Patents by Inventor Nam-young Kim

Nam-young Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110053552
    Abstract: A selection associated with a service provider is received at a user device, the service provider being associated with a first location. A second location that is associated with the user is determined at the user device. A service request and the determined second location associated with the user are sent from the user device and to a destination associated with the service provider. A route between the first and second locations to be used by the service provider is received from the service provider. A map including the route between the first and second locations to be used by the service provider is rendered on the user device.
    Type: Application
    Filed: April 2, 2010
    Publication date: March 3, 2011
    Applicant: LG ELECTRONICS INC.
    Inventors: Nam-Young KIM, Jong-Gu SHIN
  • Publication number: 20110015926
    Abstract: Voice communication by first and second users in a voice communication session that facilitates communication between a first device through which a first user communicates and a second device through which a second user communicates is enabled. Words spoken in the voice communication session between the first device and the second device are monitored. Presence of one or more key words as a subset of less than all of the monitored spoken in the voice communication session is determined from the monitored words spoken in the voice communication session. The one or more key words are displayed on a display screen.
    Type: Application
    Filed: March 4, 2010
    Publication date: January 20, 2011
    Applicant: LG Electronics Inc.
    Inventor: Nam-Young KIM
  • Patent number: 7867747
    Abstract: The present invention relates to a novel protease, a polynucleotide encoding the protease, and a fibrinolytic agent comprising the same. The protease is obtained from a new gene source by using metagenomic library technology, and can replace the conventional fibrinolytic agent.
    Type: Grant
    Filed: November 8, 2006
    Date of Patent: January 11, 2011
    Assignee: Korea Ocean Research and Development Institute
    Inventors: Sang-Hyeon Lee, Dong-Geun Lee, Jeong-Ho Jeon, Nam-Young Kim, Jung-Hyun Lee, Sang-Jin Kim, Min-Kyung Jang
  • Patent number: 7850872
    Abstract: Disclosed are a compound which works as electronic materials such as a molecular memory, a molecular switch, a molecular rectifier, a molecular wire, and so on, and a molecular electronic device including the same. The compound for molecular electronic device has the structure of following Formula 1, (MnRM)n??<Formula 1> wherein, R is a single molecule having an electrical conductivity, M is independently a repeating unit constituting a polymer having an electrical conductivity, and n is independently an integer ranging from 100 to 500.
    Type: Grant
    Filed: September 27, 2007
    Date of Patent: December 14, 2010
    Assignee: Dongjin Semichem Co., Ltd.
    Inventors: Gyou-Jin Cho, Jeong-Ju Kim, Eun-Jung Choi, Nam-Young Kim, Chan-Seok Park, Hoe-Taek Yang
  • Publication number: 20100301376
    Abstract: In a side view type light emitting diode (LED) package, a lead frame portion and lead frame electrical contact portions are exposed outside a package body to serve as an additional heat dissipation path. The side view type LED package includes an LED chip, a package body having a side surface with an opening for receiving the LED chip, and lead frames for applying a current to the LED chip. The lead frames include inner leads electrically connected to the LED chip within the package body; electrical contact lower legs extending from the inner leads to a lower portion of the package body and exposed outside the package body in the vicinity of a lower surface of the package body perpendicular to the side surface; and a heat dissipation means extending, separately from the electrical contact lower legs, from at least one of the inner leads outside the package body.
    Type: Application
    Filed: August 5, 2010
    Publication date: December 2, 2010
    Applicant: SEOUL SEMICONDUCTOR CO., LTD.
    Inventors: Nam Young KIM, Tae Kwang Kim, Kyoung Bo Han, Myung Hee Lee
  • Patent number: 7804105
    Abstract: In a side view type light emitting diode (LED) package, a lead frame portion and lead frame electrical contact portions are exposed outside a package body to serve as an additional heat dissipation path. The side view type LED package includes an LED chip, a package body having a side surface with an opening for receiving the LED chip, and lead frames for applying a current to the LED chip. The lead frames include inner leads electrically connected to the LED chip within the package body; electrical contact lower legs extending from the inner leads to a lower portion of the package body and exposed outside the package body in the vicinity of a lower surface of the package body perpendicular to the side surface; and a heat dissipation means extending, separately from the electrical contact lower legs, from at least one of the inner leads outside the package body.
    Type: Grant
    Filed: June 27, 2007
    Date of Patent: September 28, 2010
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Nam Young Kim, Tae Kwang Kim, Kyoung Bo Han, Myung Hee Lee
  • Publication number: 20100096653
    Abstract: A side-view type light emitting diode package for emitting light, emitted from a light emitting diode chip, toward a side surface is disclosed. The side-view type light emitting diode package comprises a package body having an opening portion for exposing the light emitting diode chip in a light emitting direction; and a light-transmittable resin covering the light emitting diode chip, wherein at least a portion of an inner wall of the opening portion is formed with a step projection for partitioning the opening portion into upper and lower sections, and the lower section of the opening portion below the step projection is filled with the light-transmittable resin. Accordingly, the light-transmittable resin with the convex lens shape may be easily formed, so that the light emission efficiency thereof can be improved.
