daihua Zhang, Yingdong Luo, Mingwei Zhu, Hou T. Ng, Sivapackia Ganapathiappan, Nag B. Patibandla
  • Publication number: 20220165789
    Abstract: An apparatus for positioning micro-devices on a substrate includes one or more supports to hold a donor substrate and a destination substrate, an adhesive dispenser to deliver adhesive on micro-devices on the donor substrate, a transfer device including a transfer surface to transfer the micro-devices from the donor substrate to the destination substrate, and a controller. The controller is configured to operate the adhesive dispenser to selectively dispense the adhesive onto selected micro-devices on the donor substrate based on a desired spacing of the selected micro-devices on the destination substrate.
    Type: Application
    Filed: February 11, 2022
    Publication date: May 26, 2022
    Inventors: Mingwei Zhu, Sivapackia Ganapathiappan, Boyi Fu, Hou T. Ng, Nag B. Patibandla
  • Patent number: 11329003
    Abstract: A method of printing structures on a reconstructed wafer includes positioning a plurality of semiconductor dies on a support substrate, anchoring the plurality of semiconductor dies to the support substrate by printing a plurality of anchors that extend across edges of the semiconductor dies onto the support substrate and thus form a reconstructed wafer, and printing one or more device structures on the pluralities of semiconductor dies while anchored on the support substrate. The printing operations include ejecting droplets of a liquid precursor material and curing the liquid precursor material.
    Type: Grant
    Filed: April 2, 2020
    Date of Patent: May 10, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Daihua Zhang, Hou T. Ng, Nag B. Patibandla, Sivapackia Ganapathiappan, Yingdong Luo, Kyuil Cho, Han-Wen Chen
  • Patent number: 11322381
    Abstract: A method for printing on a substrate includes printing a support structure by printing a liquid precursor material and curing the liquid precursor material, positioning a substrate within the support structure, printing one or more anchors on the substrate and the support structure by printing and curing the liquid precursor material to secure the substrate to the support structure, and printing one or more device structures on the substrate while anchored by printing and curing the liquid precursor material.
    Type: Grant
    Filed: April 2, 2020
    Date of Patent: May 3, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Daihua Zhang, Hou T. Ng, Nag B. Patibandla, Sivapackia Ganapathiappan, Yingdong Luo, Kyuil Cho, Han-Wen Chen
  • Publication number: 20220111579
    Abstract: A method of forming a three dimensional object includes dispensing droplets of an electromagnetic energy curable liquid onto a surface to form a plurality of layers of the three dimensional object in liquid form, wherein each droplet forms a layer of liquid on the surface which is larger than a minimum feature size of a structure to be formed by curing the curable liquid, and directing electromagnetic energy capable of curing the liquid and having a beam width intersecting the layer of liquid which is at least as small as the smallest feature of a structure to be formed in the curable liquid.
    Type: Application
    Filed: October 14, 2020
    Publication date: April 14, 2022
    Inventors: Daihua ZHANG, Uma SRIDHAR, Hou T. NG, Sivapackia GANAPATHIAPPAN, Nag B. PATIBANDLA
  • Publication number: 20220069174
    Abstract: A photocurable composition includes a blue photoluminescent material, one or more monomers, and a photoinitiator that initiates polymerization of the one or more monomers in response to absorption of the ultraviolet light. The blue photoluminescent material is selected to absorb ultraviolet light with a maximum wavelength in a range of about 300 nm to about 430 nm and to emit blue light. The blue photoluminescent material also has an emission peak in a range of about 420 nm to about 480 nm. The full width at half maximum of the emission peak is less than 100 nm, and the photoluminescence quantum yield is in a range of 5% to 100%.
    Type: Application
    Filed: August 28, 2020
    Publication date: March 3, 2022
    Inventors: Yingdong Luo, Lisong Xu, Sivapackia Ganapathiappan, Hou T. Ng, Byung Sung Kwak, Mingwei Zhu, Nag B. Patibandla
  • Publication number: 20220069173
    Abstract: A photocurable composition includes quantum dots, quantum dot precursor materials, a chelating agent, one or more monomers, and a photoinitiator. The quantum dots are selected to emit radiation in a first wavelength band in the visible light range in response to absorption of radiation in a second wavelength band in the UV or visible light range. The second wavelength band is different than the first wavelength band. The quantum dot precursor materials include metal atoms or metal ions corresponding to metal components present in the quantum dots. The chelating agent is configured to chelate the quantum dot precursor materials. The photoinitiator initiates polymerization of the one or more monomers in response to absorption of radiation in the second wavelength band.
