Patents by Inventor Nam Cho
Nam Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11957182Abstract: An aerosol generating device includes a main body and a cartridge detachably coupled to the main body. The main body includes a controller, a battery, and a first wireless communication unit. The cartridge includes a second wireless communication unit. The controller controls output power of the battery to apply a power pattern to the cartridge, and the first wireless communication unit establishes a wireless connection with the second wireless communication unit when power supplied from the battery to the cartridge matches a preset power pattern.Type: GrantFiled: May 7, 2020Date of Patent: April 16, 2024Assignee: KT&G CORPORATIONInventors: Byung Sung Cho, Won Kyeong Lee, Jong Sub Lee, Dae Nam Han
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Publication number: 20240119194Abstract: A simulation method and a simulation apparatus of roll press for secondary battery production are provided.Type: ApplicationFiled: July 19, 2022Publication date: April 11, 2024Inventors: Shinkyu Kang, Sung Nam Cho, Youngduk Kim, Nam Hyuck Kim, Gyeong Yun Jo, Su Ho Jeon, Han Seung Kim, Junhyeok Jeon
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Publication number: 20240114719Abstract: A display device includes a first substrate including at least one first opening part defined, a pixel disposed on the first substrate, at least one first heat dissipation layer disposed in the at least one first opening part, an insulation layer disposed under the first substrate and including at least one second opening part overlapping the at least one first opening part, and a second heat dissipation layer disposed in the at least one second opening part.Type: ApplicationFiled: December 1, 2023Publication date: April 4, 2024Applicant: Samsung Display Co., LTD.Inventors: DAEHWAN JANG, SUNGHOON KIM, HYUK-HWAN KIM, SEOKHYUN NAM, HAENGWON PARK, JIN HO CHO
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Publication number: 20240104274Abstract: A simulation apparatus and a simulation method of mixer for secondary battery production are provided. The simulation apparatus includes a memory configured to store at least one instruction; and at least one processor configured to execute the at least one instruction stored in the memory.Type: ApplicationFiled: July 19, 2022Publication date: March 28, 2024Inventors: Sung Nam Cho, Shinkyu Kang, Nam Hyuck Kim, Youngduk Kim, Su Ho Jeon
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Publication number: 20240018233Abstract: The present invention relates to an affibody that binds to testosterone, and uses thereof. An affibody or a complex of affibody and osteopontin fragments, of the present invention, has superior effects on hair growth or hair loss prevention, and thus can be effectively used as a hair growth agent or a hair loss treatment agent.Type: ApplicationFiled: October 13, 2021Publication date: January 18, 2024Inventors: Hye-Sun PARK, Hyun-Nam CHO, Dai Ho JANG
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Patent number: 11721913Abstract: A chip antenna module includes a substrate, a plurality of chip antennas disposed on a first surface of the substrate, and an electronic element mounted on a second surface of the substrate, wherein each of the plurality of chip antennas includes a first ceramic substrate mounted on the first surface of the substrate, a second ceramic substrate opposing the first ceramic substrate, a first patch disposed on the first ceramic substrate, and a second patch disposed on the second ceramic substrate, and the first ceramic substrate and the second ceramic substrate are spaced apart from each other.Type: GrantFiled: August 11, 2021Date of Patent: August 8, 2023Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Yeong Kim, Sung Nam Cho, Ju Hyoung Park, Jeong Ki Ryoo, Kyu Bum Han, Sung Yong An
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Patent number: 11695220Abstract: An array antenna includes an antenna substrate including a first ceramic member, an insertion member and a second ceramic member sequentially stacked, antenna pattern portions arranged on the antenna substrate in an array form, and shielding vias disposed inside the antenna substrate and extending in a thickness direction of the antenna substrate. The shielding vias are disposed in thickness areas of the antenna substrate corresponding to the antenna pattern portions.Type: GrantFiled: April 5, 2022Date of Patent: July 4, 2023Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Yeong Kim, Ji Hyung Jung, Chin Mo Kim, Sung Nam Cho, Sung Yong An
