Abstract: Connector apparatus for coupling an optical fiber cable with laser devices. The apparatus comprises a receptacle terminating aligned fibers of the optical cable in a planar surface perpendicular to a central axis of the receptacle. A plug mounts a plurality of laser devices each having an electrical terminal for connecting a laser device to an external source and an optical terminal aligned in a planar surface perpendicular to a central axis of the plug with each optical terminal positioned to correspond with one of the receptacle fibers. The plug slidably engages the receptacle and is affixed thereto to position the receptacle planar surface adjacent to and aligned with the plug planar surface to optically couple each laser device with a corresponding fiber of the optical cable.

Abstract: A bundle (12) of optical fibers (13) is fixed in a matrix array by apertures in a guiding plate (14) and a securing plate (15). The apertures (18) in the guiding plate are larger than those in the securing plate and the securing plate apertures (17) are funnel-shaped to aid in insertion of the fibers. Each row of optical fibers may be inserted simultaneously by mounting the row on a uniquely designed vacuum holder (26).

Abstract: A bundle (12) of optical fibers (13) is fixed in a matrix array by apertures in a guiding plate (14) and a securing plate (15). The apertures (18) in the guiding plate are larger than those in the securing plate and the securing plate apertures (17) are funnel-shaped to aid in insertion of the fibers. Each row of optical fibers may be inserted simultaneously by mounting the row on a uniquely designed vacuum holder (26).

Abstract: A robotically controlled pick-uo to tool (11) is modified by connecting to it a load cell (26) that generates a signal indicative of stress on the pick-up tool. The pick-up tool is directed toward a chip (12) to be removed and movement is stopped when the load cell generates a first signal indicative of a first level of stress. In addition to stopping movement of the pick-up tool, the first signal actuates heating of the tool to a temperature sufficient to melt the solder (13) bonding the chip to the substrate (14). The melting of the solder bonds (13) results in a reduction of stress on the tool, which causes the load cell (26) to generate a signal indicative of the second level of stress. The second signal actuates the vacuum of the pick-up tool to cause adhesion of the chip to the pick-up tool and also initiates movement of the pick-up tool so as remove the chip from the substrate.

Abstract: Automated insertion of pins (14) into apertures (12) in a backplane (10) is achieved by first shearing a predetermined number of pins from a continuous strip of pins (26). The sheared pins (12) are then engaged in a pin holder (134) which is indexed to locate the pins in registration with the apertures (12) in the backplane (10). The pin holder (134) is displaced towards the backplane (10) to insert the pins (14) into the apertures (12). As the pins are inserted, they are simultaneously engaged by a pair of guide fingers (244) which travel therewith to guide the engaged pins into the apertures without interfering with any previously inserted pins. The guide fingers disengage themselves from the pins once insertion thereof is substantially completed. An apparatus (10) is also described for carrying the above-described steps in sequence.