Patents by Inventor Nam Hoon Kim

Nam Hoon Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10665224
    Abstract: A method of updating speech recognition data including a language model used for speech recognition, the method including obtaining language data including at least one word; detecting a word that does not exist in the language model from among the at least one word; obtaining at least one phoneme sequence regarding the detected word; obtaining components constituting the at least one phoneme sequence by dividing the at least one phoneme sequence into predetermined unit components; determining information regarding probabilities that the respective components constituting each of the at least one phoneme sequence appear during speech recognition; and updating the language model based on the determined probability information.
    Type: Grant
    Filed: July 26, 2019
    Date of Patent: May 26, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Chi-youn Park, Il-hwan Kim, Kyung-min Lee, Nam-hoon Kim, Jae-won Lee
  • Publication number: 20200161235
    Abstract: A processor assembly and a system including a processor assembly are disclosed. The processor assembly includes an interposer disposed on a substrate, an integrated circuit disposed on the interposer, a memory circuit disposed on the interposer and coupled to the integrated circuit, and a capacitor embedded in the interposer. The capacitor includes at least a first non-planar conductor structure and a second non-planar conductor structure separated by a non-planar dielectric structure. The capacitor includes a first capacitor terminal electrically coupling the first non-planar conductor structure to a first voltage terminal in the integrated circuit. The capacitor includes a second capacitor terminal electrically coupling the second non-planar conductor structure to a second voltage terminal in the integrated circuit. The capacitor includes an oxide layer electrically isolating the capacitor from the interposer.
    Type: Application
    Filed: March 19, 2019
    Publication date: May 21, 2020
    Inventors: Woon Seong Kwon, Nam Hoon Kim, Teckgyu Kang
  • Patent number: 10658322
    Abstract: Integrated component packages and methods of assembling integrated component packages are provided. The integrated component package can comprise a bump pitch relaxing layer. A high-bandwidth memory component directly mechanically coupled to the bump pitch relaxing layer on a first side of the bump pitch relaxing layer via a first set of bump bond connections. The high-bandwidth memory component directly electrically coupled to the bump pitch relaxing layer on the first side of the bump pitch relaxing layer via the first set of bump bond connections. The bump pitch relaxing layer mechanically coupled to a first side of a substrate via second set of bump bond connections. The high-bandwidth memory component electrically coupled to the substrate via the bump-pitch relaxing layer and the second set of bump bond connections, and a bump pitch of the second set of bump bond connections is larger than the first set of bump bond connections.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: May 19, 2020
    Assignee: Google LLC
    Inventors: Woon Seong Kwon, Nam Hoon Kim, Teckgyu Kang
  • Publication number: 20200141485
    Abstract: A vehicle control system and a method for a vehicle running on a low friction road inhibit repetitive gear shifts of a transmission of the vehicle. The vehicle control system of the vehicle includes: one or more sensors for sensing an engine speed of the vehicle, an engine oil temperature, a position of an accelerator pedal, a lateral acceleration of the vehicle, a rotational angle of a steering wheel, or whether a low friction road running mode switch is turned on or off; and a controller for receiving sensor data from the sensors. In particular, the controller determines whether the vehicle satisfies an entry condition for performing a repetitive shift prevention control based on the sensor data, and controls a gear shift of the transmission and an engine torque to inhibit the repetitive gear shifts of the vehicle when the downshift occurs when the vehicle has satisfied the entry condition.
    Type: Application
    Filed: October 30, 2019
    Publication date: May 7, 2020
    Applicant: HYUNDAI AUTRON CO., LTD.
    Inventors: John Ha LEE, Nam Hoon KIM, Se Hoon SON, Seo Yeon CHO
  • Patent number: 10641501
    Abstract: A smoke exhaust hood apparatus having a heater for cooking food according to the present invention comprises: a suction part for suctioning smoke generated at a cooking part; an exhaust pipe through which the smoke suctioned by the suction part is transferred; and a heater assembly disposed at one side of the outside of one of the exhaust pipe and the suction part, the heater assembly radiating heat from above the cooking part. The apparatus has a heater installed at a lower portion adjacent to the suction part of the smoke exhaust hood apparatus installed above a food, so as to heat the food from above, and thus can assist food cooking or can quickly cook a tasty food.