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Publication number: 20230178281Abstract: A coil component includes: a body; a substrate disposed in the body, and having a first surface and a second surface facing each other; a coil unit including first and second coil patterns disposed on the first surface and the second surface of the substrate, respectively, first and second lead-out portions extending to surfaces of the body, a first connection portion disposed between the first coil pattern and the first lead-out portion, and a second connection portion disposed between the second coil pattern and the second lead-out portion; and first and second external electrodes disposed to be spaced apart from each other on the body and connected to the first and second lead-out portions, respectively. Each of the first and second connection portions includes one connection pattern and at least one separation pattern. The connection pattern has a smaller line width than a respective one of the lead-out portions.Type: ApplicationFiled: November 7, 2022Publication date: June 8, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sung Nam CHO, Ki Young YOO, Ji Soo YOU
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Patent number: 11652272Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on the first ceramic substrate to operate as a feed patch, and a second patch disposed on the second ceramic substrate to operate as a radiation patch. One or both of the first ceramic substrate and the second ceramic substrate include a groove, and one or both of the first patch and the second patch is disposed in the groove of the respective first ceramic substrate and second ceramic substrate and protrudes from the groove.Type: GrantFiled: October 12, 2021Date of Patent: May 16, 2023Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Yeong Kim, Sung Nam Cho, Sung Yong An, Ji Hyung Jung, Chin Mo Kim
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Patent number: 11621491Abstract: A chip antenna includes a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate, operating as a feed patch, a second patch, provided on the second substrate, operating as a radiation patch, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a ground pad provided on the other surface of the first substrate. The first substrate comprises a ceramic sintered material. The ceramic sintered material comprises an Mg2SiO4 phase, an MgAl2O4 phase, and a CaTiO3 phase, and a content of the CaTiO3 phase in the ceramic sintered material ranges from 5.1 mol % to 15.1 mol %.Type: GrantFiled: September 1, 2021Date of Patent: April 4, 2023Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Yeong Kim, Chin Mo Kim, Ji Hyung Jung, Sung Nam Cho, Sung Yong An
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Publication number: 20220397308Abstract: A geothermal system including a multitube vertically-sealed underground heat-exchanger includes: a geothermal well formed by vertically excavating a foundation; a heat pump which is arranged in the foundation, and which includes a circulating pump; and a connection tube, an auxiliary facility, and a multitube vertically-sealed underground heat-exchanger which are buried and installed in the geothermal well, and which are connected to the heat pump such that a thermal fluid thermally restored in the geothermal well is supplied to the heat pump through the circulating pump, and the thermal fluid that has undergone heat exchange in the heat pump is recovered back to the geothermal well and thermally restored therein.Type: ApplicationFiled: April 16, 2021Publication date: December 15, 2022Applicant: G&G TECHNOLOGY CO., LTD.Inventors: Heuy Nam CHO, Hyeon Ho CHANG, Sung Ouk CHOI, Young Hwa KIM, Jo Bum AN
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Patent number: 11431107Abstract: A chip antenna module includes: a first dielectric layer; a first feed via extending through the first dielectric layer; a second feed via extending through the first dielectric layer; a first patch antenna pattern disposed on an upper surface of the first dielectric layer, electrically connected to the first feed via, and having a through-hole through which the second feed via passes; a second patch antenna pattern disposed above the first patch antenna pattern and electrically connected to the second feed via; and a second dielectric layer and a third dielectric layer, respectively located vertically between the first patch antenna pattern and the second patch antenna pattern, and having different dielectric constants that form a first dielectric constant boundary surface between the first and second patch antenna patterns.Type: GrantFiled: January 10, 2020Date of Patent: August 30, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Ju Hyoung Park, Sung Yong An, Myeong Woo Han, Sung Nam Cho, Jae Yeong Kim
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Publication number: 20220231430Abstract: An array antenna includes an antenna substrate including a first ceramic member, an insertion member and a second ceramic member sequentially stacked, antenna pattern portions arranged on the antenna substrate in an array form, and shielding vias disposed inside the antenna substrate and extending in a thickness direction of the antenna substrate. The shielding vias are disposed in thickness areas of the antenna substrate corresponding to the antenna pattern portions.Type: ApplicationFiled: April 5, 2022Publication date: July 21, 2022Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Yeong KIM, Ji Hyung JUNG, Chin Mo KIM, Sung Nam CHO, Sung Yong AN