    Type: Application
    Filed: August 28, 2020
    Publication date: March 3, 2022
    Inventors: Yingdong Luo, Daihua Zhang, Hou T. Ng, Sivapackia Ganapathiappan, Nag B. Patibandla
  • Publication number: 20220069175
    Abstract: A light-emitting device includes a plurality of light-emitting diodes, a first cured composition over a first subset of the light-emitting diodes, and a second cured composition over a second subset of light-emitting diodes. The first cured composition includes a first photopolymer and a blue photoluminescent material that is an organic, organometallic, or polymeric material, embedded in the first photopolymer. The second cured composition includes a second photopolymer and a nanomaterial embedded in the second photopolymer. The nanomaterial is selected to emit red or green light in response.
    Type: Application
    Filed: August 28, 2020
    Publication date: March 3, 2022
    Inventors: Yingdong Luo, Lisong Xu, Sivapackia Ganapathiappan, Hou T. Ng, Byung Sung Kwak, Mingwei Zhu, Nag B. Patibandla
  • Publication number: 20220052248
    Abstract: A superconducting device includes a substrate, a metal oxide or metal oxynitride seed layer on the substrate, and a metal nitride superconductive layer disposed directly on the seed layer. The seed layer is an oxide or oxynitride of a first metal, and the superconductive layer is a nitride of a different second metal.
    Type: Application
    Filed: February 17, 2021
    Publication date: February 17, 2022
    Inventors: Zihao Yang, Mingwei Zhu, Shriram Mangipudi, Mohammad Kamruzzaman Chowdhury, Shane Lavan, Zhebo Chen, Yong Cao, Nag B. Patibandla
  • Patent number: 11251226
    Abstract: An apparatus for positioning micro-devices on a substrate includes one or more supports to hold a donor substrate and a destination substrate, an adhesive dispenser to deliver adhesive on micro-devices on the donor substrate, a transfer device including a transfer surface to transfer the micro-devices from the donor substrate to the destination substrate, and a controller. The controller is configured to operate the adhesive dispenser to selectively dispense the adhesive onto selected micro-devices on the donor substrate based on a desired spacing of the selected micro-devices on the destination substrate. The controller is configured to operate the transfer device such that the transfer surface engages the adhesive on the donor substrate to cause the selected micro-devices to adhere to the transfer surface and the transfer surface then transfers the selected micro-devices from the donor substrate to the destination substrate.
    Type: Grant
    Filed: June 22, 2020
    Date of Patent: February 15, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Mingwei Zhu, Sivapackia Ganapathiappan, Boyi Fu, Hou T. Ng, Nag B. Patibandla
  • Patent number: 11239213
    Abstract: A method of fabricating a multi-color display includes dispensing a photo-curable fluid over a display having an array of LEDs disposed below a cover layer. The cover has an outer surface with a plurality of recesses, and the photo-curable fluid fills the recesses. The photo-curable fluid includes a color conversion agent. A plurality of LEDs in the array are activated to illuminate and cure the photo-curable fluid to form a color conversion layer in the recesses over the activated LEDs. This layer will convert light from these LEDs to light of a first color. An uncured remainder of the photo-curable fluid is removed. Then the process is repeated with a different photo-curable fluid having a different color conversion agent and a different plurality of LEDs. This forms a second color conversion layer in different plurality of recesses to convert light from these LEDs to light of a second color.
    Type: Grant
    Filed: May 17, 2019
    Date of Patent: February 1, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Daihua Zhang, Yingdong Luo, Mingwei Zhu, Hou T. Ng, Sivapackia Ganapathiappan, Nag B. Patibandla
  • Publication number: 20220029068
    Abstract: A photocurable composition includes a nanomaterial selected to emit radiation in a first wavelength band in the visible light range in response to absorption of radiation in a second wavelength band in the UV or visible light range. The second wavelength band is different than the first wavelength band. The photocurable composition further includes one or more (meth)acrylate monomers, a thiol crosslinker, and a photoinitiator that initiates polymerization of the one or more (meth)acrylate monomers in response to absorption of radiation in the second wavelength band.