    Type: Application
    Filed: September 21, 2007
    Publication date: April 22, 2010
    Applicant: Seoul Semiconductor Co. Ltd.
    Inventors: Hwa Ja Kim, Nam Young Kim, Myung Hee Lee, Kyoung Bo Han, Tae Kwang Kim, Ji Seop So
  • Publication number: 20090317890
    Abstract: The present invention relates to a novel protease, a polynucleotide encoding the protease, and a fibrinolytic agent comprising the same. The protease is obtained from a new gene source by using metagenomic library technology, and can replace the conventional fibrinolytic agent.
    Type: Application
    Filed: November 8, 2006
    Publication date: December 24, 2009
    Applicant: Korea Ocean Research and Development Institute
    Inventors: Sang-Hyeon Lee, Dong-Geun Lee, Jeong-Ho Jeon, Nam-Young Kim, Jung-Hyun Lee, Sang-Jin Kim, Min-Kyung Jang
  • Publication number: 20090179219
    Abstract: In a side view type light emitting diode (LED) package, a lead frame portion and lead frame electrical contact portions are exposed outside a package body to serve as an additional heat dissipation path. The side view type LED package includes an LED chip, a package body having a side surface with an opening for receiving the LED chip, and lead frames for applying a current to the LED chip. The lead frames include inner leads electrically connected to the LED chip within the package body; electrical contact lower legs extending from the inner leads to a lower portion of the package body and exposed outside the package body in the vicinity of a lower surface of the package body perpendicular to the side surface; and a heat dissipation means extending, separately from the electrical contact lower legs, from at least one of the inner leads outside the package body.
    Type: Application
    Filed: June 27, 2007
    Publication date: July 16, 2009
    Applicant: Seoul Semiconductor Co., Ltd.
    Inventors: Nam Young Kim, Tae Kwang Kim, Kyoung Bo Han, Myung Hee Lee
  • Patent number: 7471168
    Abstract: The present invention discloses to an SMA connector, a preferable embodiment of which comprises a body acting as ground, a central conductor existing in the inner part of the ground, an insulator with a predetermined dielectric constant existing between the body and the central conductor, a first step transition part formed in the body, a taper formed in the central conductor in order to improve RF characteristics and to fix the central conductor and the insulator, and a second step transition part formed in the central conductor corresponding to the first step transition part to improve RF characteristics.
    Type: Grant
    Filed: July 14, 2003
    Date of Patent: December 30, 2008
    Assignees: Mission Technology Co., Ltd., Kwangwoon University Industry-Academic Collaboration Foundation
    Inventors: Jong-Chul Lee, Jae-Sun Lee, Ki-Byoung Kim, Tae-Soon Yun, Sang-Gun Lee, Nam-Young Kim, Jong-Heon Kim, Byung-Je Lee, Bub-Sang Yun, Kuk-Hwan Ra, Youn-Joo Lee, Sun-Won Hong
  • Publication number: 20080087887
    Abstract: Disclosed are a compound which works as electronic materials such as a molecular memory, a molecular switch, a molecular rectifier, a molecular wire, and so on, and a molecular electronic device including the same. The compound for molecular electronic device has the structure of following Formula 1, (MnRM)n??<Formula 1> wherein, R is a single molecule having an electrical conductivity, M is independently a repeating unit constituting a polymer having an electrical conductivity, and n is independently an integer ranging from 100 to 500.
    Type: Application
    Filed: September 27, 2007
    Publication date: April 17, 2008
    Applicant: DONGJIN SEMICHEM CO., LTD.
    Inventors: Gyou-Jin Cho, Jeong-Ju Kim, Eun-Jung Choi, Nam-Young Kim, Chan-Seok Park, Hoe-Taek Yang
  • Publication number: 20080048201
    Abstract: Disclosed is a light emitting diode (LED) package employing a lead terminal with a reflecting surface. The package includes first and second lead terminals that are spaced apart from each other. The first lead terminal has a lower portion with an LED chip mounting area, and at least one reflecting surface formed by being bent from the lower portion. Meanwhile, a package body supports the first and second lead terminals and forms a cavity through which the LED chip mounting area and the reflecting surface of the first lead terminal and a part of the second lead terminal are exposed. The first and second lead terminals extend outside of the package body. Accordingly, light emitted from an LED chip can be reflected on the reflecting surface with high reflectivity, so that the optical efficiency of the package can be improved.
