Patents by Inventor Nan Guo

Nan Guo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10666847
    Abstract: A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.
    Type: Grant
    Filed: October 10, 2018
    Date of Patent: May 26, 2020
    Assignee: Ningbo Sunny Optotech Co., Ltd.
    Inventors: Mingzhu Wang, Zhenyu Chen, Nan Guo, Takehiko Tanaka, Bojie Zhao, Zilong Deng
  • Publication number: 20200156295
    Abstract: Provided are a camera module, a molding photosensitive assembly and manufacturing method thereof, and an electronic device. The molding photosensitive assembly comprises a molding portion, at least one photosensitive chip and at least one circuit board, wherein the photosensitive chip is provided on the circuit board, the molding portion comprises a molding portion main body, the molding portion main body is made of a transparent material, and the molding portion main body, the photosensitive chip and the circuit board form an integral structure by means of a molding technique, so as to facilitate production.
    Type: Application
    Filed: April 12, 2018
    Publication date: May 21, 2020
    Applicant: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Mingzhu WANG, Takehiko TANAKA, Nan GUO, Zhenyu CHEN, Bojie ZHAO
  • Publication number: 20200162648
    Abstract: A camera module and an electronic device having the same, and a method for manufacturing the camera module, wherein the fixed-focus camera module comprises a circuit board; a photosensitive element, which is conductively connected to the circuit board; a molded base, wherein the molded base is integrally molded on the circuit board and the photosensitive element, and the molded base forms a light window, so as to provide a light passage for the photosensitive chip through the light window; and an optical lens, wherein the optical lens is supported on the molded base and corresponds to the light window formed by the molded base, wherein the circuit board comprises a circuit board substrate and at least one electronic component, wherein the at least one electronic component is electrically connected to the circuit board substrate, wherein the circuit board substrate has a blank side, and wherein the blank side of the circuit board substrate is free of the at least one electronic component.
    Type: Application
    Filed: August 3, 2018
    Publication date: May 21, 2020
    Applicant: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Mingzhu WANG, Bojie ZHAO, Zhewen MEI, Nan GUO, Lifeng YAO, Zhenyu CHEN
  • Publication number: 20200158980
    Abstract: Disclosed are a split lens assembly and a camera module. The split lens assembly comprises a first lens module and a second lens module. The first lens module is assembled to the second lens module. The first lens module and the second lens module are calibrated and assembled. A spacing that facilitates calibration is located between the first lens module and the second lens module.
    Type: Application
    Filed: March 23, 2018
    Publication date: May 21, 2020
    Applicant: Ningbo Sunny Opotech Co., Ltd.
    Inventors: Mingzhu Wang, Chunmei LIU, Shoujie WANG, Nan GUO, Lifeng YAO, Liang DING
  • Patent number: 10659664
    Abstract: A camera module and its molded circuit board assembly and manufacturing method are disclosed, wherein the molded circuit board assembly includes a circuit board and a molded base integrally formed with the circuit board through a molding process. The molded base forms a light window disposed corresponding to a photosensitive element of the camera module, wherein the light window is configured to have a trapezoidal or multi-stair trapezoidal shape cross section which has diameters increasing from bottom to top to facilitate demoulding, so as to prevent damage to the molded base, and to avoid stray light.
    Type: Grant
    Filed: December 21, 2016
    Date of Patent: May 19, 2020
    Assignee: Ningbo Sunny Opotech Co., Ltd.
    Inventors: Mingzhu Wang, Zhenyu Chen, Nan Guo, Takehiko Tanaka, Bojie Zhao, Zilong Deng
  • Patent number: 10630876
    Abstract: An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optical windows. The molded base is integrally coupled at the circuit board at a peripheral portion thereof, wherein the photosensitive units are aligned with the optical windows respectively. The optical lenses are located along two photosensitive paths of the photosensitive units respectively, such that each of the optical windows forms a light channel through the corresponding photosensitive unit and the corresponding optical lens.
    Type: Grant
    Filed: March 15, 2017
    Date of Patent: April 21, 2020
    Assignee: Ningbo Sunny Opotech Co., Ltd.
    Inventors: Mingzhu Wang, Bojie Zhao, Zhenyu Chen, Takehiko Tanaka, Nan Guo, Zhen Huang, Duanliang Cheng, Liang Ding, Feifan Chen, Heng Jiang
  • Publication number: 20200120249
    Abstract: A camera module and an array camera module based on an integral packing process are disclosed. The camera module or each of the camera module units of the array camera module includes a circuit board, an integral base, a photosensitive element operatively connected to the circuit board, a lens, a light filter holder installed at the integral base and a light filter installed at the light filter holder. The light filter is not required to be directly installed to the integral base, so that the light filter is protected and the requiring area of the light filter is reduced.
