Patents by Inventor Naigang Wang
Naigang Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12240753Abstract: A micro-electromechanical device and method of manufacture are disclosed. A sacrificial layer is formed on a silicon substrate. A metal layer is formed on a top surface of the sacrificial layer. Soft magnetic material is electrolessly deposited on the metal layer to manufacture the micro-electromechanical device. The sacrificial layer is removed to produce a metal beam separated from the silicon substrate by a space.Type: GrantFiled: September 7, 2021Date of Patent: March 4, 2025Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: William J. Gallagher, Eugene J. O'Sullivan, Naigang Wang
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Patent number: 12217158Abstract: An apparatus includes circuitry for a neural network that is configured to perform forward propagation neural network operations on floating point numbers having a first n-bit floating point format. The first n-bit floating point format has a configuration consisting of a sign bit, m exponent bits and p mantissa bits where m is greater than p. The circuitry is further configured to perform backward propagation neural network operations on floating point numbers having a second n-bit floating point format that is different than the first n-bit floating point format. The second n-bit floating point format has a configuration consisting of a sign bit, q exponent bits and r mantissa bits where q is greater than m and r is less than p.Type: GrantFiled: September 3, 2019Date of Patent: February 4, 2025Assignee: International Business Machines CorporationInventors: Xiao Sun, Jungwook Choi, Naigang Wang, Chia-Yu Chen, Kailash Gopalakrishnan
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Patent number: 12175359Abstract: An apparatus for training and inferencing a neural network includes circuitry that is configured to generate a first weight having a first format including a first number of bits based at least in part on a second weight having a second format including a second number of bits and a residual having a third format including a third number of bits. The second number of bits and the third number of bits are each less than the first number of bits. The circuitry is further configured to update the second weight based at least in part on the first weight and to update the residual based at least in part on the updated second weight and the first weight. The circuitry is further configured to update the first weight based at least in part on the updated second weight and the updated residual.Type: GrantFiled: September 3, 2019Date of Patent: December 24, 2024Assignee: International Business Machines CorporationInventors: Xiao Sun, Jungwook Choi, Naigang Wang, Chia-Yu Chen, Kailash Gopalakrishnan
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Publication number: 20240419401Abstract: Various embodiments are provided herein for performing a mathematical calculation in a computing environment. A quantization scheme is implemented, allowing at most one (1) non-zero-valued bit in the mantissa of a floating point number.Type: ApplicationFiled: June 15, 2023Publication date: December 19, 2024Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Derrick LIU, Ankur AGRAWAL, Chi-Chun LIU, Shyam RAMJI, Naigang WANG
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Publication number: 20240176584Abstract: An apparatus comprising: a first plurality of inputs representing an activation input vector; a second plurality of inputs representing a weight input vector; an analog multiplier-and-accumulator to generate a first analog voltage representing a first multiply-and-accumulate result for the said first inputs and the second inputs; a voltage multiplier that takes the said first analog voltage and produces a second analog voltage representing, a second multiply-and-accumulate result by multiplying at least one scaling factor to the first analog voltage; an analog to digital converter configured to convert the said second analog voltage multiply-and-accumulate result into a digital signal using a limited-precision operation during a neural network inference operation; and a hardware controller configured to determine the at least one scaling factor based on the first multiply-and-accumulate result, or a software controller configured to determine the at least one scaling factor based on the first multiply-and-accType: ApplicationFiled: November 29, 2022Publication date: May 30, 2024Inventors: Chia-Yu Chen, Andrea Fasoli, Ankur Agrawal, Kyu-hyoun Kim, Chi-Chun LIU, Mauricio J. Serrano, Monodeep Kar, Naigang Wang, Leland Chang
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Patent number: 11879932Abstract: Techniques regarding autonomous identification of aged circuits are provided. For example, one or more embodiments described herein can comprise a system, which can comprise a memory that can store computer executable components. The system can also comprise a processor, operably coupled to the memory, and that can execute the computer executable components stored in the memory. The computer executable components can comprise an identification component, operatively coupled to the processor, that can identify an aged circuit by analyzing a current-voltage characteristic curve for a distortion in a sub-threshold quiescent current signature of the aged circuit.Type: GrantFiled: October 24, 2018Date of Patent: January 23, 2024Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Franco Stellari, Peilin Song, Naigang Wang
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Patent number: 11620105Abstract: In an embodiment, a method includes configuring a specialized circuit for floating point computations using numbers represented by a hybrid format, wherein the hybrid format includes a first format and a second format. In the embodiment, the method includes operating the further configured specialized circuit to store an approximation of a numeric value in the first format during a forward pass for training a deep learning network. In the embodiment, the method includes operating the further configured specialized circuit to store an approximation of a second numeric value in the second format during a backward pass for training the deep learning network.Type: GrantFiled: December 21, 2020Date of Patent: April 4, 2023Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Naigang Wang, Jungwook Choi, Kailash Gopalakrishnan, Ankur Agrawal, Silvia Melitta Mueller