    Type: Grant
    Filed: November 29, 2016
    Date of Patent: May 5, 2020
    Inventor: Nam Hoon Kim
  • Publication number: 20200133400
    Abstract: A method of performing a function of a device based on motion information of the device in a standby mode of the device, a device for performing the method are provided. The device includes a sensor configured to detect movement of the device in a standby mode of the device; a storage configured to store motion information based on information related to the movement and at least one piece of function information corresponding to the motion information; and a processor configured to control the device to perform a function corresponding to the motion information in the standby mode based on the information related to the movement, the motion information, and the at least one piece of function information.
    Type: Application
    Filed: December 27, 2019
    Publication date: April 30, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jong-hyun Ryu, Yong-gook Park, Han-joo Chae, Won-young Choi, Jeong-gwan Kang, Nam-hoon Kim, Hyun-su Hong, Jin La
  • Patent number: 10636417
    Abstract: A method of obtaining a grammar model to perform speech recognition includes obtaining information about a state of at least one device, obtaining grammar model information about the at least one device based on the obtained information, and generating a grammar model to perform the speech recognition based on the obtained grammar model information.
    Type: Grant
    Filed: April 7, 2016
    Date of Patent: April 28, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chi-youn Park, Cheong-jae Lee, Nam-hoon Kim, Kyung-min Lee, Jae-won Lee
  • Patent number: 10605604
    Abstract: A device configured to determine a rotation angle with respect to a proceeding direction includes an accelerometer configured to obtain acceleration information related to movements of the device; a storage unit configured to store the acceleration information; and a controller configured to transform coordinates of the acceleration information, filter the acceleration information on the transformed coordinates, and determine the rotation angle of the device with respect to the proceeding direction of the device by using gravitational acceleration information on the transformed coordinates. The gravitational acceleration information is derived by using information about a time point when a vertical acceleration component at the transformed coordinates of the device has a maximum value, from among the acceleration information.
    Type: Grant
    Filed: December 10, 2015
    Date of Patent: March 31, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Han-sung Lee, Nam-hoon Kim, Jae-myeon Lee
  • Publication number: 20200098715
    Abstract: Integrated component packages and methods of assembling integrated component packages are provided. The integrated component package can comprise a bump pitch relaxing layer. A high-bandwidth memory component directly mechanically coupled to the bump pitch relaxing layer on a first side of the bump pitch relaxing layer via a first set of bump bond connections. The high-bandwidth memory component directly electrically coupled to the bump pitch relaxing layer on the first side of the bump pitch relaxing layer via the first set of bump bond connections. The bump pitch relaxing layer mechanically coupled to a first side of a substrate via second set of bump bond connections. The high-bandwidth memory component electrically coupled to the substrate via the bump-pitch relaxing layer and the second set of bump bond connections, and a bump pitch of the second set of bump bond connections is larger than the first set of bump bond connections.
    Type: Application
    Filed: November 27, 2019
    Publication date: March 26, 2020
    Applicant: Google LLC
    Inventors: Woon Seong Kwon, Nam Hoon Kim, Teckgyu Kang
  • Patent number: 10572605
    Abstract: An electronic device and method for providing a translations service are disclosed. The electronic device for providing a translation service includes an input unit comprising input circuitry configured to receive input text of a first language, a processor configured to divide the input text into a main segment and a sub-segment and to generate output text of a second language by selecting translation candidate text corresponding to the input text from translation candidate text of the second language, based on a meaning of text included in the sub-segment, and an output unit comprising output circuitry configured to output the output text.