    Type: Application
    Filed: September 18, 2019
    Publication date: April 16, 2020
    Inventors: Mingzhu WANG, Bojie ZHAO, Zhenyu CHEN, Nan GUO, Takehiko TANAKA
  • Publication number: 20200120244
    Abstract: The present invention provides a circuit board, a molded photosensitive assembly and manufacturing method therefor, a photographing module, and an electronic device. The circuit board comprises a substrate and at least one circuit portion formed on the substrate. A photosensitive element and the circuit portion are conductively connected. The circuit portion forms a ring circuit in an edge region of the substrate. The ring circuit surrounds the photosensitive element, so that in a molding process, the photosensitive element can be protected by the ring circuit.
    Type: Application
    Filed: January 11, 2018
    Publication date: April 16, 2020
    Applicant: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Mingzhu WANG, Zhenyu CHEN, Ningbo CHENG, Takehiko TANAKA, Bojie ZHAO, Nan GUO, Yafei WANG
  • Patent number: 10618976
    Abstract: Compositions and methods are provided relating to anti-SIRP? agonist antibodies. The antibodies of the invention bind to human SIRP?, and activate signaling, thereby inhibiting processes mediated by SIRP?, including without limitation phagocytosis. Embodiments of the invention include isolated antibodies and derivatives and fragments thereof, pharmaceutical formulations comprising one or more of the anti-SIRP? agonist antibodies; and cell lines that produce these antibodies.
    Type: Grant
    Filed: June 8, 2016
    Date of Patent: April 14, 2020
    Assignee: The Board of Trustees of the Leland Stanford Junior University
    Inventors: Irving L. Weissman, Benson George, Nan Guo Ring, Aaron Michael Ring, Jens-Peter Volkmer
  • Publication number: 20200077002
    Abstract: A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.
    Type: Application
    Filed: September 12, 2019
    Publication date: March 5, 2020
    Inventors: Mingzhu WANG, Zhenyu CHEN, Nan GUO, Takehiko Tanaka, Bojie ZHAO, Zilong DENG
  • Patent number: 10578837
    Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units coupled at the chip coupling area of the circuit board, at least two lead wires electrically connected the photosensitive units at the chip coupling area of the circuit board, and a mold sealer which includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.
    Type: Grant
    Filed: October 15, 2017
    Date of Patent: March 3, 2020
    Assignee: Ningbo Sunny Opotech Co., Ltd.
    Inventors: Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Nan Guo, Zhenyu Chen, Heng Jiang, Zhongyu Luan, Fengsheng Xi, Feifan Chen, Liang Ding
  • Patent number: 10582097
    Abstract: A camera module and its photosensitive assembly and manufacturing method thereof are provided. The photosensitive assembly includes a photosensitive element, a window circuit board and a packaging body integrally packaged the photosensitive element and the window circuit board to form an integrated body, wherein the window circuit board has at least one window for receiving the photosensitive element therein.
    Type: Grant
    Filed: April 23, 2019
    Date of Patent: March 3, 2020
    Assignee: Ningbo Sunny Opotech Co., Ltd.
    Inventors: Mingzhu Wang, Zhenyu Chen, Takehiko Tanaka, Zhongyu Luan, Bojie Zhao, Zhen Huang, Nan Guo, Fengsheng Xi, Heng Jiang, Zilong Deng
  • Publication number: 20200021720
    Abstract: An array camera module having a height difference, a circuit board assembly and a manufacturing method therefor, and an electronic device. The array camera module comprises a first camera module unit and a second camera module unit, wherein the first camera module unit comprises at least one first photosensitive assembly and at least one first lens; the first lens is located on a photosensitive path of the first photosensitive assembly; the first photosensitive assembly comprises at least one extension portion; the extension portion at least partially extends towards the direction away from the first photosensitive assembly; and the second camera module unit is fixedly connected to a second extension portion, so that the ends of the two camera module units are consistent.
    Type: Application
    Filed: December 20, 2017
    Publication date: January 16, 2020
    Applicant: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Mingzhu WANG, Takehiko TANAKA, Zhenyu CHEN, Nan GUO, Bojie ZHAO, Zhewen MEI
  • Publication number: 20200013823
    Abstract: The present invention provides a semiconductor packaging method and semiconductor device based on a molding process. In the packaging method, first, at least a portion of a compensation part is kept on at least a portion of a bonding region formed between a first adjoining surface of a semiconductor element and a second adjoining surface of a packaging component, to form a semi-finished product of a semiconductor device; then, during hardening of the packaging component, the compensation part is caused to undergo different degrees of deformation at different positions to compensate for a difference between a magnitude of deformation of the packaging component and a magnitude of deformation of the semiconductor element, so as to package the semiconductor element to form the semiconductor device. By means of the method, undesirable phenomena such as cracking and deformation of the surface of the semiconductor element can be avoided.
