Abstract: An optical assembly for a wavelength-division-multiplexing (WDM) transmitter or receiver that lends itself to cost-effective production-line manufacturing. In one embodiment, the fiber optic assembly has a vernier-type arrayed waveguide grating (AWG) with five optical ports at one side and fourteen optical ports at another side. Ten of the fourteen ports are optically coupled to ten photo-detectors or lasers. A selected one of the five ports is optically coupled to an external optical fiber. The coupling optics and the mounting hardware for the AWG are designed to accommodate, with few relatively straightforward adjustments performed on the production line, any configuration of the AWG in which any consecutive ten of the fourteen ports are optically coupled to the ten photo-detectors or lasers.

Abstract: Apparatus including a chip substrate having a first chip surface facing away from a second chip surface; an array of microelectronic elements on the first chip surface; and an array of conductors each in communication with one of the microelectronic elements, the conductors passing through the chip substrate and fully spanning a distance between the first and second chip surfaces.

Abstract: An optical assembly for a wavelength-division-multiplexing (WDM) transmitter or receiver that lends itself to cost-effective production-line manufacturing. In one embodiment, the fiber optic assembly has a vernier-type arrayed waveguide grating (AWG) with five optical ports at one side and fourteen optical ports at another side. Ten of the fourteen ports are optically coupled to ten photo-detectors or lasers. A selected one of the five ports is optically coupled to an external optical fiber. The coupling optics and the mounting hardware for the AWG are designed to accommodate, with few relatively straightforward adjustments performed on the production line, any configuration of the AWG in which any consecutive ten of the fourteen ports are optically coupled to the ten photo-detectors or lasers.

Abstract: Device having first wick evaporator including first membrane and plurality of first thermally-conductive supports. First membrane has upper and lower surfaces. First membrane also has plurality of pores with upper pore ends at upper surface of first membrane and with lower pore ends at lower surface of first membrane. Each of first thermally-conductive supports has upper and lower support ends. Upper support ends of first thermally-conductive supports are in contact with first membrane. Each of first thermally-conductive supports has longitudinal axis extending between the upper and lower support ends, average cross-sectional area along axis, and membrane support cross-sectional area at upper support end, the membrane support cross-sectional area effectively being smaller than average cross-sectional area. First thermally-conductive supports are configured to conduct thermal energy from lower support ends of first thermally-conductive supports to first membrane.

Abstract: The present invention provides an apparatus. The apparatus, in one embodiment, includes an actuator located over a substrate, a movable feature located over and coupled to the actuator, and a layer of material located above the actuator and movable feature and not constituting part of a beam/spring associated with the movable feature, the layer of material configured as a reservoir having an interior capable of holding a liquid, the movable feature being exposed to the interior.

Abstract: The invention includes a method and apparatus for controlling curvatures of light directing devices. The apparatus includes a first substrate portion having formed therein a plurality of cavities, and a substantially flexible membrane disposed over the cavities for forming a respective plurality of light directing mechanisms, the light directing mechanisms disposed over the cavities. The respective curvatures of the light directing mechanisms are set using a pressure difference across each of the membrane portions disposed over the cavities. The respective curvatures of the light directing mechanisms may be controllably adjusted during operation of the light directing mechanisms.

Abstract: Device having first wick evaporator including first membrane and plurality of first thermally-conductive supports. First membrane has upper and lower surfaces. First membrane also has plurality of pores with upper pore ends at upper surface of first membrane and with lower pore ends at lower surface of first membrane. Each of first thermally-conductive supports has upper and lower support ends. Upper support ends of first thermally-conductive supports are in contact with first membrane. Each of first thermally-conductive supports has longitudinal axis extending between the upper and lower support ends, average cross-sectional area along axis, and membrane support cross-sectional area at upper support end, the membrane support cross-sectional area effectively being smaller than average cross-sectional area. First thermally-conductive supports are configured to conduct thermal energy from lower support ends of first thermally-conductive supports to first membrane.

Abstract: The present invention provides an interconnect. The interconnect comprises a pliable surface having a plurality of nanostructures disposed thereon, the pliable surface configured to allow the plurality of nanostructures to at least partially conform to a surface when the nanostructures come into contact therewith.

Abstract: Apparatus including a chip substrate having a first chip surface facing away from a second chip surface; an array of microelectronic elements on the first chip surface; and an array of conductors each in communication with one of the microelectronic elements, the conductors passing through the chip substrate and fully spanning a distance between the first and second chip surfaces.

Abstract: Methods include providing substrate having substrate surface, forming metal-containing pad on substrate surface, and forming metal-containing protective shell enclosing metal-containing body on metal-containing pad. Methods may include forming sacrificial layer on metal-containing pad and including top surface and cavity, cavity having side wall extending between metal-containing pad and top surface; and forming metal-containing protective shell in cavity. Methods may also include providing first, second, third and fourth metal-containing pads on first, second, third and fourth substrate surfaces; forming first metal-containing protective shell on first or second metal-containing pad; forming second metal-containing protective shell on third or fourth metal-containing pad; heating first metal-containing protective shell to form solder-bond between first and second substrate surfaces; and heating second metal-containing protective shell to form solder-bond between third and fourth substrate surfaces.