    Type: Grant
    Filed: June 12, 2017
    Date of Patent: February 25, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Young-ho Han, Il-hwan Kim, Chi-youn Park, Nam-hoon Kim, Kyung-min Lee
  • Patent number: 10543477
    Abstract: Provided are a polymer capsule loaded with transition metal particles having excellent water dispersibility and stability, and a method for preparing the same. Specifically, the polymer capsule loaded with transition metal particles according to the present invention includes a surface-modified polymer capsule surface-modified to thereby have a positive zeta potential in a dispersed state in water; and transition metal particles loaded on a surface of the surface-modified polymer capsule. In addition, a method for preparing a polymer capsule loaded with transition metal particles according to the present invention includes a) preparing a polymer capsule; b) surface-modifying the polymer capsule to prepare a polymer capsule having a positive zeta potential in a dispersed state in water; and c) sequentially adding a water-soluble transition metal precursor and a reducing agent to a water dispersion of the surface-modified polymer capsule obtained in step b).
    Type: Grant
    Filed: May 3, 2017
    Date of Patent: January 28, 2020
    Assignees: INSTITUTE FOR BASIC SCIENCE, POSTECH ACADEMY-INDUSTRY FOUNDATION
    Inventors: Kimoon Kim, Gyeongwon Yun, Zahid Hassan, Jiyeong Lee, Jeehong Kim, Nam Hoon Kim, Kangkyun Baek, Ilha Hwang
  • Patent number: 10540013
    Abstract: A method of performing a function of a device based on motion information of the device in a standby mode of the device, a device for performing the method are provided. The device includes a sensor configured to detect movement of the device in a standby mode of the device; a storage configured to store motion information based on information related to the movement and at least one piece of function information corresponding to the motion information; and a processor configured to control the device to perform a function corresponding to the motion information in the standby mode based on the information related to the movement, the motion information, and the at least one piece of function information.
    Type: Grant
    Filed: January 29, 2014
    Date of Patent: January 21, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jong-hyun Ryu, Yong-gook Park, Han-joo Chae, Won-young Choi, Jeong-gwan Kang, Nam-hoon Kim, Hyun-su Hong, Jin La
  • Publication number: 20200014286
    Abstract: The present invention may provide a motor including a housing; a stator disposed in the housing; a rotor disposed in the stator; a shaft coupled to the rotor; and a wire assembly connected to the stator, wherein the wire assembly includes a first ground part, the housing includes a body and a bracket including a first fastening hole and disposed on an upper portion of the body, and the bracket includes a third ground part, which is inserted into the first fastening hole and thereby contacts the body, and a second ground part, which is connected to the third ground part and is disposed so as to be exposed to the bottom surface of the bracket and thereby contacts the first ground part.
    Type: Application
    Filed: February 6, 2018
    Publication date: January 9, 2020
    Inventors: Tae Ho KIM, Nam Hoon KIM, Ja Young SEO, Jin Su PYEON
  • Patent number: 10515920
    Abstract: Integrated component packages and methods of assembling integrated component packages are provided. The integrated component package can comprise a bump pitch relaxing layer. A high-bandwidth memory component directly mechanically coupled to the bump pitch relaxing layer on a first side of the bump pitch relaxing layer via a first set of bump bond connections. The high-bandwidth memory component directly electrically coupled to the bump pitch relaxing layer on the first side of the bump pitch relaxing layer via the first set of bump bond connections. The bump pitch relaxing layer mechanically coupled to a first side of a substrate via second set of bump bond connections. The high-bandwidth memory component electrically coupled to the substrate via the bump-pitch relaxing layer and the second set of bump bond connections, and a bump pitch of the second set of bump bond connections is larger than the first set of bump bond connections.
    Type: Grant
    Filed: April 9, 2018
    Date of Patent: December 24, 2019
    Assignee: Google LLC
    Inventors: Woon Seong Kwon, Nam Hoon Kim, Teckgyu Kang
  • Patent number: 10510342
    Abstract: Provided herein is a voice recognition server and a control method thereof, the method including determining an index value for each of a plurality of training texts; setting a group for each of the plurality of training texts based on the index values of the plurality of training texts, and matching a function corresponding to each group and storing the matched results; in response to receiving a user's uttered voice from a user terminal apparatus, determining an index value from the received uttered voice; and searching a group corresponding to the index value determined from the received uttered voice, and performing the function corresponding to the uttered voice, thereby providing a voice recognition result of a variety of user's uttered voices suitable to the user's intentions.
