Patents by Inventor Nam-Goo Cha
Nam-Goo Cha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240113150Abstract: A light emitting device according to an embodiment includes: a substrate; first through third LED stacks disposed on the substrate, and including a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer, respectively; a lower insulation layer covering the first through third LED stacks; an upper insulation layer disposed on the lower insulation layer; and electrode pad layers disposed on the upper insulation layer, and electrically connected to the first through third LED stacks, in which the lower insulation layer has openings allowing electrical connection to the first through third LED stacks, the upper insulation layer covers the lower insulation layer such that each of the openings in the lower insulation layer is at least partially exposed, and the electrode pad layers extend on the upper insulation layer to pass through the openings in the lower insulation layer.Type: ApplicationFiled: September 18, 2023Publication date: April 4, 2024Inventors: Nam Goo CHA, Jong Min JANG
-
Publication number: 20230034456Abstract: The present disclosure relates to a light emitting module and a display apparatus using the same. Specifically, one embodiment of the present disclosure provides a light emitting module including: a light emitting structure configured to emit light; and a light transmitting layer configured to transmit light emitted from the light emitting structure, wherein the light transmitting layer has a light scattering region in which one or more voids for refracting the light are formed.Type: ApplicationFiled: July 29, 2022Publication date: February 2, 2023Inventors: Nam Goo Cha, Seong Chan Park
-
Patent number: 11251225Abstract: In some examples, a semiconductor device may comprise a semiconductor chip including a plurality of pixels, each pixel formed of a plurality of sub-pixels, such as a red sub-pixel, green sub-pixel and blue sub-pixel. Each sub-pixel may comprise a light emitting diode. A first signal line may connect to signal terminals of a first group sub-pixels (e.g., arranged in the same row), and a second signal line may connect to common terminals of a second group of sub-pixels (e.g., arranged in the same column). The number of chip pads may thus be reduced to provide increased design flexibility in location and/or allowing an increase in chip pad size. In some examples, a light transmissive material may be formed in openings of a semiconductor growth substrate on which light emitting cells of the sub-pixels were grown. The light transmissive material of some of the sub-pixels may comprise a wavelength conversion material and/or filter.Type: GrantFiled: May 1, 2020Date of Patent: February 15, 2022Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Nam Goo Cha, Yong Il Kim, Young Soo Park
-
Patent number: 10903397Abstract: A light emitting device package may include: a light emitting structure including a plurality of light emitting regions configured to emit light, respectively; a plurality of light adjusting layers formed above the light emitting regions to change characteristics of the light emitted from the light emitting regions, respectively; a plurality of electrodes configured to control the light emitting regions to emit the light, respectively; and an isolation insulating layer disposed between the light emitting regions to insulate the light emitting regions from one another, the isolation insulating layer forming a continuous structure with respect to the light emitting regions.Type: GrantFiled: April 17, 2020Date of Patent: January 26, 2021Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Yong Il Kim, Hyong Sik Won, Wan Tae Lim, Nam Goo Cha
-
Publication number: 20200258939Abstract: In some examples, a semiconductor device may comprise a semiconductor chip including a plurality of pixels, each pixel formed of a plurality of sub-pixels, such as a red sub-pixel, green sub-pixel and blue sub-pixel. Each sub-pixel may comprise a light emitting diode. A first signal line may connect to signal terminals of a first group sub-pixels (e.g., arranged in the same row), and a second signal line may connect to common terminals of a second group of sub-pixels (e.g., arranged in the same column). The number of chip pads may thus be reduced to provide increased design flexibility in location and/or allowing an increase in chip pad size. In some examples, a light transmissive material may be formed in openings of a semiconductor growth substrate on which light emitting cells of the sub-pixels were grown. The light transmissive material of some of the sub-pixels may comprise a wavelength conversion material and/or filter.Type: ApplicationFiled: May 1, 2020Publication date: August 13, 2020Inventors: Nam Goo CHA, Yong Il KIM, Young Soo PARK
-