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Publication number: 20220165485Abstract: A coil component includes a body, a support substrate disposed within the body, a lead portion disposed on a first surface of the support substrate, a first insulating layer disposed on the first surface of the support substrate to cover the lead portion, a coil unit including a plurality of turns disposed on the first insulating layer, a second insulating layer covering the coil unit, and first and second external electrodes spaced apart from each other on the body, and connected to the coil unit and the lead portion, respectively.Type: ApplicationFiled: February 3, 2021Publication date: May 26, 2022Inventors: Sung Nam Cho, Jae Youn Park, Jin Won Lee, Ji Soo You
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Patent number: 11322856Abstract: An array antenna includes an antenna substrate including a first ceramic member, an insertion member and a second ceramic member sequentially stacked, antenna pattern portions arranged on the antenna substrate in an array form, and shielding vias disposed inside the antenna substrate and extending in a thickness direction of the antenna substrate. The shielding vias are disposed in thickness areas of the antenna substrate corresponding to the antenna pattern portions.Type: GrantFiled: January 2, 2020Date of Patent: May 3, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Yeong Kim, Ji Hyung Jung, Chin Mo Kim, Sung Nam Cho, Sung Yong An
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Publication number: 20220102872Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on one surface of the first ceramic substrate to operate as a feeding patch, a second patch disposed on the second ceramic substrate to operate as a radiation patch, at least one feed via penetrating through the first ceramic substrate in a thickness direction to provide a feed signal to the first patch, and a bonding pad disposed on a second surface of the first ceramic substrate opposite the first surface. A thickness of the first ceramic substrate is greater than a thickness of the second ceramic substrate.Type: ApplicationFiled: December 10, 2021Publication date: March 31, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ju Hyoung PARK, Kyu Bum HAN, Jae Yeong KIM, Jeong Ki RYOO, Sung Nam CHO, Sung Yong AN
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Patent number: 11264703Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to oppose the first ceramic substrate, a first patch, disposed on the first ceramic substrate, configured to operate as a feed patch, a second patch, disposed on the second ceramic substrate, configured to operate as a radiation patch, an insertion member disposed between the first ceramic substrate and the second ceramic substrate, and a shielding layer disposed on a side surface of the insertion member.Type: GrantFiled: January 19, 2021Date of Patent: March 1, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Sung Nam Cho, Sung Yong An, Jae Yeong Kim, Ju Hyoung Park
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Patent number: 11251518Abstract: A chip antenna comprises a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate a second patch, provided on the second substrate, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a bonding pad provided on a second surface of the first substrate. The first substrate comprises a dielectric substance and a magnetic substance.Type: GrantFiled: March 24, 2020Date of Patent: February 15, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Chin Mo Kim, Sung Yong An, Ji Hyung Jung, Jae Yeong Kim, Ju Hyoung Park, Sung Nam Cho
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Publication number: 20220029274Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on the first ceramic substrate to operate as a feed patch, and a second patch disposed on the second ceramic substrate to operate as a radiation patch. One or both of the first ceramic substrate and the second ceramic substrate include a groove, and one or both of the first patch and the second patch is disposed in the groove of the respective first ceramic substrate and second ceramic substrate and protrudes from the groove.Type: ApplicationFiled: October 12, 2021Publication date: January 27, 2022Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Yeong KIM, Sung Nam CHO, Sung Yong AN, Ji Hyung JUNG, Chin Mo KIM
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Patent number: 11233336Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on one surface of the first ceramic substrate to operate as a feeding patch, a second patch disposed on the second ceramic substrate to operate as a radiation patch, at least one feed via penetrating through the first ceramic substrate in a thickness direction to provide a feed signal to the first patch, and a bonding pad disposed on a second surface of the first ceramic substrate opposite the first surface. A thickness of the first ceramic substrate is greater than a thickness of the second ceramic substrate.Type: GrantFiled: October 31, 2019Date of Patent: January 25, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Ju Hyoung Park, Kyu Bum Han, Jae Yeong Kim, Jeong Ki Ryoo, Sung Nam Cho, Sung Yong An