Patents by Inventor Nam Cho
Nam Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11264703Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to oppose the first ceramic substrate, a first patch, disposed on the first ceramic substrate, configured to operate as a feed patch, a second patch, disposed on the second ceramic substrate, configured to operate as a radiation patch, an insertion member disposed between the first ceramic substrate and the second ceramic substrate, and a shielding layer disposed on a side surface of the insertion member.Type: GrantFiled: January 19, 2021Date of Patent: March 1, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Sung Nam Cho, Sung Yong An, Jae Yeong Kim, Ju Hyoung Park
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Patent number: 11251518Abstract: A chip antenna comprises a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate a second patch, provided on the second substrate, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a bonding pad provided on a second surface of the first substrate. The first substrate comprises a dielectric substance and a magnetic substance.Type: GrantFiled: March 24, 2020Date of Patent: February 15, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Chin Mo Kim, Sung Yong An, Ji Hyung Jung, Jae Yeong Kim, Ju Hyoung Park, Sung Nam Cho
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Publication number: 20220029274Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on the first ceramic substrate to operate as a feed patch, and a second patch disposed on the second ceramic substrate to operate as a radiation patch. One or both of the first ceramic substrate and the second ceramic substrate include a groove, and one or both of the first patch and the second patch is disposed in the groove of the respective first ceramic substrate and second ceramic substrate and protrudes from the groove.Type: ApplicationFiled: October 12, 2021Publication date: January 27, 2022Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Yeong KIM, Sung Nam CHO, Sung Yong AN, Ji Hyung JUNG, Chin Mo KIM
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Patent number: 11233336Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on one surface of the first ceramic substrate to operate as a feeding patch, a second patch disposed on the second ceramic substrate to operate as a radiation patch, at least one feed via penetrating through the first ceramic substrate in a thickness direction to provide a feed signal to the first patch, and a bonding pad disposed on a second surface of the first ceramic substrate opposite the first surface. A thickness of the first ceramic substrate is greater than a thickness of the second ceramic substrate.Type: GrantFiled: October 31, 2019Date of Patent: January 25, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Ju Hyoung Park, Kyu Bum Han, Jae Yeong Kim, Jeong Ki Ryoo, Sung Nam Cho, Sung Yong An
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Publication number: 20220018555Abstract: A geothermal system includes: at least two geothermal holes (1) formed in the ground; a return water circulation tube (10) for returning underground water of the geothermal holes; a water collection and supply well (20) for collecting and then supplying the underground water returned by the return water circulation tube; at least one heat pump (30) for generating heat for cooling and heating, by using, as a heat source, the heat of the underground water supplied by the water collection and supply well; and a supply tube (40) which is an underground water supply means for supplying, to the geothermal holes, the underground water that supplied heat to the heat pump.Type: ApplicationFiled: November 28, 2019Publication date: January 20, 2022Applicant: G&G TECHNOLOGY CO., LTD.Inventors: Heuy Nam CHO, Hyeon Ho CHANG, Sung Ouk CHOI, Sang Gin PARK
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Patent number: 11223133Abstract: A chip antenna includes a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate, operating as a feed patch, a second patch, provided on the second substrate, operating as a radiation patch, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a ground pad provided on the other surface of the first substrate. The first substrate comprises a ceramic sintered material. The ceramic sintered material comprises an Mg2SiO4 phase, an MgAl2O4 phase, and a CaTiO3 phase, and a content of the CaTiO3 phase in the ceramic sintered material ranges from 5.1 mol % to 15.1 mol %.Type: GrantFiled: February 27, 2020Date of Patent: January 11, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Yeong Kim, Chin Mo Kim, Ji Hyung Jung, Sung Nam Cho, Sung Yong An
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Patent number: 11223100Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on the first ceramic substrate to operate as a feed patch, and a second patch disposed on the second ceramic substrate to operate as a radiation patch. One or both of the first ceramic substrate and the second ceramic substrate include a groove, and one or both of the first patch and the second patch is disposed in the groove of the respective first ceramic substrate and second ceramic substrate and protrudes from the groove.Type: GrantFiled: January 2, 2020Date of Patent: January 11, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Yeong Kim, Sung Nam Cho, Sung Yong An, Ji Hyung Jung, Chin Mo Kim