Patent number: 10734559Abstract: A light-emitting diode (LED) package includes a light-emitting structure, an optical wavelength conversion layer on the light-emitting structure, and an optical filter layer on the optical wavelength conversion layer. The light-emitting structure includes a first-conductivity-type semiconductor layer, an active layer on the first-conductivity-type semiconductor layer, and a second-conductivity-type semiconductor layer on the active layer, and emits first light having a first peak wavelength. The optical wavelength conversion layer absorbs the first light emitted from the light-emitting structure and emits second light having a second peak wavelength different from the first peak wavelength. The optical filter layer reflects the first light emitted from the light-emitting structure and transmits the second light emitted from the optical wavelength conversion layer.Type: GrantFiled: March 22, 2019Date of Patent: August 4, 2020Assignee: Samsung Electronics Co., Ltd.Inventors: Ha-nul Yoo, Yong-il Kim, Nam-goo Cha, Wan-tae Lim, Kyung-wook Hwang, Sung-hyun Sim, Hye-seok Noh
-
Publication number: 20200243723Abstract: A light emitting device package may include: a light emitting structure including a plurality of light emitting regions configured to emit light, respectively; a plurality of light adjusting layers formed above the light emitting regions to change characteristics of the light emitted from the light emitting regions, respectively; a plurality of electrodes configured to control the light emitting regions to emit the light, respectively; and an isolation insulating layer disposed between the light emitting regions to insulate the light emitting regions from one another, the isolation insulating layer forming a continuous structure with respect to the light emitting regions.Type: ApplicationFiled: April 17, 2020Publication date: July 30, 2020Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Yong Il KIM, Hyong Sik WON, Wan Tae LIM, Nam Goo CHA
-
Patent number: 10644062Abstract: In some examples, a semiconductor device may comprise a semiconductor chip including a plurality of pixels, each pixel formed of a plurality of sub-pixels, such as a red sub-pixel, green sub-pixel and blue sub-pixel. Each sub-pixel may comprise a light emitting diode. A first signal line may connect to signal terminals of a first group sub-pixels (e.g., arranged in the same row), and a second signal line may connect to common terminals of a second group of sub-pixels (e.g., arranged in the same column). The number of chip pads may thus be reduced to provide increased design flexibility in location and/or allowing an increase in chip pad size. In some examples, a light transmissive material may be formed in openings of a semiconductor growth substrate on which light emitting cells of the sub-pixels were grown. The light transmissive material of some of the sub-pixels may comprise a wavelength conversion material and/or filter.Type: GrantFiled: August 19, 2019Date of Patent: May 5, 2020Inventors: Nam Goo Cha, Yong II Kim, Young Soo Park
-
Patent number: 10636940Abstract: A semiconductor light-emitting device includes a light-emitting structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer, and a magnetic layer on the light-emitting structure. The magnetic layer may have at least one magnetization direction that is parallel to an upper surface of the active layer. The magnetic layer may generate a magnetic field that is parallel to the upper surface of the active layer. The magnetic layer may include multiple structures that may have different magnetization directions. Multiple magnetic layers may be included on the light-emitting structure. A magnetic layer may be on a contact electrode. A magnetic layer may be isolated from a pad electrode.Type: GrantFiled: April 28, 2016Date of Patent: April 28, 2020Assignee: Samsung Electronics Co., Ltd.Inventors: Wan Tae Lim, Yong Il Kim, Nam Goo Cha, Sung Hyun Sim
-
Patent number: 10629782Abstract: A light emitting device package may include: a light emitting structure including a plurality of light emitting regions configured to emit light, respectively; a plurality of light adjusting layers formed above the light emitting regions to change characteristics of the light emitted from the light emitting regions, respectively; a plurality of electrodes configured to control the light emitting regions to emit the light, respectively; and an isolation insulating layer disposed between the light emitting regions to insulate the light emitting regions from one another, the isolation insulating layer forming a continuous structure with respect to the light emitting regions.Type: GrantFiled: January 23, 2019Date of Patent: April 21, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Yong Il Kim, Hyong Sik Won, Wan Tae Lim, Nam Goo Cha
-