    Type: Grant
    Filed: March 8, 2016
    Date of Patent: December 17, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kyung-min Lee, Il-hwan Kim, Chi-youn Park, Young-ho Han, Nam-hoon Kim, Jae-won Lee
  • Publication number: 20190348022
    Abstract: A method of updating speech recognition data including a language model used for speech recognition, the method including obtaining language data including at least one word; detecting a word that does not exist in the language model from among the at least one word; obtaining at least one phoneme sequence regarding the detected word; obtaining components constituting the at least one phoneme sequence by dividing the at least one phoneme sequence into predetermined unit components; determining information regarding probabilities that the respective components constituting each of the at least one phoneme sequence appear during speech recognition; and updating the language model based on the determined probability information.
    Type: Application
    Filed: July 26, 2019
    Publication date: November 14, 2019
    Inventors: Chi-youn PARK, II-hwan Kim, Kyung-min Lee, Nam-hoon Kim, Jae-won Lee
  • Patent number: 10460043
    Abstract: An apparatus and a method for constructing a multilingual acoustic model, and a computer readable recording medium are provided. The method for constructing a multilingual acoustic model includes dividing an input feature into a common language portion and a distinctive language portion, acquiring a tandem feature by training the divided common language portion and distinctive language portion using a neural network to estimate and remove correlation between phonemes, dividing parameters of an initial acoustic model constructed using the tandem feature into common language parameters and distinctive language parameters, adapting the common language parameters using data of a training language, adapting the distinctive language parameters using data of a target language, and constructing an acoustic model for the target language using the adapted common language parameters and the adapted distinctive language parameters.
    Type: Grant
    Filed: November 22, 2013
    Date of Patent: October 29, 2019
    Assignees: SAMSUNG ELECTRONICS CO., LTD., IDIAP RESEARCH INSTITUTE
    Inventors: Nam-Hoon Kim, Petr Motlicek, Philip Neil Garner, David Imseng, Jae-won Lee, Jeong-Mi Cho
  • Publication number: 20190312002
    Abstract: Integrated component packages and methods of assembling integrated component packages are provided. The integrated component package can comprise a bump pitch relaxing layer. A high-bandwidth memory component directly mechanically coupled to the bump pitch relaxing layer on a first side of the bump pitch relaxing layer via a first set of bump bond connections. The high-bandwidth memory component directly electrically coupled to the bump pitch relaxing layer on the first side of the bump pitch relaxing layer via the first set of bump bond connections. The bump pitch relaxing layer mechanically coupled to a first side of a substrate via second set of bump bond connections. The high-bandwidth memory component electrically coupled to the substrate via the bump-pitch relaxing layer and the second set of bump bond connections, and a bump pitch of the second set of bump bond connections is larger than the first set of bump bond connections.
    Type: Application
    Filed: April 9, 2018
    Publication date: October 10, 2019
    Inventors: Woon Seong Kwon, Nam Hoon Kim, Teckgyu Kang
  • Patent number: 10424352
    Abstract: There are provided a memory system and a method for operating the same. A memory system includes: a semiconductor memory device for outputting a ready/busy (R/B) signal by performing an internal operation in response to an operation command, and outputting status data by performing a status check operation in response to a status check command; and a controller for outputting the operation command and the status check command to the semiconductor memory device, and determining validity of the status data, based on the R/B signal.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: September 24, 2019
    Assignee: SK hynix Inc.
    Inventors: Nam Hoon Kim, Soo Jin Wi, Deung Kak Yoo
  • Patent number: 10403267
    Abstract: A method of updating speech recognition data including a language model used for speech recognition, the method including obtaining language data including at least one word; detecting a word that does not exist in the language model from among the at least one word; obtaining at least one phoneme sequence regarding the detected word; obtaining components constituting the at least one phoneme sequence by dividing the at least one phoneme sequence into predetermined unit components; determining information regarding probabilities that the respective components constituting each of the at least one phoneme sequence appear during speech recognition; and updating the language model based on the determined probability information.
    Type: Grant
    Filed: January 16, 2015
    Date of Patent: September 3, 2019
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Chi-youn Park, Il-hwan Kim, Kyung-min Lee, Nam-hoon Kim, Jae-won Lee