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Publication number: 20210384633Abstract: A chip antenna includes a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate, operating as a feed patch, a second patch, provided on the second substrate, operating as a radiation patch, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a ground pad provided on the other surface of the first substrate. The first substrate comprises a ceramic sintered material. The ceramic sintered material comprises an Mg2SiO4 phase, an MgAl2O4 phase, and a CaTiO3 phase, and a content of the CaTiO3 phase in the ceramic sintered material ranges from 5.1 mol % to 15.1 mol %.Type: ApplicationFiled: September 1, 2021Publication date: December 9, 2021Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Yeong KIM, Chin Mo KIM, Ji Hyung JUNG, Sung Nam CHO, Sung Yong AN
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Publication number: 20210376490Abstract: A chip antenna module includes a substrate, a plurality of chip antennas disposed on a first surface of the substrate, and an electronic element mounted on a second surface of the substrate, wherein each of the plurality of chip antennas includes a first ceramic substrate mounted on the first surface of the substrate, a second ceramic substrate opposing the first ceramic substrate, a first patch disposed on the first ceramic substrate, and a second patch disposed on the second ceramic substrate, and the first ceramic substrate and the second ceramic substrate are spaced apart from each other.Type: ApplicationFiled: August 11, 2021Publication date: December 2, 2021Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Yeong KIM, Sung Nam CHO, Ju Hyoung PARK, Jeong Ki RYOO, Kyu Bum HAN, Sung Yong AN
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Patent number: 11121476Abstract: A chip antenna module includes a substrate, a plurality of chip antennas disposed on a first surface of the substrate, and an electronic element mounted on a second surface of the substrate, wherein each of the plurality of chip antennas includes a first ceramic substrate mounted on the first surface of the substrate, a second ceramic substrate opposing the first ceramic substrate, a first patch disposed on the first ceramic substrate, and a second patch disposed on the second ceramic substrate, and the first ceramic substrate and the second ceramic substrate are spaced apart from each other.Type: GrantFiled: December 23, 2019Date of Patent: September 14, 2021Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Yeong Kim, Sung Nam Cho, Ju Hyoung Park, Jeong Ki Ryoo, Kyu Bum Han, Sung Yong An
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Patent number: 11069954Abstract: A chip antenna includes a first dielectric substrate, a second dielectric substrate spaced apart from and opposing the first dielectric substrate, a first patch disposed on the first dielectric substrate, a second patch disposed on the second dielectric substrate, and a mounting pad and a feed pad disposed on a mounting surface of the first dielectric substrate. The first dielectric substrate, mounted on a mounting substrate through the mounting pad, is electrically connected to the mounting substrate through the feed pad. One of the first dielectric substrate and the second dielectric substrate is formed of ceramic and another is formed of polytetrafluoroethylene (PTFE).Type: GrantFiled: February 12, 2020Date of Patent: July 20, 2021Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Chin Mo Kim, Jae Yeong Kim, Sung Yong An, Sung Nam Cho, Ji Hyung Jung
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Publication number: 20210143527Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to oppose the first ceramic substrate, a first patch, disposed on the first ceramic substrate, configured to operate as a feed patch, a second patch, disposed on the second ceramic substrate, configured to operate as a radiation patch, an insertion member disposed between the first ceramic substrate and the second ceramic substrate, and a shielding layer disposed on a side surface of the insertion member.Type: ApplicationFiled: January 19, 2021Publication date: May 13, 2021Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sung Nam CHO, Sung Yong AN, Jae Yeong KIM, Ju Hyoung PARK
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Publication number: 20210111478Abstract: A chip antenna includes a first dielectric substrate, a second dielectric substrate spaced apart from and opposing the first dielectric substrate, a first patch disposed on the first dielectric substrate, a second patch disposed on the second dielectric substrate, and a mounting pad and a feed pad disposed on a mounting surface of the first dielectric substrate. The first dielectric substrate, mounted on a mounting substrate through the mounting pad, is electrically connected to the mounting substrate through the feed pad. One of the first dielectric substrate and the second dielectric substrate is formed of ceramic and another is formed of polytetrafluoroethylene (PTFE).Type: ApplicationFiled: February 12, 2020Publication date: April 15, 2021Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Chin Mo KIM, Jae Yeong KIM, Sung Yong AN, Sung Nam CHO, Ji Hyung JUNG