Patent number: 10553752Abstract: A light-emitting device includes a substrate including a top surface and a first side surface, wherein an area of the top surface is larger than an area of the first side surface, and a light-emitting structure on the first side surface of the substrate, the light-emitting structure having a first-conductivity-type semiconductor layer, a second-conductivity-type semiconductor layer, and an active layer between the first-conductivity-type semiconductor layer and the second-conductivity-type semiconductor layer, wherein the light-emitting structure emits a first light having a first peak wavelength, and wherein an emission area of a first light emitted through the top surface of the substrate is larger than an emission area of a first light emitted through the first side surface of the substrate.Type: GrantFiled: September 20, 2016Date of Patent: February 4, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Nam-goo Cha, Young-soo Park, Dong-hyun Cho
-
Publication number: 20190389720Abstract: A method for assembling colloidal particles onto a substrate surface through fluid transport. The method comprises placing a first fluid placed adjacent to the substrate surface, applying a colloidal dispersion on top of the first fluid layer and removal of the first fluid layer. The method is extremely versatile, and is especially useful in depositing colloidal materials in high aspect ratio channels and vias without the need for prior treatment of the surface.Type: ApplicationFiled: June 25, 2019Publication date: December 26, 2019Inventors: Nam-Goo CHA, Yolanda EHEGOYEN, Ahmed BUSNAINA, Taehoon KIM
-
Publication number: 20190371856Abstract: In some examples, a semiconductor device may comprise a semiconductor chip including a plurality of pixels, each pixel formed of a plurality of sub-pixels, such as a red sub-pixel, green sub-pixel and blue sub-pixel. Each sub-pixel may comprise a light emitting diode. A first signal line may connect to signal terminals of a first group sub-pixels (e.g., arranged in the same row), and a second signal line may connect to common terminals of a second group of sub-pixels (e.g., arranged in the same column). The number of chip pads may thus be reduced to provide increased design flexibility in location and/or allowing an increase in chip pad size. In some examples, a light transmissive material may be formed in openings of a semiconductor growth substrate on which light emitting cells of the sub-pixels were grown. The light transmissive material of some of the sub-pixels may comprise a wavelength conversion material and/or filter.Type: ApplicationFiled: August 19, 2019Publication date: December 5, 2019Inventors: Nam Goo CHA, Yong Il KIM, Young Soo PARK
-
Patent number: 10475957Abstract: An LED light source module includes a light emitting stacked body, and a first through electrode structure and a second through electrode structure passing through a portion of the light emitting stacked body. The light emitting stacked body includes a base insulating layer, light emitting layers sequentially stacked on the base insulating layer, each of the light emitting layers including a first conductivity-type semiconductor layer, a second conductivity-type semiconductor layer, and an active layer disposed between the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer, and an interlayer insulating layer disposed between the light emitting layers. The first through electrode structure is connected to the first conductivity-type semiconductor layer of each of the light emitting layers, and the second through electrode structure is connected to any one or any combination of the second conductivity-type semiconductor layer of each of the light emitting layers.Type: GrantFiled: November 14, 2018Date of Patent: November 12, 2019Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Nam Goo Cha, Yong Il Kim, Young Soo Park, Sung Hyun Sim, Hanul Yoo
-
Patent number: 10388693Abstract: In some examples, a semiconductor device may comprise a semiconductor chip including a plurality of pixels, each pixel formed of a plurality of sub-pixels, such as a red sub-pixel, green sub-pixel and blue sub-pixel. Each sub-pixel may comprise a light emitting diode. A first signal line may connect to signal terminals of a first group sub-pixels (e.g., arranged in the same row), and a second signal line may connect to common terminals of a second group of sub-pixels (e.g., arranged in the same column). The number of chip pads may thus be reduced to provide increased design flexibility in location and/or allowing an increase in chip pad size. In some examples, a light transmissive material may be formed in openings of a semiconductor growth substrate on which light emitting cells of the sub-pixels were grown. The light transmissive material of some of the sub-pixels may comprise a wavelength conversion material and/or filter.Type: GrantFiled: May 21, 2018Date of Patent: August 20, 2019Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Nam Goo Cha, Yong Il Kim, Young Soo Park