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Patent number: 11604647Abstract: An apparatus includes a memory and a processor coupled to the memory. The processor includes first and second sets of arithmetic units having first and second precision for floating-point computations, the second precision being lower than the first precision. The processor is configured to obtain a machine learning model trained in the first precision, to utilize the second set of arithmetic units to perform inference on input data, to utilize the first set of arithmetic units to generate feedback for updating parameters of the second set of arithmetic units based on the inference performed on the input data by the second set of arithmetic units, to tune parameters of the second set of arithmetic units based at least in part on the feedback generated by the first set of arithmetic units, and to utilize the second set of arithmetic units with the tuned parameters to generate inference results.Type: GrantFiled: September 3, 2019Date of Patent: March 14, 2023Assignee: International Business Machines CorporationInventors: Xiao Sun, Chia-Yu Chen, Naigang Wang, Jungwook Choi, Kailash Gopalakrishnan
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Patent number: 11479845Abstract: Embodiments are directed to a method of forming a magnetic stack arrangement of a laminated magnetic inductor having a high frequency peak quality factor (Q). A first magnetic stack is formed having one or more magnetic layers alternating with one or more insulating layers in a first inner region of a laminated magnetic inductor. A second magnetic stack is formed opposite a surface of the first magnetic stack in an outer region of the laminated magnetic inductor. A third magnetic stack is formed opposite a surface of the second magnetic stack in a second inner region of the laminated magnetic inductor. The insulating layers are formed such that a thickness of an insulating layer in the second magnetic stack is greater than a thickness of an insulating layer in the first magnetic stack.Type: GrantFiled: October 3, 2019Date of Patent: October 25, 2022Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Hariklia Deligianni, Bruce B. Doris, Eugene J. O'Sullivan, Naigang Wang
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Patent number: 11367569Abstract: Embodiments of the invention are directed to a method of fabricating a yoke arrangement of an inductor. A non-limiting example method includes forming a dielectric layer across from a major surface of a substrate. The method further includes configuring the dielectric layer such that it imparts a predetermined dielectric layer compressive stress on the substrate. A magnetic stack is formed on an opposite side of the dielectric layer from the substrate, wherein the magnetic stack includes one or more magnetic layers alternating with one or more insulating layers. The method further includes configuring the magnetic stack such that it imparts a predetermined magnetic stack tensile stress on the dielectric layer, wherein a net effect of the predetermined dielectric layer compressive stress and the predetermined magnetic stack tensile stress on the substrate is insufficient to cause a portion of the major surface of the substrate to be substantially non-planar.Type: GrantFiled: August 21, 2018Date of Patent: June 21, 2022Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Hariklia Deligianni, Bruce B. Doris, Eugene J. O'Sullivan, Naigang Wang
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Patent number: 11361889Abstract: Embodiments are directed to a method of forming a laminated magnetic inductor and resulting structures having multiple magnetic layer thicknesses. A first magnetic stack having one or more magnetic layers alternating with one or more insulating layers is formed in a first inner region of the laminated magnetic inductor. A second magnetic stack is formed opposite a major surface of the first magnetic stack in an outer region of the laminated magnetic inductor. A third magnetic stack is formed opposite a major surface of the second magnetic stack in a second inner region of the laminated magnetic inductor. The magnetic layers are formed such that a thickness of a magnetic layer in each of the first and third magnetic stacks is less than a thickness of a magnetic layer in the second magnetic stack.Type: GrantFiled: January 28, 2020Date of Patent: June 14, 2022Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Hariklia Deligianni, Bruce B. Doris, Eugene J. O'Sullivan, Naigang Wang
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Publication number: 20220180171Abstract: An apparatus includes a floating-point gradient register; an integer register; a memory bank; and an array of processing units. Each of the units includes a plurality of binary shifters having an integer input configured to obtain corresponding bits of a 4-bit integer multiplicand, and a shift-specifying input configured to obtain corresponding bits in an exponent field of a 4-bit floating point multiplier. The multiplier is specified in a mantissaless four-bit floating point format including a sign bit, three exponent bits, and no mantissa bits. An adder tree has a plurality of inputs coupled to outputs of the plurality of shifters, and a rounder has an input coupled to an output of the adder tree. The integer inputs are connected to the integer register; the shift-specifying inputs are connected to the floating-point gradient register; and outputs of the rounders are coupled to the memory bank.Type: ApplicationFiled: December 4, 2020Publication date: June 9, 2022Inventors: Xiao Sun, Ankur Agrawal, Kailash Gopalakrishnan, Naigang Wang, Chia-Yu Chen, Jiamin Ni
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Patent number: 11342115Abstract: A planar magnetic structure includes a closed loop structure having a plurality of core segments divided into at least two sets. A coil is formed about one or more core segments. A first antiferromagnetic layer is formed on a first set of core segments, and a second antiferromagnetic layer is formed on a second set of core segments. The first and second antiferromagnetic layers include different blocking temperatures and have an easy axis pinning a magnetic moment in two different directions, wherein when current flows through the coil, the magnetic moments rotate to form a closed magnetic loop in the closed loop structure.Type: GrantFiled: September 4, 2019Date of Patent: May 24, 2022Assignee: International Business Machines CorporationInventors: Guohan Hu, Naigang Wang