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Publication number: 20210066814Abstract: An array antenna includes an antenna substrate including a first ceramic member, an insertion member and a second ceramic member sequentially stacked, antenna pattern portions arranged on the antenna substrate in an array form, and shielding vias disposed inside the antenna substrate and extending in a thickness direction of the antenna substrate. The shielding vias are disposed in thickness areas of the antenna substrate corresponding to the antenna pattern portions.Type: ApplicationFiled: January 2, 2020Publication date: March 4, 2021Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Yeong KIM, Ji Hyung JUNG, Chin Mo KIM, Sung Nam CHO, Sung Yong AN
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Publication number: 20210066782Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to oppose the first ceramic substrate, a first patch, disposed on the first ceramic substrate, configured to operate as a feed patch, a second patch, disposed on the second ceramic substrate, configured to operate as a radiation patch, an insertion member disposed between the first ceramic substrate and the second ceramic substrate, and a shielding layer disposed on a side surface of the insertion member.Type: ApplicationFiled: January 15, 2020Publication date: March 4, 2021Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sung Nam CHO, Sung Yong AN, Jae Yeong KIM, Ju Hyoung PARK
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Patent number: 10938091Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to oppose the first ceramic substrate, a first patch, disposed on the first ceramic substrate, configured to operate as a feed patch, a second patch, disposed on the second ceramic substrate, configured to operate as a radiation patch, an insertion member disposed between the first ceramic substrate and the second ceramic substrate, and a shielding layer disposed on a side surface of the insertion member.Type: GrantFiled: January 15, 2020Date of Patent: March 2, 2021Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Sung Nam Cho, Sung Yong An, Jae Yeong Kim, Ju Hyoung Park
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Patent number: 10923822Abstract: A wireless communications antenna includes: a magnetic body including one or more slits formed therein; and a coil part having solenoid form and disposed around the magnetic body, wherein the one or more slits are configured such that the magnetic body is not disconnected and a magnetic path of the magnetic body is continuous.Type: GrantFiled: June 19, 2018Date of Patent: February 16, 2021Assignee: WITS Co., Ltd.Inventors: Tae Jun Choi, Jung Young Cho, Seung Hee Oh, Sung Nam Cho, Chang Hak Choi
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Publication number: 20210036407Abstract: A chip antenna comprises a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate a second patch, provided on the second substrate, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a bonding pad provided on a second surface of the first substrate. The first substrate comprises a dielectric substance and a magnetic substance.Type: ApplicationFiled: March 24, 2020Publication date: February 4, 2021Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Chin Mo KIM, Sung Yong AN, Ji Hyung JUNG, Jae Yeong KIM, Ju Hyoung PARK, Sung Nam CHO
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Patent number: 10895056Abstract: Disclosed is a shielding apparatus for high-depth groundwater well pollution prevention grouting comprising: a shielding portion which is provided on the outer circumferential surface of a grouting casing installed in an excavation hole in the ground and compressed to be in close contact with a hollow wall of the excavation hole; a compression portion which is provided on the outer circumferential surface of the grouting casing and formed to descend toward the shielding portion and brings the shielding portion into close contact with the hollow wall of the excavation hole to guide the excavation hole to be sealed; and a pressure equalization injection tube portion which is connected with the compression portion on the outer circumferential surface of the grouting casing and lowers the compression portion by water pressure generated by supplying water from the outside through a water supply tube.Type: GrantFiled: December 17, 2018Date of Patent: January 19, 2021Assignee: G&G Technology Co., Ltd.Inventors: Sung Ouk Choi, Sang Gin Park, Heuy Nam Cho
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Publication number: 20200335870Abstract: A chip antenna includes a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate, operating as a feed patch, a second patch, provided on the second substrate, operating as a radiation patch, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a ground pad provided on the other surface of the first substrate. The first substrate comprises a ceramic sintered material. The ceramic sintered material comprises an Mg2SiO4 phase, an MgAl2O4 phase, and a CaTiO3 phase, and a content of the CaTiO3 phase in the ceramic sintered material ranges from 5.1 mol % to 15.1 mol %.Type: ApplicationFiled: February 27, 2020Publication date: October 22, 2020Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Yeong KIM, Chin Mo KIM, Ji Hyung JUNG, Sung Nam CHO, Sung Yong AN