Abstract: A memory includes: a plurality of memory banks suitable for storing data; a read peripheral region including circuits suitable for transferring data that are read from one memory bank among the memory banks to a memory controller during a read operation; a write peripheral region including circuits suitable for transferring write data that are transferred from the memory controller to one memory bank among the memory banks during a write operation; and a self-refresh counter circuit suitable for activating a self-refresh read signal for activating the read peripheral region whenever a self-refresh operation is performed N times, where N is an integer equal to or greater than 1.

Abstract: A semiconductor device may include a memory bank, an X-decoder adjacent to the memory bank in a row direction, a Y-decoder adjacent to the memory bank in a column direction, X-lines extending from the X-decoder across the memory bank in the row direction, Y-lines extending from the Y-decoder across the memory bank in the column direction, and a plurality of connection lines.

Abstract: A semiconductor device may include a memory bank, an X-decoder adjacent to the memory bank in a row direction, a Y-decoder adjacent to the memory bank in a column direction, X-lines extending from the X-decoder across the memory bank in the row direction, Y-lines extending from the Y-decoder across the memory bank in the column direction, and a plurality of connection lines.

Abstract: An input/output terminal characteristic calibration circuit may include a plurality of input/output terminals a subset of which is configured to partially and selectively receive a characteristic calibration signal according to an external input, such that characteristics of the input/output terminals corresponding to the characteristic calibration signal are calibrated. The input/output terminal characteristic calibration circuit may also include a characteristic calibration signal generation circuit coupled to the plurality of input/output terminals in common through a test signal line, and configured to provide the characteristic calibration signal to the plurality of input/output terminals in common through the test signal line.

Abstract: A semiconductor device may include a first pad configured to provide a first voltage. The semiconductor device may include a second pad. The semiconductor device may include a connection circuit configured to couple the first pad to the second pad on the basis of a connection signal or electrically separate the second pad from the first pad on the basis of the connection signal. The semiconductor device may include a detection circuit configured to generate a defect detection signal on the basis of a test mode signal and a second voltage received from the second pad.

Abstract: A semiconductor device may include a first pad configured to provide a first voltage. The semiconductor device may include a second pad. The semiconductor device may include a connection circuit configured to couple the first pad to the second pad on the basis of a connection signal or electrically separate the second pad from the first pad on the basis of the connection signal. The semiconductor device may include a detection circuit configured to generate a defect detection signal on the basis of a test mode signal and a second voltage received from the second pad.

Abstract: An input/output terminal characteristic calibration circuit may include a plurality of input/output terminals a subset of which is configured to partially and selectively receive a characteristic calibration signal according to an external input, such that characteristics of the input/output terminals corresponding to the characteristic calibration signal are calibrated. The input/output terminal characteristic calibration circuit may also include a characteristic calibration signal generation circuit coupled to the plurality of input/output terminals in common through a test signal line, and configured to provide the characteristic calibration signal to the plurality of input/output terminals in common through the test signal line.

Abstract: An input/output terminal characteristic calibration circuit may include a plurality of input/output terminals a subset of which is configured to partially and selectively receive a characteristic calibration signal according to an external input, such that characteristics of the input/output terminals corresponding to the characteristic calibration signal are calibrated. The input/output terminal characteristic calibration circuit may also include a characteristic calibration signal generation circuit coupled to the plurality of input/output terminals in common through a test signal line, and configured to provide the characteristic calibration signal to the plurality of input/output terminals in common through the test signal line.

Abstract: An input/output terminal characteristic calibration circuit may include a plurality of input/output terminals a subset of which is configured to partially and selectively receive a characteristic calibration signal according to an external input, such that characteristics of the input/output terminals corresponding to the characteristic calibration signal are calibrated. The input/output terminal characteristic calibration circuit may also include a characteristic calibration signal generation circuit coupled to the plurality of input/output terminals in common through a test signal line, and configured to provide the characteristic calibration signal to the plurality of input/output terminals in common through the test signal line.

Abstract: A semiconductor memory device includes a plurality of memory cell blocks each including a plurality of word lines and suitable for being selectively activated based on an active command and a row address, wherein word lines are selected from the respective activated memory cell blocks based on the active command and the row address, and a column decoding block sequentially accessing the activated memory cell blocks to input/output data thereof by decoding a column address based on the row address.