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Patent number: 11222742Abstract: Embodiments are directed to a method of forming a laminated magnetic inductor and resulting structures having anisotropic magnetic layers. A first magnetic stack is formed having one or more magnetic layers alternating with one or more insulating layers. A trench is formed in the first magnetic stack oriented such that an axis of the trench is perpendicular to a hard axis of the magnetic inductor. The trench is filled with a dielectric material.Type: GrantFiled: October 3, 2019Date of Patent: January 11, 2022Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Hariklia Deligianni, Bruce B. Doris, Eugene J. O'Sullivan, Naigang Wang
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Patent number: 11222746Abstract: A planar magnetic structure includes a closed loop structure having a plurality of core segments divided into at least two sets. A coil is formed about one or more core segments. A first antiferromagnetic layer is formed on a first set of core segments, and a second antiferromagnetic layer is formed on a second set of core segments. The first and second antiferromagnetic layers include different blocking temperatures and have an easy axis pinning a magnetic moment in two different directions, wherein when current flows through the coil, the magnetic moments rotate to form a closed magnetic loop in the closed loop structure.Type: GrantFiled: October 28, 2019Date of Patent: January 11, 2022Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Guohan Hu, Naigang Wang
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Publication number: 20210395080Abstract: A micro-electromechanical device and method of manufacture are disclosed. A sacrificial layer is formed on a silicon substrate. A metal layer is formed on a top surface of the sacrificial layer. Soft magnetic material is electrolessly deposited on the metal layer to manufacture the micro-electromechanical device. The sacrificial layer is removed to produce a metal beam separated from the silicon substrate by a space.Type: ApplicationFiled: September 7, 2021Publication date: December 23, 2021Inventors: William J. Gallagher, Eugene J. O'Sullivan, Naigang Wang
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Patent number: 11205541Abstract: A method for fabricating a magnetic material stack on a substrate, comprises forming a first dielectric layer, forming a first magnetic material layer on the first dielectric layer, forming at least a second dielectric layer on the first magnetic material layer and forming at least a second magnetic material layer on the second dielectric layer. During one or more of the forming steps, a surface smoothing operation is performed to remove at least a portion of surface roughness on the layer being formed.Type: GrantFiled: March 4, 2019Date of Patent: December 21, 2021Assignee: International Business Machines CorporationInventors: Hariklia Deligianni, Bruce B. Doris, Eugene J. O'Sullivan, Naigang Wang
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Patent number: 11174159Abstract: A micro-electromechanical device and method of manufacture are disclosed. A sacrificial layer is formed on a silicon substrate. A metal layer is formed on a top surface of the sacrificial layer. Soft magnetic material is electrolessly deposited on the metal layer to manufacture the micro-electromechanical device. The sacrificial layer is removed to produce a metal beam separated from the silicon substrate by a space.Type: GrantFiled: August 20, 2013Date of Patent: November 16, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: William J. Gallagher, Eugene J. O'Sullivan, Naigang Wang
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Patent number: 11170933Abstract: Embodiments of the invention are directed to a method of fabricating a yoke arrangement of an inductor. A non-limiting example method includes forming a dielectric layer across from a major surface of a substrate. The method further includes configuring the dielectric layer such that it imparts a predetermined dielectric layer compressive stress on the substrate. A magnetic stack is formed on an opposite side of the dielectric layer from the substrate, wherein the magnetic stack includes one or more magnetic layers alternating with one or more insulating layers. The method further includes configuring the magnetic stack such that it imparts a predetermined magnetic stack tensile stress on the dielectric layer, wherein a net effect of the predetermined dielectric layer compressive stress and the predetermined magnetic stack tensile stress on the substrate is insufficient to cause a portion of the major surface of the substrate to be substantially non-planar.Type: GrantFiled: April 23, 2019Date of Patent: November 9, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Hariklia Deligianni, Bruce B. Doris, Eugene J. O'Sullivan, Naigang Wang
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Patent number: 11114944Abstract: A multi-phase buck switching converter having grouped pairs of phases, each phase using two magnetically coupled air-core inductors. For each group, a first driver circuit controlling switching of a first power transistor switching circuit coupled to a first air-core inductor output for driving an output load at the first phase. A second driver circuit controlling switching of a second power transistor switching circuit coupled to a second air-core inductor output for driving said output load at the second phase. The first and second phases are spaced 180° apart. The coupled air-core inductors per group of such orientation, separation distance and mutual inductance polarity relative to each other such that magnetic coupling between the two or more inductors at each phase results in a net increase in effective inductance per unit volume. Each air-core inductor is a metal slab of defined length, height and thickness formed using back-end-of-line semiconductor manufacturing process.Type: GrantFiled: December 9, 2019Date of Patent: September 7, 2021Assignee: International Business Machines CorporationInventors: Xin Zhang, Todd E. Takken, Naigang Wang, Leland Chang