Abstract: Apparatus including a chip substrate having a first chip surface facing away from a second chip surface; an array of microelectronic elements on the first chip surface; and an array of conductors each in communication with one of the microelectronic elements, the conductors passing through the chip substrate and fully spanning a distance between the first and second chip surfaces.

Abstract: The present invention provides an apparatus. The apparatus, may include an actuator located over a substrate, a movable feature located over and coupled to the actuator, and a layer of material located above the actuator and movable feature and not constituting part of a beam/spring associated with the movable feature, the layer of material configured as a reservoir having an interior capable of holding a liquid, the movable feature being exposed to the interior.

Abstract: The present invention provides a process for manufacturing an apparatus. The process, in one embodiment, includes providing a micro-electro-mechanical system (MEMS) device, the micro-electro-mechanical system (MEMS) device including an actuator coupled to a movable feature, sacrificial material fixing the actuator and movable feature with respect to one another, and a layer of material located over the actuator, movable feature and sacrificial material. The process may further include removing only a portion of the layer of material to expose the sacrificial material, and subjecting the exposed sacrificial material to an etchant to release the movable feature.

Abstract: A method and apparatus for forming an electrically and/or thermally conducting interconnection is disclosed wherein a first surface and a second surface are contacted with each other via a plurality of nanostructures disposed on at least one of the surfaces. In one embodiment, a first plurality of areas of nanostructures is disposed on a component in an electronics package such as, illustratively, a microprocessor. The first plurality of areas is then brought into contact with a corresponding second plurality of areas of nanostructures on a substrate, thus creating a strong friction bond. In another illustrative embodiment, a plurality of nanostructures is disposed on a component, such as a microprocessor, which is then brought into contact with a substrate. Intermolecular forces result in an attraction between the molecules of the nanostructures and the molecules of the substrate, thus creating a bond between the nanostructures and the substrate.

Abstract: A method and apparatus for forming an electrically and/or thermally conducting interconnection is disclosed wherein a first surface and a second surface are contacted with each other via a plurality of nanostructures disposed on at least one of the surfaces. In one embodiment, a first plurality of areas of nanostructures is disposed on a component in an electronics package such as, illustratively, a microprocessor. The first plurality of areas is then brought into contact with a corresponding second plurality of areas of nanostructures on a substrate, thus creating a strong friction bond. In another illustrative embodiment, a plurality of nanostructures is disposed on a component, such as a microprocessor, which is then brought into contact with a substrate. Intermolecular forces result in an attraction between the molecules of the nanostructures and the molecules of the substrate, thus creating a bond between the nanostructures and the substrate.

Abstract: The present invention provides a process and an apparatus. The process, in one embodiment, includes providing a micro-electro-mechanical system (MEMS) device, the micro-electro-mechanical system (MEMS) device including an actuator coupled to a movable feature, sacrificial material fixing the actuator and movable feature with respect to one another, and a layer of material located over the actuator, movable feature and sacrificial material. The process may further include removing only a portion of the layer of material to expose the sacrificial material, and subjecting the exposed sacrificial material to an etchant to release the movable feature.

Abstract: Apparatus include a substrate having a top surface, a housing having an inner surface, and a joint located between the housing and the substrate. The top and inner surfaces are located to form a cavity between the housing and the substrate. The joint is located to seal the cavity. The apparatus includes a micro-electronic structure that is exposed to the cavity and is located between the substrate and housing. The apparatus also includes a dielectric layer located over the substrate and electrical feedthroughs that traverse the joint and connect to the micro-electronic structure. Portions of the electrical feedthroughs that traverse the joint are located in trenches in the dielectric layer. The electrical feedthroughs have a density along part of the joint of at least 10 per millimeter.

Abstract: Apparatus including a chip substrate having a first chip surface facing away from a second chip surface; an array of microelectronic elements on the first chip surface; and an array of conductors each in communication with one of the microelectronic elements, the conductors passing through the chip substrate and fully spanning a distance between the first and second chip surfaces.

Abstract: The invention includes an apparatus for receiving an optical signal from an optical input means and directing the optical signal to one of a plurality of optical output means. The apparatus includes a solid signal propagating material having a refractive index greater than the refractive index of air. The solid signal propagating material includes a first transparent surface optically cooperating with the optical input and output means, a second transparent surface optically cooperating with a first light directing mechanism, and a reflective surface optically cooperating with the first light directing mechanism. A first reflecting component of the light directing mechanism directs a received optical signal to a second reflecting component of the light directing mechanism via the reflective surface of the signal propagating material. The second reflecting component of the light directing mechanism directs the respective incident optical signal to the selected one of the plurality of optical output means.

Abstract: A coupler assembly for an optical backplane system having a backplane and two or more circuit packs connected to that backplane. Each circuit pack has an optical transceiver and the backplane has an optical pipe (e.g., an array of waveguides) adapted to guide optical signals between the transceivers of different circuit packs. A coupler assembly is provided for each transceiver to couple light between that transceiver and the optical pipe. Advantageously, the coupler assembly has a movable optical element that can accommodate possible misalignment between the backplane and the circuit pack. In one embodiment, the movable optical element is an array of MEMS mirrors, each mirror adapted to direct light between an optical transmitter or receiver and the corresponding waveguide of the optical pipe.