Abstract: A semiconductor memory device may include: a plurality of memory mats; and a plurality of sense amplifier arrays arranged alternately with the memory mats, each sense amplifier array being suitable for sensing and amplifying data of memory mats adjacent thereto, wherein during a data sensing operation to a memory mat among the plurality of memory mats, in addition to a sense amplifier for the memory mat and sense amplifiers positioned immediately above and below the sense amplifier for the memory mat, at least one additional sense amplifier closest to the sense amplifier for the memory mat is also activated for providing additional amplification.

Abstract: A memory device includes a first memory bank comprising first and second memory blocks; a second memory bank comprising third and fourth memory blocks; and a bank selection unit suitable for selecting a memory bank corresponding to a bank address among the first and the second memory banks when an active command is applied, wherein the selected memory bank performs row access on a word line of an unselected memory block, while activating a word line of a memory block that is selected by a block address among memory blocks of the selected memory bank.

Abstract: A semiconductor memory device includes a plurality of memory cell blocks each including a plurality of word lines and suitable for being selectively activated based on an active command and a row address, wherein word lines are selected from the respective activated memory cell blocks based on the active command and the row address, and a column decoding block sequentially accessing the activated memory cell blocks to input/output data thereof by decoding a column address based on the row address.

Abstract: A semiconductor memory device may include: a plurality of memory mats; and a plurality of sense amplifier arrays arranged alternately with the memory mats, each sense amplifier array being suitable for sensing and amplifying data of memory mats adjacent thereto, wherein during a data sensing operation to a memory mat among the plurality of memory mats, in addition to a sense amplifier for the memory mat and sense amplifiers positioned immediately above and below the sense amplifier for the memory mat, at least one additional sense amplifier closest to the sense amplifier for the memory mat is also activated for providing additional amplification.

Abstract: A semiconductor memory device includes a plurality of memory cell blocks each including a plurality of word lines and suitable for being selectively activated based on an active command and a row address, wherein word lines are selected from the respective activated memory cell blocks based on the active command and the row address, and a column decoding block sequentially accessing the activated memory cell blocks to input/output data thereof by decoding a column address based on the row address.

Abstract: A semiconductor memory device includes a plurality of memory cell blocks each including a plurality of word lines and suitable for being selectively activated based on an active command and a row address, wherein word lines are selected from the respective activated memory cell blocks based on the active command and the row address, and a column decoding block sequentially accessing the activated memory cell blocks to input/output data thereof by decoding a column address based on the row address.

Abstract: A memory device includes a first memory bank comprising first and second memory blocks; a second memory bank comprising third and fourth memory blocks; and a bank selection unit suitable for selecting a memory bank corresponding to a bank address among the first and the second memory banks when an active command is applied, wherein the selected memory bank performs row access on a word line of an unselected memory block, while activating a word line of a memory block that is selected by a block address among memory blocks of the selected memory bank.

Abstract: A column repair circuit of a semiconductor memory apparatus includes a plurality of mats and performs a column repair operation to replace failed cells among a plurality of memory cells provided in the mats. The column repair circuit includes two or more fuse units configured to perform the column repair operation. Each of the fuse units includes a plurality of fuses, and is configured in such a manner that m mats correspond to one fuse or n mats correspond to one fuse, where m and n are natural numbers equal to or more than 1 and different from each other.

Abstract: Input/output (I/O) line driving circuits are provided. The circuit includes a first I/O line driver and a second I/O line driver. The first I/O line driver receives a first input signal in response to an enable signal to generate a first control signal and drives a first I/O line in response to a second control signal. The second I/O line driver receives a second input signal in response to the enable signal to generate the second control signal and drives a second I/O line in response to the first control signal.

Abstract: Input/output (I/O) line driving circuits are provided. The circuit includes a first I/O line driver and a second I/O line driver. The first I/O line driver receives a first input signal in response to an enable signal to generate a first control signal and drives a first I/O line in response to a second control signal. The second I/O line driver receives a second input signal in response to the enable signal to generate the second control signal and drives a second I/O line in response to the first control signal.