    Type: Application
    Filed: September 20, 2019
    Publication date: January 9, 2020
    Inventors: Mingzhu WANG, Bojie ZHAO, Takehiko TANAKA, Zhenyu CHEN, Heng JIANG, Nan GUO
  • Publication number: 20190387147
    Abstract: A camera module includes a circuit board, an optical lens, an insulating member, a photosensitive sensor, and an integral encapsulating support structure. The insulating member is disposed on the periphery of a photosensitive area of the photosensitive sensor to prevent the photosensitive sensor from contacting to and being damaged by the formation mold during the forming process of the integral encapsulating support structure and to prevent the fluid material from flowing to the photosensitive area of the photosensitive sensor.
    Type: Application
    Filed: August 27, 2019
    Publication date: December 19, 2019
    Inventors: Mingzhu WANG, Bojie ZHAO, Takehiko TANAKA, Zhen HUANG, Nan GUO
  • Patent number: 10498942
    Abstract: A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demolding and avoiding stray lights.
    Type: Grant
    Filed: March 16, 2017
    Date of Patent: December 3, 2019
    Assignee: Ningbo Sunny Opotech Co., Ltd.
    Inventors: Mingzhu Wang, Zhenyu Chen, Nan Guo, Takehiko Tanaka, Bojie Zhao, Zilong Deng
  • Publication number: 20190361191
    Abstract: A camera lens module includes an image sensor and a lens assembly. The image sensor includes a photosensitive chip defining a photosensitive path, wherein the lens assembly is coupled to the image sensor along the photosensitive path of the photosensitive chip. The lens assembly includes at least one optical lens module and an aperture member coupled at the optical lens module, wherein the optical lens module includes a lens barrel and at least an optical lens supported within the lens barrel. A relative position of the lens assembly with respect to the image sensor is adjustable for calibration and the relative position of the optical lens module is permanently fixed after calibration.
    Type: Application
    Filed: May 31, 2019
    Publication date: November 28, 2019
    Inventors: Mingzhu WANG, Heng JIANG, Feifan CHEN, Chunmei LIU, Bojie ZHAO, Nan GUO, Liang DING
  • Publication number: 20190364184
    Abstract: The present disclosure provides a camera module, a circuit board assembly and a manufacturing method thereof, and an electronic device with the camera module, wherein the circuit board assembly comprises at least one electronic component, a substrate, and a molding unit. At least one of the electronic components is connected to the substrate conductively on a back face of the substrate. The molding unit comprises a back molding portion and a molding base, wherein the molding base is bonded to a front face of the substrate integrally when the back molding portion is bonded to at least a part of an area of the back face of the substrate integrally. There may be no need to reserve a position on the front face of the substrate to conductively connect the electronic components, so that the length and width of the camera module can be reduced, thereby reducing the volume of the camera module.
    Type: Application
    Filed: December 25, 2017
    Publication date: November 28, 2019
    Applicant: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Mingzhu WANG, Nan GUO, Zhenyu CHEN, Bojie ZHAO, Takehiko TANAKA, Feifan CHEN, Ye WU
  • Publication number: 20190364183
    Abstract: A camera module includes a lens, a photosensitive chip and an electrical holder. The electrical holder has an integrated circuit that the electrical holder serves as an integration of a base and a PCB in a conventional camera module, wherein the electrical holder not only forms an assembling unit for connecting a motor and an optical lens but also forms an electrical connection unit for electrically connecting to the motor, a photosensitive chip and a flexible circuit board with each other, so as to minimize an overall size of the camera module.
    Type: Application
    Filed: May 31, 2019
    Publication date: November 28, 2019
    Inventors: Mingzhu WANG, Nan GUO, Feifan CHEN, Bojie ZHAO, Bo PENG, Zhen HUANG
  • Patent number: 10477088
    Abstract: A camera module and an array camera module based on an integral packing process are disclosed. The camera module or each of the camera module units of the array camera module includes a circuit board, an integral base, a photosensitive element operatively connected to the circuit board, a lens, a light filter holder installed at the integral base and a light filter installed at the light filter holder. The light filter is not required to be directly installed to the integral base, so that the light filter is protected and the requiring area of the light filter is reduced.
    Type: Grant
    Filed: November 18, 2016
    Date of Patent: November 12, 2019
    Assignee: Ningbo Sunny Opotech Co., Ltd.
    Inventors: Mingzhu Wang, Bojie Zhao, Zhenyu Chen, Nan Guo, Takehiko Tanaka