Patents by Inventor Nalin Kumar

Nalin Kumar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multilayer electrical interconnect fabrication with few process steps
    Patent number: 5118385
    Abstract: Method for making a multilayer electrical interconnect with stacked pillars between layers using a minimal number of conventional process steps. The method includes sputtering a chromium/copper/titanium trilayer on a dielectric base, depositing a patterned mask on the trilayer, etching the exposed trilayer, removing the mask, depositing a layer of polyimide over the unetched copper, forming a via in the polyimide above the copper, electrolessly plating nickel into the via, and polishing the interconnect to form a planar top surface.
    Type: Grant
    Filed: May 28, 1991
    Date of Patent: June 2, 1992
    Assignee: Microelectronics and Computer Technology Corporation
    Inventors: Nalin Kumar, Charles W. C. Lin