    Type: Application
    Filed: July 19, 2007
    Publication date: February 28, 2008
    Applicant: SEOUL SEMICONDUCTOR CO., LTD.
    Inventors: Hwa Ja KIM, Nam Young KIM, Myung Hee LEE, Kyoung Bo HAN, Tae Kwang KIM, Ji Seop SO
  • Publication number: 20060128215
    Abstract: The present invention discloses to an SMA connector, a preferable embodiment of which comprises a body acting as ground, a central conductor existing in the inner part of the ground, an insulator with a predetermined dielectric constant existing between the body and the central conductor, a first step transition part formed in the body, a taper formed in the central conductor in order to improve RF characteristics and to fix the central conductor and the insulator, and a second step transition part formed in the central conductor corresponding to the first step transition part to improve RF characteristics.
    Type: Application
    Filed: July 14, 2003
    Publication date: June 15, 2006
    Applicants: Mission Telecom Corporation, Kwangwoon Foundation
    Inventors: Jong-Chul Lee, Jae-Sun Lee, Ki-Byoung Kim, Tae-Soon Yun, Sang-Gun Lee, Nam-Young Kim, Jong-Heon Kim, Byung-Je Lee, Bub-Sang Yun, Kuk-Hwan Ra, Youn-Joo Lee, Sun-Won Hong
  • Patent number: 6956528
    Abstract: This invention relates to a microstrip array antenna, especially a broad-band dual-polarized microstrip array antenna having parallel feeding structure whose consist of two parts power supplying layers each of which generates its own polarization respectively. And the broad-band dual-polarized microstrip array antenna according to the present invention arranges transmission paths for two separate linear polarization on a different layer each other in order to minimize an interference effect and a proximity feeding method and an aperture coupled method are used in order to get two separate polarization.
    Type: Grant
    Filed: June 9, 2001
    Date of Patent: October 18, 2005
    Assignees: Mission Telecom, Inc., Pawanet, Inc., Kwangwoon Foundation
    Inventors: Byung-je Lee, Gi-cho Kang, Hak-yong Lee, Nam-young Kim, Jong-heon Kim, Guen-ho Lee, Keuk-hwan Ra
  • Publication number: 20040119645
    Abstract: This invention relates to a microstrip array antenna, especially a broad-band dual-polarized microstrip array antenna having parallel feeding structure whose consist of two parts power supplying layers each of which generates its own polarization respectively. And the broad-band dual-polarized microstrip array antenna according to the present invention arranges transmission paths for two separate linear polarization on a different layer each other in order to minimize an interference effect and a proximity feeding method and an aperture coupled method are used in order to get two separate polarization.
    Type: Application
    Filed: October 30, 2003
    Publication date: June 24, 2004
    Inventors: Byung-je Lee, Gi-cho Kang, Hak-yong Lee, Nam-young Kim, Jong-heon Kim, Guen-ho Lee, Keuk-hwan Ra
  • Patent number: 6546689
    Abstract: Disclosed is a construction and method for jointing steel members using shear rings, achieving a jointing construction to which a real shearing force can be applied, improving working conditions, the jointing strength and durability, and reducing material. The construction has at least one first steel member and at least one second steel member overlapped together and respectively having at least a bolt hole and at least an annular groove, and at least one shear ring inserted in the annular groove of both the first steel member and the second steel member to prevent slip between the first steel member and the second steel member. The annular groove is formed at each of contact surfaces of the first steel member and the second steel member, and the bolt hole has a first clearance while the annular groove of at least one of the first steel member and the second steel member has a second clearance smaller than the first clearance.
    Type: Grant
    Filed: June 11, 2001
    Date of Patent: April 15, 2003
    Assignee: Ssedaa Technology Co., Ltd.
    Inventor: Nam Young Kim
  • Patent number: D529451
    Type: Grant
    Filed: August 23, 2005
    Date of Patent: October 3, 2006
    Assignee: Seoul Semiconductor Co. Ltd.
    Inventors: Nam Young Kim, Kyoung Bo Han, Myoung Hee Lee
  • Patent number: D529452
    Type: Grant
    Filed: August 23, 2005
    Date of Patent: October 3, 2006
    Assignee: Seoul Semiconductor Co. Ltd.
    Inventors: Nam Young Kim, Kyoung Bo Han, Myung Hee Lee
  • Patent number: D557223
    Type: Grant
    Filed: July 28, 2006
    Date of Patent: December 11, 2007
    Assignee: Seoul Seimiconductor Co., Ltd.
    Inventors: Nam Young Kim, Kyoung Bo Han, Myung Hee Lee
  • Patent number: D566054
    Type: Grant
    Filed: July 28, 2006
    Date of Patent: April 8, 2008
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Nam Young Kim, Kyoung Bo Han, Myung Hee Lee