    Type: Application
    Filed: July 20, 2021
    Publication date: January 27, 2022
    Inventors: Yingdong Luo, Sivapackia Ganapathiappan, Daihua Zhang, Hou T. Ng, Nag B. Patibandla
  • Publication number: 20220017699
    Abstract: An implementation described herein provides a binder ink mixture for 3D printing of ceramic parts in a binder jet process. The binder ink mixture includes a molecular space filler and a free radical initiator.
    Type: Application
    Filed: July 20, 2020
    Publication date: January 20, 2022
    Inventors: Yingdong Luo, Sivapackia Ganapathiappan, Daihua Zhang, Hou T. Ng, Nag B. Patibandla
  • Publication number: 20220016708
    Abstract: Methods and systems for additive manufacturing can include a modular spreader unit including multiple spreaders that collectively span the width of a large build area. The spreaders can be arranged in offset rows so that spreaders in a second row cover gaps between spreaders in a first row. The spreaders can be secured with quick release mechanisms for rapid replacement and adjustment during service intervals.
    Type: Application
    Filed: July 14, 2021
    Publication date: January 20, 2022
    Inventors: Hou T. Ng, Daihua Zhang, Nag B. Patibandla
  • Publication number: 20220013707
    Abstract: A method of fabricating a device including a superconductive layer includes depositing a seed layer on a substrate, exposing the seed layer to an oxygen-containing gas or plasma to form a modified seed layer, and after exposing the seed layer to the oxygen-containing gas or plasma depositing a metal nitride superconductive layer directly on the modified seed layer. The seed layer is a nitride of a first metal, and the superconductive layer is a nitride of a different second metal.
    Type: Application
    Filed: February 17, 2021
    Publication date: January 13, 2022
    Inventors: Zihao Yang, Mingwei Zhu, Shriram Mangipudi, Mohammad Kamruzzaman Chowdhury, Shane Lavan, Zhebo Chen, Yong Cao, Nag B. Patibandla
  • Publication number: 20220013708
    Abstract: A method of fabricating a device including a superconductive layer includes depositing a seed layer on a substrate at a first temperature, the seed layer being a nitride of a first metal, reducing the temperature of the substrate to a second temperature that is lower than the first temperature, increasing the temperature of the substrate to a third temperature that is higher than the first temperature to form a modified seed layer, and depositing a metal nitride superconductive layer directly on the modified seed layer at the third temperature, the superconductive layer being a nitride of a different second metal.
    Type: Application
    Filed: February 17, 2021
    Publication date: January 13, 2022
    Inventors: Zihao Yang, Mingwei Zhu, Shriram Mangipudi, Mohammad Kamruzzaman Chowdhury, Shane Lavan, Zhebo Chen, Yong Cao, Nag B. Patibandla
  • Patent number: 11207826
    Abstract: An additive manufacturing system includes a platen, a dispenser apparatus positioned above the platen to dispense a layer of powder over the platen, and an energy source to selectively fuse the layer of powder. The dispenser apparatus includes a support structure, a dispenser secured to the support structure and including a reservoir to hold the powder and one or more openings configured to deliver powder from the reservoir in a linear region that extends along a first axis, a spreader extending along the first axis and secured to the support structure and positioned to spread powder already delivered on the platen by the dispenser, and a drive system to move the support structure along a second axis perpendicular to the first axis such that the dispenser and blade move together to sweep the linear region along the second axis to deposit and level the powder.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: December 28, 2021
    Assignee: Applied Materials, Inc.
    Inventors: Hou T. Ng, Raanan Zehavi, Nag B. Patibandla
  • Publication number: 20210379726
    Abstract: A polishing pad for a semiconductor fabrication operation includes a polishing region and a window region, wherein both regions are made of an interpenetrating polymer network formed from a free-radically polymerized material and a cationically polymerized material.
    Type: Application
    Filed: June 9, 2020
    Publication date: December 9, 2021
    Inventors: Uma Sridhar, Sivapackia Ganapathiappan, Ashwin Murugappan Chockalingam, Rajeev Bajaj, Daniel Redfield, Mayu Felicia Yamamura, Yingdong Luo, Nag B. Patibandla