-
Publication number: 20190221730Abstract: A light-emitting diode (LED) package includes a light-emitting structure, an optical wavelength conversion layer on the light-emitting structure, and an optical filter layer on the optical wavelength conversion layer. The light-emitting structure includes a first-conductivity-type semiconductor layer, an active layer on the first-conductivity-type semiconductor layer, and a second-conductivity-type semiconductor layer on the active layer, and emits first light having a first peak wavelength. The optical wavelength conversion layer absorbs the first light emitted from the light-emitting structure and emits second light having a second peak wavelength different from the first peak wavelength. The optical filter layer reflects the first light emitted from the light-emitting structure and transmits the second light emitted from the optical wavelength conversion layer.Type: ApplicationFiled: March 22, 2019Publication date: July 18, 2019Applicant: Samsung Electronics Co., Ltd.Inventors: Ha-nul Yoo, Yong-il Kim, Nam-goo Cha, Wan-tae Lim, Kyung-wook Hwang, Sung-hyun Sim, Hye-seok Noh
-
Patent number: 10333035Abstract: A method of manufacturing a light emitting device package is provided. The method includes preparing a film strip including one or more light blocking regions and one or more wavelength conversion regions, preparing light emitting devices, each including one or more light emitting regions, bonding the film strip to the light emitting devices so as to dispose the one or more wavelength conversion regions on the one or more light emitting regions of each of the light emitting devices, and cutting the film strip and the light emitting devices into individual device units.Type: GrantFiled: October 28, 2016Date of Patent: June 25, 2019Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Nam Goo Cha, Sung Hyun Sim, Wan tae Lim, Hye Seok Noh, Hanul Yoo
-
Patent number: 10329139Abstract: A method for assembling colloidal particles onto a substrate surface through fluid transport. The method comprises placing a first fluid placed adjacent to the substrate surface, applying a colloidal dispersion on top of the first fluid layer and removal of the first fluid layer. The method is extremely versatile, and is especially useful in depositing colloidal materials in high aspect ratio channels and vias without the need for prior treatment of the surface.Type: GrantFiled: June 7, 2011Date of Patent: June 25, 2019Assignee: Northeastern UniversityInventors: Nam-Goo Cha, Yolanda Echegoyen, Ahmed Busnaina, Taehoon Kim
-
Publication number: 20190157515Abstract: A light emitting device package may include: a light emitting structure including a plurality of light emitting regions configured to emit light, respectively; a plurality of light adjusting layers formed above the light emitting regions to change characteristics of the light emitted from the light emitting regions, respectively; a plurality of electrodes configured to control the light emitting regions to emit the light, respectively; and an isolation insulating layer disposed between the light emitting regions to insulate the light emitting regions from one another, the isolation insulating layer forming a continuous structure with respect to the light emitting regions.Type: ApplicationFiled: January 23, 2019Publication date: May 23, 2019Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Yong Il KIM, Hyong Sik WON, Wan Tae LIM, Nam Goo CHA
-
Publication number: 20190103510Abstract: An LED light source module includes a light emitting stacked body, and a first through electrode structure and a second through electrode structure passing through a portion of the light emitting stacked body. The light emitting stacked body includes a base insulating layer, light emitting layers sequentially stacked on the base insulating layer, each of the light emitting layers including a first conductivity-type semiconductor layer, a second conductivity-type semiconductor layer, and an active layer disposed between the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer, and an interlayer insulating layer disposed between the light emitting layers. The first through electrode structure is connected to the first conductivity-type semiconductor layer of each of the light emitting layers, and the second through electrode structure is connected to any one or any combination of the second conductivity-type semiconductor layer of each of the light emitting layers.Type: ApplicationFiled: November 14, 2018Publication date: April 4, 2019Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Nam Goo CHA, Yong Il KIM, Young Soo PARK, Sung Hyun SIM, Hanul YOO